PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    1.
    发明申请
    PRINTED CIRCUIT BOARD, FUEL CELL AND METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 审中-公开
    印刷电路板,燃料电池和制造印刷电路板的方法

    公开(公告)号:US20110281202A1

    公开(公告)日:2011-11-17

    申请号:US13097155

    申请日:2011-04-29

    IPC分类号: H01M8/04 H05K1/00 H05K3/10

    摘要: An FPC board, electrode films and a fuel accommodating chamber are accommodated in a casing. In the FPC board, a plurality of collector portions are joined onto a base insulating layer with an adhesive pattern sandwiched therebetween. The base insulating layer is made of porous ePTFE, and is air-permeable. Openings are formed in the collector portions. The adhesive pattern has the same shape as the plurality of collector portions. The FPC board is sandwiched by an upper surface portion and a lower surface portion of the casing while being bent along a bend portion. The electrode films are arranged between the plurality of collector portions of the FPC board. The fuel accommodating chamber is provided between the FPC board and the lower surface portion so as to come in contact with the base insulating layer. A liquid fuel is supplied to the fuel accommodating chamber.

    摘要翻译: FPC基板,电极膜和燃料容纳室容纳在壳体中。 在FPC基板中,将多个集电体部分接合到基底绝缘层上,其中夹有粘合剂图案。 基底绝缘层由多孔ePTFE制成,是透气的。 开口形成在收集器部分中。 粘合剂图案具有与多个集电体部分相同的形状。 FPC基板沿着弯曲部弯曲而夹在壳体的上表面部分和下表面部分之间。 电极膜配置在FPC基板的多个集电部之间。 燃料容纳室设置在FPC基板和下表面部分之间以与基底绝缘层接触。 液体燃料被供给到燃料容纳室。

    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD
    3.
    发明申请
    METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD 有权
    制造印刷电路板的方法

    公开(公告)号:US20110277321A1

    公开(公告)日:2011-11-17

    申请号:US13083097

    申请日:2011-04-08

    IPC分类号: H05K3/10

    摘要: A resist film is formed on a conductor layer of a two-layered base material composed of a carrier layer and the conductor layer. Next, the resist film is exposed and developed, so that an etching resist pattern is formed. A region of the conductor layer that is exposed while not covered with the etching resist pattern is removed by etching. A conductor pattern is formed by removing the etching resist pattern. Then, an adhesive layer precursor is applied on an entire surface including an upper surface of the conductor pattern. The adhesive layer precursor is exposed and developed, so that an adhesive pattern is formed on the conductor pattern. After that, a base insulating layer is joined onto the conductor pattern with the adhesive pattern sandwiched therebetween. Finally, a carrier layer is separated from the conductor pattern, so that the FPC board is manufactured.

    摘要翻译: 在由载体层和导体层构成的两层基材的导体层上形成抗蚀剂膜。 接下来,将抗蚀剂膜曝光和显影,从而形成抗蚀剂图案。 通过蚀刻除去未被抗蚀剂图案覆盖的露出的导体层的区域。 通过去除抗蚀剂图案形成导体图案。 然后,在包括导体图案的上表面的整个表面上施加粘合剂层前体。 粘合剂层前体被曝光和显影,使得在导体图案上形成粘合剂图案。 之后,将基底绝缘层接合到导体图案上,其中夹有粘合剂图案。 最后,将载体层与导体图案分离,从而制造FPC基板。

    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME
    4.
    发明申请
    PRINTED CIRCUIT BOARD AND METHOD OF MANUFACTURING THE SAME 有权
    印刷电路板及其制造方法

    公开(公告)号:US20120024574A1

    公开(公告)日:2012-02-02

    申请号:US13187830

    申请日:2011-07-21

    IPC分类号: H05K1/00 H05K3/10

    摘要: A printed circuit board includes a base insulating layer formed of a porous film. Conductor traces are formed on the base insulating layer formed of the porous film. A cover insulating layer is formed on the base insulating layer to cover the conductor traces. The porous film used as the base insulating layer has a reflectivity of not less than 50% for light of at least a part of wavelengths in a wavelength region from 400 nm to 800 nm.

