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1.发明申请PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开印刷电路板，燃料电池和制造印刷电路板的方法公开(公告)号：US20110281202A1
公开(公告)日：2011-11-17
申请号：US13097155
申请日：2011-04-29
CPC分类号： H01M8/0269 , H01M8/1011 , H01M8/2465 , Y02E60/523 , Y02P70/56 , Y10T29/49155
摘要： An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.
摘要翻译： FPC基板，电极膜和燃料容纳室容纳在壳体中。 在FPC基板中，将多个集电体部分接合到基底绝缘层上，其中夹有粘合剂图案。 基底绝缘层由多孔ePTFE制成，是透气的。 开口形成在收集器部分中。 粘合剂图案具有与多个集电体部分相同的形状。 FPC基板沿着弯曲部弯曲而夹在壳体的上表面部分和下表面部分之间。 电极膜配置在FPC基板的多个集电部之间。 燃料容纳室设置在FPC基板和下表面部分之间以与基底绝缘层接触。 液体燃料被供给到燃料容纳室。
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公开(公告)号：US20110277321A1
公开(公告)日：2011-11-17
申请号：US13083097
申请日：2011-04-08
IPC分类号： H05K3/10
CPC分类号： H05K3/20 , H05K1/0393 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155
摘要： A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
摘要翻译： 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来，将抗蚀剂膜曝光和显影，从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后，在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影，使得在导体图案上形成粘合剂图案。 之后，将基底绝缘层接合到导体图案上，其中夹有粘合剂图案。 最后，将载体层与导体图案分离，从而制造FPC基板。
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公开(公告)号：US20120024581A1
公开(公告)日：2012-02-02
申请号：US13094941
申请日：2011-04-27
CPC分类号： H05K1/034 , H01B3/445 , H05K1/0393 , H05K3/06 , H05K3/108 , H05K3/28 , H05K2201/0116 , H05K2201/015
摘要： A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.
摘要翻译： 在由多孔ePTFE制成的多孔基底绝缘层上形成多个导体迹线。 每个导体迹线具有种子层和导体层的层叠结构。 覆盖绝缘层形成在基底绝缘层上以覆盖每个导体迹线。 用作多孔基底绝缘层的ePTFE具有连续的孔。 ePTFE的平均孔径不小于0.05μm且不大于1.0μm。
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公开(公告)号：US09288903B2
公开(公告)日：2016-03-15
申请号：US13094941
申请日：2011-04-27
CPC分类号： H05K1/034 , H01B3/445 , H05K1/0393 , H05K3/06 , H05K3/108 , H05K3/28 , H05K2201/0116 , H05K2201/015
摘要： A plurality of conductor traces are formed on a porous base insulating layer made of porous ePTFE. Each conductor trace has a laminated structure of a seed layer and a conductor layer. A cover insulating layer is formed on the base insulating layer to cover each conductor trace. The ePTFE used as the porous base insulating layer has continuous pores. An average pore size of the ePTFE is not less than 0.05 μm and not more than 1.0 μm.
摘要翻译： 在由多孔ePTFE制成的多孔基底绝缘层上形成多个导体迹线。 每个导体迹线具有种子层和导体层的层叠结构。 覆盖绝缘层形成在基底绝缘层上以覆盖每个导体迹线。 用作多孔基底绝缘层的ePTFE具有连续的孔。 ePTFE的平均孔径不小于0.05μm且不大于1.0μm。
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公开(公告)号：US08438726B2
公开(公告)日：2013-05-14
申请号：US13083097
申请日：2011-04-08
IPC分类号： H05K3/02
CPC分类号： H05K3/20 , H05K1/0393 , Y10T29/49117 , Y10T29/49144 , Y10T29/49155
摘要： A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.
摘要翻译： 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来，将抗蚀剂膜曝光和显影，从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后，在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影，使得在导体图案上形成粘合剂图案。 之后，将基底绝缘层接合到导体图案上，其中夹有粘合剂图案。 最后，将载体层与导体图案分离，从而制造FPC基板。
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