公开(公告)号：US06294922B1

公开(公告)日：2001-09-25

申请号：US08773252

申请日：1996-12-23

申请人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

发明人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

IPC分类号： G01R3102

CPC分类号： G01R3/00 ,  G01R1/07357

摘要： A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe. Next configuration features in including: two kinds of probes; measurement probes and connection probes anew, and a plurality of connection probes include buckling portions to buckle, upon a contact by an end of contact portion onto the wiring pattern provided with the first board when inserted into holes provided with the a second board; wherein through holes provided with the second board are positioned to align to the arrangement of wiring pattern provided with the first board. Thereby, undesirable deviation of contact point by the probe is avoided and a suitable contact pressure is preferably kept, and further convenience in the work of exchanging damaged probes is brought about.

摘要翻译： 第一组装构造的特征在于包括：多个探针，其在接触部分的端部接触到半导体集成电路的电极上时具有弯曲部分以弯曲; 第一板，其设置有与所述探针的连接部分连接的第一布线图案; 第二板，其与所述第一板可移除地紧固并设置有与所述第一布线图形连接的第二布线图案; 安装有第二板的壳体构件用于保持探针的接触部分。 下一个配置功能包括：两种探头; 重新测量探针和连接探针，并且当插入设置有第二板的孔中时，接触部分的端部与设置有第一板的布线图案接触时，多个连接探针包括弯曲部分以弯曲; 其中设置有第二板的通孔被定位成与设置有第一板的布线图案的布置对准。 因此，避免了由探针引起的接触点的不期望的偏差，并且优选地保持适当的接触压力，并且进一步方便了更换损坏的探针的工作。

公开(公告)号：US5055778A

公开(公告)日：1991-10-08

申请号：US548401

申请日：1990-07-05

申请人： Kazumasa Okubo ,  Masao Okubo ,  Yasuro Yoshimitsu ,  Kiyoshi Sugaya

发明人： Kazumasa Okubo ,  Masao Okubo ,  Yasuro Yoshimitsu ,  Kiyoshi Sugaya

IPC分类号： G01R1/067 ,  G01R1/073

CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/06711

摘要： Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable. The disclosure refers to additional devices to enhance the convenience in determining the alignment between the probe front ends and the IC ends, and also in obtaining accurate measurements of an IC chip under test.

摘要翻译： 探头卡是测试成品IC芯片的一部分。 该卡通常安装有多个探针，非常细的针，大致为L字形，每个探针的前端可以朝向IC芯片向下突出。 传统探头难以将所有的探针前端与IC芯片上的电端对齐。 在探针前端和IC端部之间的所有触点形成之后，通常会使用过度驱动来产生足够的接触压力，但这种作用往往会导致传统的探针端部从IC端部滑落。 所提出的探针卡包括具有弹性绝缘特性的树脂层的新设置，以填充组装到探针卡中的支撑件的中心开口区域。 通过这种树脂层的填充使得探头前端弹性地保持在适当的位置，使得通过过驱动偏离适当的各自配置变得可避免。 本公开涉及增加确定探针前端和IC端之间的对准的便利性的附加装置，并且还用于获得正在测试的IC芯片的精确测量。

公开(公告)号：US06853208B2

公开(公告)日：2005-02-08

申请号：US09851946

申请日：2001-05-10

申请人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

发明人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

IPC分类号： G01R31/26 ,  G01R1/073 ,  G01R3/00 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/07357 ,  G01R3/00

摘要： Purpose: To present a vertical probe card capable of reusing without replacing a broken probe if a probe is broken. Constitution: A vertical probe card having vertical probes 100, being used in measurement of electric characteristics of an LSI chip 610 to be measured, comprising a main substrate 300 forming conductive patterns 310, a plurality of probes 100 drooping vertically from the main substrate 300, and a probe support 200 provided at the back side of the main substrate 300 for supporting the probes 100, in which the probe support 200 is disposed parallel to the main substrate 300, and has an upper guide plate 210 and a lower guide plate 220 for supporting the probes 100 by passing the through-holes 211,221 opened in each, and the lower guide plate 220 is composed of three substrates 220A, 220B, 220C laminated separably.