    摘要翻译: 印刷电路板包括由多孔膜形成的基底绝缘层。 在由多孔膜形成的基底绝缘层上形成导体迹线。 在绝缘绝缘层上形成覆盖导体迹线的覆盖绝缘层。 用作基底绝缘层的多孔膜对于在400nm至800nm的波长区域中的至少一部分波长的光具有不小于50%的反射率。

    FUEL SUPPLY AMOUNT ADJUSTMENT FILM, PRINTED CIRCUIT BOARD, AND FUEL CELL
    8.
    发明申请
    FUEL SUPPLY AMOUNT ADJUSTMENT FILM, PRINTED CIRCUIT BOARD, AND FUEL CELL 审中-公开
    燃油供应量调整膜,印刷电路板和燃料电池

    公开(公告)号:US20120141840A1

    公开(公告)日:2012-06-07

    申请号:US13288519

    申请日:2011-11-03

    IPC分类号: H01M8/04 H01M2/02 H01M2/00

    摘要: A base insulating layer in an FPC board is used as a fuel supply amount adjustment film for a fuel cell. The base insulating layer in the FPC board has a plurality of anisotropic through pores. The anisotropic through pores respectively has openings on one surface and the other surface of the base insulating layer. The respective openings on the one surface and the other surface of the base insulating layer communicate with each other without diverging by a single communication path. The communication path has a shape that can specify a long axis and a short axis perpendicular to the long axis. The long axis extends in a direction intersecting the one surface and the other surface of the base insulating layer at a predetermined angle.

    摘要翻译: 作为燃料电池的燃料供给量调整膜,使用FPC基板的基底绝缘层。 FPC基板中的基底绝缘层具有多个各向异性通孔。 各向异性通孔分别在基体绝缘层的一个表面和另一个表面上具有开口。 基底绝缘层的一个表面和另一个表面上的相应开口彼此连通,而不会通过单个连通路径发散。 通信路径具有可以指定长轴和垂直于长轴的短轴的形状。 长轴在与基体绝缘层的一个表面和另一个表面相交的方向上以预定角度延伸。

    PRINTED CIRCUIT BOARD AND FUEL CELL INCLUDING THE SAME
    9.
    发明申请
    PRINTED CIRCUIT BOARD AND FUEL CELL INCLUDING THE SAME 审中-公开
    印刷电路板和燃料电池,包括它们

    公开(公告)号:US20110189508A1

    公开(公告)日:2011-08-04

    申请号:US13019460

    申请日:2011-02-02

    摘要: Collector portions, connection conductor portions and drawn-out conductor portions are formed on one surface of a base insulting layer of an FPC board. The collector portions, the connection conductor portions and the drawn-out conductor portions are covered with cover layers. The cover layers contain a resin composition. The resin composition has moisture permeability of not more than 150 g/(m2·24 h) in an environment at a temperature of 40° C. and with a relative humidity of 90%. The resin composition has a glass transition temperature of not less than 80° C.

    摘要翻译: 集电体部分,连接导体部分和引出导体部分形成在FPC基板的基底绝缘层的一个表面上。 集电体部分,连接导体部分和引出导体部分被覆盖层覆盖。 覆盖层含有树脂组合物。 在40℃,相对湿度90%的环境下,树脂组合物的透湿度不超过150g /(m2·24h)。 树脂组合物的玻璃化转变温度不低于80℃

    PRINTED CIRCUIT BOARD AND FUEL CELL
    10.
    发明申请
    PRINTED CIRCUIT BOARD AND FUEL CELL 审中-公开
    印刷电路板和燃料电池

    公开(公告)号:US20110076522A1

    公开(公告)日:2011-03-31

    申请号:US12884763

    申请日:2010-09-17

    IPC分类号: H01M14/00 H05K1/00 H05K1/09

    摘要: An FPC board includes a base insulating layer. The base insulating layer is composed of a first insulating portion and a second insulating portion. A bend portion is provided in the first insulating portion. A conductor layer is formed on one surface of the base insulating layer. The conductor layer is composed of a collector portion and a drawn-out conductor portion. A cover layer is formed to cover the conductor layer. A liquid crystal polymer is used as a material for the base insulating layer.

    摘要翻译: FPC基板包括基底绝缘层。 基极绝缘层由第一绝缘部和第二绝缘部构成。 弯曲部分设置在第一绝缘部分中。 在基底绝缘层的一个表面上形成导体层。 导体层由集电部和拉出导体部构成。 形成覆盖层以覆盖导体层。 使用液晶聚合物作为基底绝缘层的材料。