摘要:
A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要:
The present invention provides a method of preparing a polymer, which comprises subjecting a monomer containing at least a polar unsaturated compound to anionic polymerization in the presence of a phosphazenium compound represented by the formula (1): (wherein Z− is an anion of an active hydrogen compound in the form where a proton is eliminated from the active hydrogen compound and transferred to the anion; a, b, c and d each represents 1 or 0, but all of them are not simultaneously 0; and R may the same or different and each represents a hydrocarbon group having 1 to 10 carbon atoms, and two R(s) on the same nitrogen atom are optionally combined each other to form a cyclic structure), or in the presence of the phosphazenium compound and the active hydrogen compound. The resulting polymer is characterized by narrow molecular weight distribution.
摘要:
A process for preparing phosphine oxides by reacting iminophosphoranes with phosphorus oxytrichloride by which highly purified phosphine oxides can be obtained industrially in a higher yield. Specifically, phosphine oxides are prepared in such a manner that iminophosphoranes are reacted with phosphorus oxytrichloride using an aprotic organic solvent with permittivity 2.2 or more at 20° C. as a solvent under special reaction conditions to give a liquid reaction product containing phosphine oxides and aminophosphonium chlorides which are yielded as a by-product at the same time as the phosphine oxides, and the above described chlorides are removed from the above described liquid reaction product by a solid-liquid separation process, and the solution having been subjected to the solid-liquid separation process is washed with water.
摘要:
A process for preparing phosphine oxides by reacting iminophosphoranes with phosphorus oxytrichloride by which highly purified phosphine oxides can be obtained industrially in a higher yield. Specifically, phosphine oxides are prepared in such a manner that iminophosphoranes are reacted with phosphorus oxytrichloride using an aprotic organic solvent with permittivity 2.2 or more at 20° C. as a solvent under special reaction conditions to give a liquid reaction product containing phosphine oxides and aminophosphonium chlorides which are yielded as a by-product at the same time as the phosphine oxides, and the above described chlorides are removed from the above described liquid reaction product by a solid-liquid separation process, and the solution having been subjected to the solid-liquid separation process is washed with water.
摘要:
A process is provided for preparing iminotris(dimethylamino)phosphorane at high purity and high yield from aminotris(dimethylamino)phosphonium chloride. Aminotris(dimethylamino)phosphonium chloride is first reacted with an aqueous solution of the hydroxide of an alkali metal or alkaline earth metal in the presence of a solvent in which the chloride and hydroxide of the alkali metal or alkaline earth metal are sparingly soluble, whereby iminotris(dimethylamino)phosphorane is formed. After water is dissolved off at a temperature of 70.degree. C. or lower from the reaction mixture, solids are removed from the thus-concentrated reaction mixture by solid-liquid separation. The resultant mother liquor is then distilled to obtain iminotris(dimethylamino)phosphorane.
摘要:
A photosensitive resin composition which is effective in avoiding troubles in the step of plating with various metals in printed wiring board production, such as under-film metal deposition and film peeling, and which forms a wiring-protecting film excellent in adhesion, flexibility, insulation reliability, and heat resistance. The photosensitive resin composition comprises (A) a carboxylated polymer, (B) a compound having at least two photopolymerizable unsaturated double bonds, (C) a photopolymerization initiator, and (D) a nitrogen compound represented by a specific feature.
摘要:
A printer prints on two sides of a sheet of paper having continuous pages, and discharges the paper to a postprocessor for disconnecting the paper in page units and storing the disconnected sheets of paper in a stack. Depending on whether the postprocessor has an inversion mechanism that inverts front and back sides of the paper, sides of the paper on which data for the front side of the paper and data for the back side of the paper are printed are switched. With this arrangement, even when the postprocessor does not have the inversion mechanism, the front side data is printed on the back side, and the back side data is printed on the front side thereby enabling the postprocessor to stack the disconnected sheets of paper in page units in the order of page numbers.
摘要:
A composition for forming a film for protecting wiring which in one aspect includes a polyimide precursor, a compound having at least two photopolymerizable groups, and a photopolymerization initiator, wherein the polyimide precursor includes a polyimide precursor obtained from a diamine component comprising a defined diamine compound. In other aspects, a dry film for forming a wiring-protecting film using the composition and a substrate having wiring protected by means of the dry film are provided.
摘要:
There is provided a process for preparing a poly(alkylene oxide) by using a polymerization initiator which does not cause any problem on preparing and handling in the preparation of the polyalkylene oxide by polymerizing an alkylene oxide compound and does not require a special treatment before the initiation of the polymerization. That is, it is a process of polymerizing the alkylene oxide compound in the presence of a phosphine oxide compound represented by the formula (1): wherein R is the same or different and each represents a hydrocarbon group having 1 to 10 carbon atoms, and x represents an amount of water molecules contained in terms of a molar ratio and is within a range from 0 to 5.0, or in the presence of said phosphine oxide compound and an active hydrogen compound selected from water or an organic compound having a partial structural formula —OH or —NH—.
摘要:
Disclosed is a photosensitive resin composition which does not contain any halogenated compound or any antimony compound that has a high risk of putting a load on the environment, which exerts good flame retardancy after being cured, and which particularly meets the recent exacting requirements with respect to bending resistance and insulation reliability. Specifically disclosed is a photosensitive resin composition comprising: (A) a (meth)acrylate compound represented by the general formula (1); (B) a polyimide precursor; and (C) a photopolymerization initiator [in the formula, R1 represents a hydrogen atom or a methyl group; R2 represents a hydrogen atom or a univalent organic group; n and m independently represent an integer of 1 to 5; p represents an integer of 0 to 6; q and r independently represent an integer of 0 to 4; and s represent an integer of 0 to 6, provided that the sum of p, q, r and s is 6, and the sum total of p and s may range from 3 to 6 and is preferably 6].