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公开(公告)号：US5330684A
公开(公告)日：1994-07-19
申请号：US970806
申请日：1992-11-03
申请人： Kenji Emori , Yoshihiko Tasaka
发明人： Kenji Emori , Yoshihiko Tasaka
IPC分类号： C09J7/00 , C08G59/40 , C09J7/02 , C09J9/02 , C09J11/06 , C09J129/14 , C09J153/00 , C09J153/02 , C09J163/00 , C09J177/00 , C09J201/00 , C09J201/06 , H01B1/22 , H01B5/16 , H05K3/32 , H01B1/00 , H01B1/20
CPC分类号： H01B1/22 , C08G59/4014 , C09J163/00 , C09J177/00 , H05K3/321
摘要： A composition for forming a moisture resistant, anisotropic conductive film having a rapid curing speed, high heat resistance, high humidity resistance, long shelf life and excellent repairability comprising an adhesive composition containing about 100 parts cyanate ester, from about 0.01 part to 10 parts of a curing catalyst, from about 10 parts to about 300 parts of a film-formable thermoplastic resin, and from about 10 to about 500 parts of an epoxy resin, and from about 0.1 part to about 20 parts conductive particles per 100 parts total adhesive composition.
摘要翻译： 一种用于形成具有快速固化速度，高耐热性，高耐湿性，长保质期和优异的可修复性的防湿各向异性导电膜的组合物，其包含含有约100份氰酸酯的粘合剂组合物，其含量为约0.01份至10份 固化催化剂，约10份至约300份可成膜热塑性树脂和约10至约500份环氧树脂，以及约0.1份至约20份导电颗粒/ 100份总粘合剂组合物 。
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公开(公告)号：US4865954A
公开(公告)日：1989-09-12
申请号：US7332
申请日：1987-01-27
申请人： Yoshichi Hagiwara , Naoya Kimura , Kenji Emori
发明人： Yoshichi Hagiwara , Naoya Kimura , Kenji Emori
CPC分类号： C23F1/02 , G03F7/00 , H05K3/064 , H05K2201/0355 , H05K2201/0382 , H05K2201/09745
摘要： The present invention provides a method for forming a metal image in which a resist film is provided at an image portion and then etching processing is performed to thereby form the metal image comprising the steps of: (1) forming an image comprised of concave surface portions on a metal surface; (2) forming a resist film on the metal surface; and (3) exposing the resist film to such an extent that at the concave portions of the resist film is not made wholly soluble.
摘要翻译： 本发明提供一种形成金属图像的方法，其中在图像部分设置抗蚀剂膜，然后进行蚀刻处理，从而形成金属图像，包括以下步骤：（1）形成由凹面部分 在金属表面上 （2）在金属表面上形成抗蚀膜; 和（3）将抗蚀剂膜曝光到在抗蚀剂膜的凹部不完全溶解的程度。
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