公开(公告)号：US08822048B2

公开(公告)日：2014-09-02

申请号：US13356955

申请日：2012-01-24

申请人： Hirofumi Ebe ,  Shinichi Inoue ,  Yoshihiro Furukawa

发明人： Hirofumi Ebe ,  Shinichi Inoue ,  Yoshihiro Furukawa

IPC分类号： H01M2/02 ,  H01M14/00 ,  H05K5/03 ,  B32B33/00

CPC分类号： C08K5/3475 ,  H01M8/00 ,  H01M10/0525 ,  H01M10/4257 ,  H05K1/0393 ,  H05K3/247 ,  H05K2203/122

摘要： A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1).

摘要翻译： 在基底绝缘层的一个表面上形成导体层。 导体层包括集电器部分和从收集器部分延伸成细长形状的拉出导体部分。 覆盖层形成在基底绝缘层上以覆盖导体层的预定部分。 用于覆盖层的材料包括含有由式（1）表示的化合物的糊剂组合物。

公开(公告)号：US20090194321A1

公开(公告)日：2009-08-06

申请号：US12356106

申请日：2009-01-20

申请人： Yasuto Ishimaru ,  Hirofumi Ebe

发明人： Yasuto Ishimaru ,  Hirofumi Ebe

IPC分类号： H05K1/18 ,  H05K3/10

CPC分类号： H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674

摘要： A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in a periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A pair of slits is formed in the metal layer such that a region being opposite to the electronic component is sandwiched therebetween. Each slit is formed so as not to divide the metal layer into a plurality of regions.

摘要翻译： 安装区域设置在绝缘层的一个表面的大致中心处。 导电迹线形成为从安装区域的内部向外延伸。 在安装区域的周围形成覆盖绝缘层以覆盖导电迹线。 导电迹线的端子布置在安装区域中，并且电子部件的凸块接合到端子。 例如，在绝缘层的另一个表面上设置由铜构成的金属层。 在金属层中形成一对狭缝，使得与电子部件相对的区域夹在其间。 每个狭缝形成为不将金属层划分成多个区域。

公开(公告)号：US08102664B2

公开(公告)日：2012-01-24

申请号：US12357714

申请日：2009-01-22

申请人： Yasuto Ishimaru ,  Hirofumi Ebe

发明人： Yasuto Ishimaru ,  Hirofumi Ebe

IPC分类号： H05K1/18

CPC分类号： H05K3/303 ,  H01L23/3735 ,  H01L2224/16225 ,  H05K1/0203 ,  H05K1/0269 ,  H05K1/189 ,  H05K2201/0108 ,  H05K2201/09318 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  H05K2203/166 ,  Y02P70/613 ,  Y10T29/49162

摘要： A mounting region having a rectangular shape is provided at an approximately center of one surface of an insulating layer. A plurality of conductive traces are formed so as to outwardly extend from the inside of the mounting region. A cover insulating layer is formed so as to cover the plurality of conductive traces in a periphery of the mounting region. An electronic component is mounted on the insulating layer so as to overlap with the mounting region. A metal layer is provided on the other surface of the insulating layer. Openings having a rectangular shape are formed in the metal layer along a pair of longer sides and a pair of shorter sides of the mounting region. The openings are opposite to part of terminals of the plurality of conductive traces, respectively, with the insulating layer sandwiched therebetween.

摘要翻译： 在绝缘层的一个表面的大致中心处设置具有矩形形状的安装区域。 多个导电迹线被形成为从安装区域的内部向外延伸。 形成覆盖绝缘层，以覆盖安装区域周边的多个导电迹线。 电子部件安装在绝缘层上以与安装区域重叠。 在绝缘层的另一个表面上设置金属层。 沿着一对长边和安装区域的一对短边在金属层中形成具有矩形形状的开口。 开口分别与多个导电迹线的端子的一部分相对，绝缘层夹在其间。

公开(公告)号：US08022306B2

公开(公告)日：2011-09-20

申请号：US12426404

申请日：2009-04-20

申请人： Hirofumi Ebe ,  Yasuto Ishimaru

发明人： Hirofumi Ebe ,  Yasuto Ishimaru

IPC分类号： H05K1/09 ,  B05D5/12

CPC分类号： H05K1/0271 ,  H01L23/3735 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10674

摘要： A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3).

