Abstract:
A high-frequency generator circuit comprises a signal generating circuit, a delay unit, a selector, a synthesizer circuit, and a controller. The signal generating circuit generates a signal having the same frequency as an output signal. The delay unit includes a plurality of delay circuits, and delays the signal generated by the signal generating circuit. The selector selects an output signal of the delay circuits. The synthesizer circuit synthesizes the signal selected by the selector, and outputs the output signal. The controller controls the selector based on data for setting a waveform of the output signal and a control signal for setting at least amplitude, phase and frequency of the output signal.
Abstract:
A parallel wiring according to the present invention includes a plurality of differential lines juxtaposed in a reference direction, wherein each differential line includes two wiring lines which are substantially parallel to each other, and the two wiring lines oppose each other obliquely with respect to the reference direction.
Abstract:
A semiconductor device comprising a substrate, a conductor and an insulating film provided on the surface of the substrate, part of the surface of the substrate being electrically connected with the conductor through a contact hole made in the insulating film, wherein a barrier layer present between part of the surface of the substrate and the conductor is provided only on the bottom of the contact hole, and the barrier layer provided on the bottom comprises amorphous titanium silicon nitride. This can provide a structure that has a barrier layer with a low contact resistance, enables formation of a conductor film of good quality on the barrier layer, and can attain a good electrical conduction even at fine contact holes.
Abstract:
A code division multiplex communications system comprising: receiving circuit for receiving a radio wave and transforming the radio wave to an electric signal; delaying circuit for sequentially reading the electric signal at a timing of a clock pulse; switching circuit for shutting off a drive current of the delaying circuit at an OFF timing of the clock pulse; adding and subtracting circuit for adding and subtracting outputs of the delaying circuit in accordance with a spread code; and reproducing circuit for reproducing a transmission signal on the basis of an output of the adding and subtracting circuit. RCS95-120 is similar with respect to a point that an analog LSI matched filter is constructed by a slide capacitor system.
Abstract:
By providing a deposited film formation method in which aluminum or a metal composed mainly of aluminum of good quality is selectively deposited according to the CVD method utilizing an alkyl aluminum hydride and hydrogen, and then pure aluminum or a metal composed mainly of aluminum is non-selectively deposited, it becomes possible to form an electroconductive film of good quality within fine openings or on an insulating layer.
Abstract:
By providing a deposited film formation method in which aluminum or a metal composed mainly of aluminum of good quality is selectively deposited according to the CVD method utilizing an alkyl aluminum hydride and hydrogen, and then pure aluminum or a metal composed mainly of aluminum is non-selectively deposited, it becomes possible to form an electroconductive film of good quality within fine openings or on an insulating layer.
Abstract:
A deposited film formation method which forms an aluminum film by use of the plasma CVD method,wherein a substrate having an electron donative surface (A) and a non-electron donative surface (B) is arranged in a space for deposited film formation having a portion which is increased in cross-sectional area toward said substrate is arranged, and a gas of trimethylaluminum and hydrogen gas are introduced into said space for deposited film formation to deposit an aluminum film selectively on said electron donative surface (A).A deposited film formation method which forms an aluminum film by use of the plasma CVD method, comprising:(a) the step of arranging a substrate having an electron donative surface (a) and a non-electron donative surface (B) in a space for deposited film formation equipped with a reverse flow preventive means into plasma, and(b) the step of introducing a gas of trimethylaluminum and hydrogen gas into said space for deposited film formation, said aluminum film being selectively formed on said electron donative surface (A).
Abstract:
A chemical vapor deposition process is disclosed comprising the steps of forming liquid droplets of a liquid raw material; injecting the liquid droplets through a plate member opening placed opposite to the surface of the substrate to vaporize the liquid droplets; and supplying a reaction gas that reacts with the vaporized raw material; and depositing a thin film on the substrate.
Abstract:
A process for forming a deposition film comprising aluminum comprises the steps of: treating chemically a surface of a substrate having an electron-donative surface and a non-electron-donative surface so as to terminate the electron-donative surface with hydrogen atoms, and thereafter placing the substrate in a space for deposition film formation; introducing gas comprising alkylaluminum hydride and hydrogen gas into the space for deposition film formation; and forming an aluminum film selectively on the electron-donative surface by maintaining the substrate at a temperature in the range of from not lower than the decomposition temperature of the alkylaluminum hydride to not higher than 450.degree. C.
Abstract:
A depletion operation is realized by using a depletion type MOSFET even at the room temperature or the liquid nitrogen temperature without doping the channel portion below the gate electrode with impurities having a conductivity type, which is opposite to the conductivity type of the semiconductor substrate. Further this FET can construct an inverter together with an enhancement type FET and these can be integrated on one substrate.