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    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    1.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME 有权
    印刷线路板及其制造方法

    公开(公告)号：US20090078451A1

    公开(公告)日：2009-03-26

    申请号：US12188795

    申请日：2008-08-08

    申请人： Ayao Niki ,  Kazuhisa Kitajima

    发明人： Ayao Niki ,  Kazuhisa Kitajima

    IPC分类号： H05K1/00 ,  H05K3/00

    CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

    摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

    摘要翻译： 印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电 导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。 交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    3.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME 审中-公开
    印刷线路板及其制造方法

    公开(公告)号：US20120181072A1

    公开(公告)日：2012-07-19

    申请号：US13434960

    申请日：2012-03-30

    申请人： Ayao NIKI ,  Kazuhisa Kitajima

    发明人： Ayao NIKI ,  Kazuhisa Kitajima

    IPC分类号： H05K1/09 ,  H05K3/42 ,  H05K3/28

    CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

    摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

    摘要翻译： 印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电 导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。 交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

    Roll coater for coating and method of manufacturing printed wiring board employing the roll coater
    5.
    发明授权
    Roll coater for coating and method of manufacturing printed wiring board employing the roll coater 有权
    辊涂机和涂布机制造印刷线路板的方法

    公开(公告)号：US06645297B1

    公开(公告)日：2003-11-11

    申请号：US09868138

    申请日：2001-08-21

    申请人： Ayumi Suzuki ,  Ayao Niki ,  Ryo Aoki ,  Kazuhisa Kitajima ,  Susumu Kagohashi ,  Yukari Kajiyama ,  Hiroshi Tanaka

    发明人： Ayumi Suzuki ,  Ayao Niki ,  Ryo Aoki ,  Kazuhisa Kitajima ,  Susumu Kagohashi ,  Yukari Kajiyama ,  Hiroshi Tanaka

    IPC分类号： B05C1102

    CPC分类号： H05K3/0091 ,  B05C1/0808 ,  H05K3/28 ,  H05K3/4602 ,  H05K3/4661 ,  H05K2203/0143 ,  H05K2203/1509

    摘要： A roll coater with which an interlaminar resin insulating layer and/or a solder resist layer can be formed with good thickness uniformity to enable the manufacture of a printed circuit board free from the no-hole defect and anomalies in the diameter and geometry of the holes for via-hole and/or solder bump which is due to uneven layer thickness, thus having high electrical integrity and reliability. This roll coater 20 is used for forming an interlaminar resin insulating layer and/or a solder resist layer in the manufacture of a printed circuit board including a substrate and, as serially built up thereon, a conductor circuit and an interlaminar insulating layer in an alternate fashion and in repetition, with a solder resist layer formed on top of the resulting multilayer structure, which comprises rolls 21 each having a surface formed with a multiplicity of grooves running in the direction of roll rotation, with the grooves 22a, 22b in the roll-end or marginal areas 21a of the surface being relatively reduced in depth as compared with the remaining area.

    摘要翻译： 可以形成具有良好厚度均匀性的层间树脂绝缘层和/或阻焊层的辊涂机，以使得能够制造没有孔缺陷的印刷电路板和孔的直径和几何形状的异常 用于通孔和/或焊料凸块，这是由于不均匀的层厚度，因此具有高的电气完整性和可靠性。 在制造包括基板的印刷电路板时，该辊涂机20用于形成层间树脂绝缘层和/或阻焊层，并且在其上串联构建导体电路和交替的层间绝缘层 时间和重复，在形成的多层结构的顶部上形成阻焊层，其包括辊21，辊21具有形成有沿辊旋转方向延伸的多个槽的表面，辊中的槽22a，22b 与剩余面积相比，表面的边缘区域21a的深度相对减小。

    Printed wiring board and method for manufacturing same
    7.
    发明授权
    Printed wiring board and method for manufacturing same 有权
    印刷电路板及其制造方法

    公开(公告)号：US08238114B2

    公开(公告)日：2012-08-07

    申请号：US12188795

    申请日：2008-08-08

    申请人： Ayao Niki ,  Kazuhisa Kitajima

    发明人： Ayao Niki ,  Kazuhisa Kitajima

    IPC分类号： H05K7/10

    CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

    摘要： A printed wiring board includes multiple conductive layers having conductive circuits, multiple resin insulation layers having openings and including the uppermost resin insulation layer positioned as the outermost layer of the resin insulation layers, multiple via conductors formed in the openings, respectively, and connecting the conductive circuits in the conductive layers, and multiple component-loading pads formed of a copper foil and positioned to load an electronic component. The resin insulation layers and the conductive layers are alternately laminated, and the component-loading pads are formed on the uppermost resin insulation layer.

    摘要翻译： 印刷布线板包括具有导电电路的多个导电层，具有开口的多个树脂绝缘层，并且包括位于树脂绝缘层的最外层的最上层的树脂绝缘层，分别形成在开口中的多个通孔导体，并将导电 导电层中的电路，以及由铜箔形成并定位成装载电子元件的多个元件负载焊盘。 交替层叠树脂绝缘层和导电层，并且在最上层的树脂绝缘层上形成元件负荷垫。

    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME
    8.
    发明申请
    PRINTED WIRING BOARD AND METHOD FOR MANUFACTURING SAME 审中-公开
    印刷线路板及其制造方法

    公开(公告)号：US20110302779A1

    公开(公告)日：2011-12-15

    申请号：US13216305

    申请日：2011-08-24

    申请人： Ayao NIKI ,  Kazuhisa Kitajima

    发明人： Ayao NIKI ,  Kazuhisa Kitajima

    IPC分类号： H01K3/10

    CPC分类号： H05K3/4682 ,  H05K1/113 ,  H05K3/0058 ,  H05K3/025 ,  H05K3/06 ,  H05K3/108 ,  H05K2201/096 ,  H05K2203/0152 ,  H05K2203/0156 ,  H05K2203/0228 ,  H05K2203/1536 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/49155 ,  Y10T29/49165 ,  Y10T29/49167

    摘要： A method for manufacturing a printed wiring board including providing a support member having a metal surface, securing a metal foil to the metal surface such that the metal foil is joined or bonded to a peripheral portion of the metal surface, forming a resin insulation layer on the metal foil secured on the metal surface, forming an opening for a via conductor in the resin insulation layer, forming a conductive circuit on the resin insulation layer, forming in the opening a via conductor electrically connecting the conductive circuit and the metal foil such that a laminated sheet body is formed, and cutting a portion of the laminated sheet body inside the peripheral portion of the metal surface of the support member such that the metal foil releases the portion of the laminated sheet body from the support member.

    摘要翻译： 一种制造印刷线路板的方法，包括：提供具有金属表面的支撑构件，将金属箔固定到金属表面，使得金属箔接合或结合到金属表面的周边部分，形成树脂绝缘层 金属箔固定在金属表面上，在树脂绝缘层中形成通孔导体的开口，在树脂绝缘层上形成导电电路，在开口中形成电连接导电电路和金属箔的通孔导体，使得 形成层压片体，并且在支撑构件的金属表面的周边部分内切割层压片体的一部分，使得金属箔从支撑构件释放层压片体的部分。