摘要翻译： 目的：提供一个能够重复使用的垂直探针卡，而不会在探头损坏时更换损坏的探头。 结构：具有垂直探针100的垂直探针卡，用于测量要测量的LSI芯片610的电特性，包括形成导电图案310的主基板300，从主基板300垂直下垂的多个探针100， 以及设置在主基板300的背侧的探针支撑件200，用于支撑探针支撑件200平行于主基板300设置的探针100，并且具有上引导板210和下引导板220， 通过使每个开放的通孔211,221通过来支撑探针100，下引导板220由可分离地层叠的三个基板220A，220B，220C组成。

公开(公告)号：US06300783B1

公开(公告)日：2001-10-09

申请号：US09148147

申请日：1998-09-04

申请人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

发明人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

IPC分类号： G01R3102

CPC分类号： G01R3/00 ,  G01R1/07357

摘要： A first assembly configuration features in including: a plurality of probes having a buckling portion to buckle, upon a contact by an end of a contact portion onto an electrode of semiconductor integrated circuit; a first board provided with a first wiring pattern connected with a connecting portion of the probe; a second board removably fastened with the first board and provided with a second wiring pattern connected with the first wiring pattern; housing members mounted with the second board for holding the contact portion of the probe. Next configuration features in including: two kinds of probes; measurement probes and connection probes anew, and a plurality of connection probes include buckling portions to buckle, upon a contact by an end of contact portion onto the wiring pattern provided with the first board when inserted into holes provided with the a second board; wherein through holes provided with the second board are positioned to align to the arrangement of wiring pattern provided with the first board. Thereby, undesirable deviation of contact point by the probe is avoided and a suitable contact pressure is preferably kept, and further convenience in the work of exchanging damaged probes is brought about.

摘要翻译： 第一组装构造的特征在于包括：多个探针，其在接触部分的端部接触到半导体集成电路的电极上时具有弯曲部分以弯曲; 第一板，其设置有与所述探针的连接部分连接的第一布线图案; 第二板，其与所述第一板可移除地紧固并设置有与所述第一布线图形连接的第二布线图案; 安装有第二板的壳体构件用于保持探针的接触部分。 下一个配置功能包括：两种探头; 重新测量探针和连接探针，并且当插入设置有第二板的孔中时，接触部分的端部与设置有第一板的布线图案接触时，多个连接探针包括弯曲部分以弯曲; 其中设置有第二板的通孔被定位成与设置有第一板的布线图案的布置对准。 因此，避免了由探针引起的接触点的不期望的偏差，并且优选地保持适当的接触压力，并且进一步方便了更换损坏的探针的工作。

公开(公告)号：US5670889A

公开(公告)日：1997-09-23

申请号：US404729

申请日：1995-03-15

申请人： Masao Okubo ,  Nobuyuki Murakami ,  Kouji Katahira ,  Hiroshi Iwata ,  Kazumasa Okubo

发明人： Masao Okubo ,  Nobuyuki Murakami ,  Kouji Katahira ,  Hiroshi Iwata ,  Kazumasa Okubo

IPC分类号： G01R1/073 ,  G01R31/28 ,  H01L21/66 ,  G01R31/02

CPC分类号： G01R1/07342 ,  G01R31/2855

摘要： Probe card is a part which is incorporated into a probing equipment to test finished IC chips, This card is customarily mounted with a plurality of probes, very fine needle and generally bent, and each probe is disposed so that its front end may pinpoint to a pad of an IC chip of interest. In performing the probing test, a most important condition is to keep the probe contact pressure on the pad of an IC chip at a constant position during measurement time, but in performing such at a high temperature, heated IC chips radiate the probe card and thereby positional deviation of the contact point is caused by heat expansion of the probe card and hence the contact pressure may change. The invented probe card employs a ceramic material in fabricating the probe card for possessing a very low expansion coefficient or for possessing an equivalent coefficient value to the IC chip or wafers, thereby the positional deviation of the probe contact is avoided and other devices to cope with difficulties caused by performance at a high temperature are disclosed.