摘要翻译： 安装区域设置在绝缘层的一个表面的大致中心处。 在绝缘层的另一个表面上设置金属层。 形成狭缝以与金属层的与安装区域重合的区域（相对区域）交叉并分割金属层。 由狭缝分割的金属层的多个区域（大区域）各自包括相对区域的部分区域（小区域）。 每个大区域的面积对应于其中包括的小区域的面积。 具体而言，相对于金属的整个面积，面积为（A±δ）[％]的面积相对于相对区域的整个面积的面积为A [％]的小区域被包括 层。 这里，δ是可接受的误差范围，可接受的误差范围δ不大于（A×0.3）。

公开(公告)号：US20090277667A1

公开(公告)日：2009-11-12

申请号：US12426404

申请日：2009-04-20

申请人： Hirofumi EBE ,  Yasuto ISHIMARU

发明人： Hirofumi EBE ,  Yasuto ISHIMARU

IPC分类号： H05K1/09 ,  B05D5/12

CPC分类号： H05K1/0271 ,  H01L23/3735 ,  H01L23/49838 ,  H01L2224/16 ,  H01L2924/01078 ,  H01L2924/01079 ,  H05K1/0209 ,  H05K1/189 ,  H05K2201/09663 ,  H05K2201/09781 ,  H05K2201/10674

摘要： A mounting region is provided at a substantially center of one surface of an insulating layer. A metal layer is provided on the other surface of the insulating layer. A slit is formed to cross a region (an opposite region) of the metal layer that coincides with the mounting region and to divide the metal layer. A plurality of regions (large regions) of the metal layer divided by the slit each include a partial region (small region) of the opposite region. The area of each large region is set corresponding to the area of the small region included therein. Specifically, the small region having the area of A [%] with respect to the whole area of the opposite region is included in the large region having the area of (A±δ) [%] with respect to the whole area of the metal layer. Here, δ is an acceptable error range, and the acceptable error range δ is not more than (A×0.3).

摘要翻译： 安装区域设置在绝缘层的一个表面的大致中心处。 在绝缘层的另一个表面上设置金属层。 形成狭缝以与金属层的与安装区域重合的区域（相对区域）交叉并分割金属层。 由狭缝分割的金属层的多个区域（大区域）各自包括相对区域的部分区域（小区域）。 每个大区域的面积对应于其中包括的小区域的面积。 具体而言，相对于金属的整个面积，面积为（A±δ）[％]的面积相对于相对区域的整个面积的面积为A [％]的小区域被包含在 层。 这里，delta是可接受的误差范围，可接受的误差范围delta不大于（Ax0.3）。

公开(公告)号：US20090195997A1

公开(公告)日：2009-08-06

申请号：US12356099

申请日：2009-01-20

申请人： Yasuto Ishimaru ,  Hirofumi Ebe

发明人： Yasuto Ishimaru ,  Hirofumi Ebe

IPC分类号： H05K1/18 ,  H05K3/10

CPC分类号： H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/49162

摘要： A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.

摘要翻译： 安装区域设置在绝缘层的一个表面的大致中心处。 导电迹线形成为从安装区域的内部向外延伸。 在安装区域的周围形成覆盖绝缘层以覆盖导电迹线。 导电迹线的端子布置在安装区域中，并且电子部件的凸块接合到端子。 例如，在绝缘层的另一个表面上设置由铜构成的金属层。 在金属层中形成狭缝，以跨越与电子部件相对的区域并分割金属层。

公开(公告)号：US20120186865A1

公开(公告)日：2012-07-26

申请号：US13356955

申请日：2012-01-24

申请人： Hirofumi EBE ,  Shinichi INOUE ,  Yoshihiro FURUKAWA

发明人： Hirofumi EBE ,  Shinichi INOUE ,  Yoshihiro FURUKAWA

IPC分类号： H05K1/02 ,  H01B1/04 ,  H01B1/12 ,  C08K5/3475 ,  C09D167/02

CPC分类号： C08K5/3475 ,  H01M8/00 ,  H01M10/0525 ,  H01M10/4257 ,  H05K1/0393 ,  H05K3/247 ,  H05K2203/122

摘要： A conductor layer is formed on one surface of a base insulating layer. The conductor layer includes a collector portion, and a drawn-out conductor portion extending in an elongated shape from the collector portion. A cover layer is formed on the base insulating layer to cover a predetermined portion of the conductor layer. A material for the cover layer includes a paste composition containing a compound expressed by the formula (1).

