-
1.发明申请TIN POWDER, MANUFACTURING METHOD OF TIN POWDER AND CONDUCTIVE PASTE CONTAINING TIN POWDER 审中-公开锡粉，含有粉末的粉末和导电浆料的制造方法公开(公告)号：US20090032139A1
公开(公告)日：2009-02-05
申请号：US11912940
申请日：2006-04-27
CPC分类号： H05K1/097 , B22F1/0048 , B22F1/0055 , B22F9/24 , H05K3/4069
摘要： Object of the invention is to provide a tin powder containing fine tin particles which performs fine pitch wiring circuit easily, excellent in filling the minute diameter via holes, and exhibits low temperature fusibility. In order to achieve the object, a copper powder slurry is prepared by adding a copper powder in water with agitation and a tin solution for deposition by substitution is prepared by adding an acid to an aqueous mixture solution containing a stannous salt and thiourea. Then the copper powder slurry and the tin solution for deposition by substitution are mixed with agitation in a certain ratio of tin in the solution against to copper in the slurry to deposit tin by substitution on the surface of the copper powder. As a result, the tin powder of the present invention is obtained.
摘要翻译： 本发明的目的是提供一种含有细锡颗粒的锡粉，其容易地进行细间距布线电路，在通孔中填充微小直径优异，并且显示低温熔融性。 为了达到上述目的，通过在水中搅拌加入铜粉而制备铜粉浆料，通过在含有亚锡盐和硫脲的混合水溶液中加入酸来制备用于沉积的锡溶液。 然后将铜粉和用于通过置换沉积的锡溶液以一定比例的锡溶液与浆料中的铜混合搅拌混合，以通过在铜粉表面上的取代沉积锡。 结果，得到本发明的锡粉末。
-
2.发明申请公开(公告)号：US20080042111A1
公开(公告)日：2008-02-21
申请号：US11629888
申请日：2005-06-17
CPC分类号： H01B1/22 , B22F1/025 , B22F9/16 , B22F2998/00 , B23K35/025 , B23K35/26 , B23K35/302 , B23K35/40 , C22B3/46 , C22B15/0091 , C22B25/04 , C23C18/1635 , C23C18/31 , C23C18/54 , H05K1/095 , H05K3/4069 , Y02P10/234 , Y02P10/236 , B22F1/0055
摘要： It is an object to provide a copper-containing tin powder having excellent capabilities in forming fine wiring circuits and filling via holes with ability in bond by melting at a low temperature. In order to achieve the object, it is produced from a copper powder as a starting material by a wet substitution process and it contains remainder of copper un-substituted at 30% by weight or less. The change rate of properties of the copper-containing tin powder, e.g. an average primary particle size or the like is in the range from −20 to +5% with respect to the starting copper powders. The copper-containing tin powder is produced by a wet substitution process in which a copper powder is brought into contact with a plating solution for tin substitution to make copper component constituting the copper powder dissolve with simultaneous substituted deposition of tin.
摘要翻译： 本发明的目的是提供一种具有优异的形成精细布线电路的能力的铜含量的锡粉末，并且通过在低温下的熔融来填充通孔的能力。 为了达到上述目的，通过湿式取代法由铜粉作为原料制造，含有30重量％以下的未取代的铜的剩余部分。 含铜锡粉的性能变化率，例如 相对于起始铜粉，平均一次粒径等在-20〜+ 5％的范围内。 含铜锡粉末通过湿式取代工艺制造，其中使铜粉与用于锡取代的镀液接触，以使铜构成的铜成分同时代替沉积锡而溶解。
-
3.发明申请公开(公告)号：US20080090092A1
公开(公告)日：2008-04-17
申请号：US11658083
申请日：2005-07-15
CPC分类号： B22F1/025 , B22F2998/10 , C23C18/1635 , C23C18/1841 , C23C18/34 , H01B1/026 , H05K1/092 , Y10T428/12181 , B22F1/0088 , B22F1/0085
摘要： Objects of the present invention are to provide oxidation resistant nickel-coated copper powder for conductive paste capable of forming a conductive wiring part for an electronic circuit, and to provide a method for producing the same. In order to achieve the objects, there is provided nickel-coated copper powder which is characterized in that it comprises nickel-coated copper particles in which a core material is copper particles, a catalyst for plating is fixed to a surface of the copper-particles by reduction reaction and electroless plated nickel is applied to the outermost surface. The reduction reaction is characterized in that hydrazine is used as a reducing agent.
摘要翻译： 本发明的目的是提供一种能够形成用于电子电路的导电布线部分的用于导电浆料的耐氧化镍包覆铜粉末，并提供其制造方法。 为了实现上述目的，提供了镍包覆铜粉，其特征在于，其包含镍包覆的铜颗粒，其中芯材为铜颗粒，镀覆催化剂固定在铜颗粒表面 通过还原反应和无电镀镍施加到最外表面。 还原反应的特征在于将肼用作还原剂。
-
-
搜索结果
3 条记录 (耗时 0.01 秒)