摘要翻译： 探针卡是结合在探测设备中以测试完成的IC芯片的部件。该卡通常安装有多个探针，非常细的针并且通常弯曲，并且每个探针被设置成使得其前端可以精确定位到 感兴趣的IC芯片的焊盘。 在进行探测测试时，最重要的条件是在测量时间内将探针接触压力保持在恒定位置，但是在高温下进行，加热的IC芯片辐射探针卡 接触点的位置偏差是由探针卡的热膨胀引起的，因此接触压力可能改变。 本发明的探针卡采用陶瓷材料制造探针卡，用于具有非常低的膨胀系数或者具有相当于IC芯片或晶片的系数值，从而避免了探针接触的位置偏差，并且其他装置可以应付 公开了在高温下由性能引起的困难。

公开(公告)号：US5134365A

公开(公告)日：1992-07-28

申请号：US735214

申请日：1991-07-24

申请人： Kazumasa Okubo ,  Masao Okubo ,  Yasuro Yoshimitsu ,  Kiyoshi Sugaya

发明人： Kazumasa Okubo ,  Masao Okubo ,  Yasuro Yoshimitsu ,  Kiyoshi Sugaya

IPC分类号： G01R1/067 ,  G01R1/073

CPC分类号： G01R1/07342 ,  G01R1/06733 ,  G01R1/06711

摘要： Probe card is a part which is incorporated into probing equipment to test finished IC chips. This card is customarily mounted with a plurality of probes, very fine needle and generally L letter shaped, each of which is disposed so that its front end may project downwardly toward an IC chip. Conventional probes are difficult to align all the probe front ends with electrical ends on the IC chip. Overdrive is normally taken to produce adequate contact pressures with respective probes after all contacts between the probe front ends and the IC ends are formed, but this action often causes conventional probe ends to slip down from the IC ends. The proposed probe card includes a new provision of a resin layer of an elastic, insulative characteristic to fill the central open area of the supporter which is assembled into the probe card. The filling, by such a resin layer, makes the probe front ends resiliently held in position so that a deviation from proper respective dispositions by overdrive becomes avoidable. The disclosure refers to additional devices to enhance the convenience in determining the alignment between the probe front ends and the IC ends, and also in obtaining accurate measurements of an IC chip under test.

摘要翻译： 探头卡是测试成品IC芯片的一部分。 该卡通常安装有多个探针，非常细的针，大致为L字形，每个探针的前端可以朝向IC芯片向下突出。 传统探头难以将所有的探针前端与IC芯片上的电端对齐。 在探针前端和IC端部之间的所有触点形成之后，通常会采用过驱动来产生足够的接触压力，但这种作用往往会导致传统的探针端部从IC端部滑落。 所提出的探针卡包括具有弹性绝缘特性的树脂层的新设置，以填充组装到探针卡中的支撑件的中心开口区域。 通过这种树脂层的填充使得探头前端弹性地保持在适当的位置，使得通过过驱动偏离适当的各自配置变得可避免。 本公开涉及增加确定探针前端和IC端之间的对准的便利性的附加装置，并且还用于获得正在测试的IC芯片的精确测量。

公开(公告)号：US6013169A

公开(公告)日：2000-01-11

申请号：US38929

申请日：1998-03-09

申请人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

发明人： Masao Okubo ,  Kazumasa Okubo ,  Hiroshi Iwata

IPC分类号： G01R1/067 ,  H01L21/66 ,  C25D5/50

CPC分类号： G01R1/06761 ,  G01R1/0675

摘要： A method of reforming a tungsten probe tip includes forming a non-oxidizing metallic film on the surface of the tungsten probe tip, heating the film in a non-oxidizing atmosphere or vacuum, and diffusing the film into the tungsten probe tip. The non-oxidizing metallic film can be formed from a metal such as gold, platinum, rhodium, palladium, and iridium. The reformed tungsten probe tip can be used in low voltage and low current testing, and has excellent abrasion resistance, conductivity and oxidation resistance.

摘要翻译： 重整钨探针尖端的方法包括在钨探针尖端的表面上形成非氧化性金属膜，在非氧化性气氛或真空中加热该膜，并将该膜扩散到钨探针尖端。 非氧化性金属膜可以由金，铂，铑，钯，铱等金属形成。 重整的钨探针尖端可用于低电压和低电流测试，具有优异的耐磨性，导电性和抗氧化性。