摘要翻译： 在基底绝缘层的一个表面上形成导体层。 导体层包括集电器部分和从收集器部分延伸成细长形状的拉出导体部分。 覆盖层形成在基底绝缘层上以覆盖导体层的预定部分。 用于覆盖层的材料包括含有由式（1）表示的化合物的糊剂组合物。

公开(公告)号：US20120141840A1

公开(公告)日：2012-06-07

申请号：US13288519

申请日：2011-11-03

申请人： Shinichi INOUE ,  Hirofumi EBE

发明人： Shinichi INOUE ,  Hirofumi EBE

IPC分类号： H01M8/04 ,  H01M2/02 ,  H01M2/00

CPC分类号： H01M8/04201 ,  H01M8/0239 ,  H01M8/0247 ,  H01M8/0269 ,  H01M8/04186 ,  H01M8/1011 ,  Y02E60/523

摘要： A base insulating layer in an FPC board is used as a fuel supply amount adjustment film for a fuel cell. The base insulating layer in the FPC board has a plurality of anisotropic through pores. The anisotropic through pores respectively has openings on one surface and the other surface of the base insulating layer. The respective openings on the one surface and the other surface of the base insulating layer communicate with each other without diverging by a single communication path. The communication path has a shape that can specify a long axis and a short axis perpendicular to the long axis. The long axis extends in a direction intersecting the one surface and the other surface of the base insulating layer at a predetermined angle.

摘要翻译： 作为燃料电池的燃料供给量调整膜，使用FPC基板的基底绝缘层。 FPC基板中的基底绝缘层具有多个各向异性通孔。 各向异性通孔分别在基体绝缘层的一个表面和另一个表面上具有开口。 基底绝缘层的一个表面和另一个表面上的相应开口彼此连通，而不会通过单个连通路径发散。 通信路径具有可以指定长轴和垂直于长轴的短轴的形状。 长轴在与基体绝缘层的一个表面和另一个表面相交的方向上以预定角度延伸。

公开(公告)号：US08097814B2

公开(公告)日：2012-01-17

申请号：US12356099

申请日：2009-01-20

申请人： Yasuto Ishimaru ,  Hirofumi Ebe

发明人： Yasuto Ishimaru ,  Hirofumi Ebe

IPC分类号： H05K1/16

CPC分类号： H05K1/0209 ,  H01L23/3735 ,  H01L23/562 ,  H01L2224/16225 ,  H05K1/0271 ,  H05K1/189 ,  H05K2201/09318 ,  H05K2201/09663 ,  H05K2201/0969 ,  H05K2201/09781 ,  H05K2201/10674 ,  Y10T29/49162

摘要： A mounting region is provided at an approximately center of one surface of an insulating layer. A conductive trace is formed so as to outwardly extend from inside of the mounting region. A cover insulating layer is formed in the periphery of the mounting region so as to cover the conductive trace. A terminal of the conductive trace is arranged in the mounting region, and a bump of an electronic component is bonded to the terminal. A metal layer made of copper, for example, is provided on the other surface of the insulating layer. A slit is formed in the metal layer so as to cross a region being opposite to the electronic component and to divide the metal layer.

摘要翻译： 安装区域设置在绝缘层的一个表面的大致中心处。 导电迹线形成为从安装区域的内部向外延伸。 在安装区域的周围形成覆盖绝缘层以覆盖导电迹线。 导电迹线的端子布置在安装区域中，并且电子部件的凸块接合到端子。 例如，在绝缘层的另一个表面上设置由铜构成的金属层。 在金属层中形成狭缝，以跨越与电子部件相对的区域并分割金属层。

公开(公告)号：US20110281202A1

公开(公告)日：2011-11-17

申请号：US13097155

申请日：2011-04-29

申请人： Hiroyuki HANAZONO ,  Shinichi INOUE ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Hirofumi EBE

发明人： Hiroyuki HANAZONO ,  Shinichi INOUE ,  Mineyoshi HASEGAWA ,  Keisuke OKUMURA ,  Hirofumi EBE

IPC分类号： H01M8/04 ,  H05K1/00 ,  H05K3/10

CPC分类号： H01M8/0269 ,  H01M8/1011 ,  H01M8/2465 ,  Y02E60/523 ,  Y02P70/56 ,  Y10T29/49155

摘要： An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.

摘要翻译： FPC基板，电极膜和燃料容纳室容纳在壳体中。 在FPC基板中，将多个集电体部分接合到基底绝缘层上，其中夹有粘合剂图案。 基底绝缘层由多孔ePTFE制成，是透气的。 开口形成在收集器部分中。 粘合剂图案具有与多个集电体部分相同的形状。 FPC基板沿着弯曲部弯曲而夹在壳体的上表面部分和下表面部分之间。 电极膜配置在FPC基板的多个集电部之间。 燃料容纳室设置在FPC基板和下表面部分之间以与基底绝缘层接触。 液体燃料被供给到燃料容纳室。