Method and Apparatus for Diagnosing an Integrated Circuit
    3.
    发明申请
    Method and Apparatus for Diagnosing an Integrated Circuit 有权
    用于诊断集成电路的方法和装置

    公开(公告)号:US20100244853A1

    公开(公告)日:2010-09-30

    申请号:US12628725

    申请日:2009-12-01

    IPC分类号: G01R31/02 G21C17/00

    摘要: System and method for diagnosing failures within an integrated circuit is provided. In an embodiment, the apparatus includes a diagnostic cell coupled in series with a buffer chain. The diagnostic cell includes a plurality of logic operators that when activated invert a signal received from the buffer chain. The inversion of the signal from the buffer chain allows the diagnostic cell to determine the location of a failure within an integrated circuit previously determined by a scan chain design for test methodology to contain a failure.

    摘要翻译: 提供了一种诊断集成电路故障的系统和方法。 在一个实施例中,该装置包括与缓冲链串联耦合的诊断单元。 诊断单元包括多个逻辑运算符,当激活时反转从缓冲器链接收到的信号。 来自缓冲链的信号的反转允许诊断单元确定先前由扫描链设计确定的集成电路中的故障的位置,以便测试方法包含故障。

    Bis-indole pyrroles useful as antimicrobials agents
    4.
    发明申请
    Bis-indole pyrroles useful as antimicrobials agents 失效
    双吲哚吡咯可用作抗微生物剂

    公开(公告)号:US20070149601A1

    公开(公告)日:2007-06-28

    申请号:US11602869

    申请日:2006-11-20

    IPC分类号: A61K31/405 C07D403/14

    摘要: Compounds of Formula I, commonly referred to as bis-indole pyrroles, including isolated naturally-occurring compounds, synthetic and semi-synthetic derivatives thereof having antimicrobial properties and to antimicrobial compositions that include one or more of bis-indole pyrroles and their derivatives or analogs having antimicrobial properties are disclosed. Pharmaceutical compositions comprising such compounds and methods of treating bacterial infections with the disclosed compounds or the disclosed pharmaceutical compositions are also disclosed.

    摘要翻译: 通常称为双吲哚吡咯的化合物,包括分离的天然存在的化合物,其具有抗微生物性质的合成和半合成衍生物以及包含一个或多个双吲哚吡咯及其衍生物或类似物的抗微生物组合物 公开了具有抗微生物性质。 还公开了包含这些化合物的药物组合物和用所公开的化合物或所公开的药物组合物治疗细菌感染的方法。

    System and method for detecting soft-fails
    7.
    发明授权
    System and method for detecting soft-fails 有权
    检测软故障的系统和方法

    公开(公告)号:US08339155B2

    公开(公告)日:2012-12-25

    申请号:US12857270

    申请日:2010-08-16

    IPC分类号: H03K19/00 H03K19/23

    CPC分类号: H03K19/23 G01R31/31816

    摘要: A system and method for detecting soft-failures in integrated circuits is provided. A circuit includes a combinatorial logic block having a first signal input and a second signal input, and a latch coupled to an output of the combinatorial logic block. The combinatorial logic block produces a pulse when only one of either a first signal provided by the first signal input or a second signal provided by the second signal input is a logical high value, and the latch captures the pulse if the pulse has a pulse width greater than a second threshold. The pulse has a pulse width that is based on a timing difference between a first signal transition on the first signal and a second signal transition on the second signal, the combinatorial logic block produces the pulse if the timing difference is greater than a first threshold, and the combinatorial logic block operates with balanced inputs.

    摘要翻译: 提供一种用于检测集成电路中的软故障的系统和方法。 电路包括具有第一信号输入和第二信号输入的组合逻辑块,以及耦合到组合逻辑块的输出的锁存器。 当仅由第一信号输入提供的第一信号或由第二信号输入提供的第二信号中的一个信号是逻辑高值时,组合逻辑块产生脉冲,并且如果脉冲具有脉冲宽度,则锁存器捕捉脉冲 大于第二阈值。 脉冲具有基于第一信号上的第一信号转换与第二信号上的第二信号转换之间的定时差的脉冲宽度,如果定时差大于第一阈值,组合逻辑块产生脉冲, 并且组合逻辑块通过平衡输入进行操作。

    Apparatus for delivering semiconductor components to a substrate
    10.
    发明授权
    Apparatus for delivering semiconductor components to a substrate 有权
    用于将半导体部件输送到基板的装置

    公开(公告)号:US08590143B2

    公开(公告)日:2013-11-26

    申请号:US13115261

    申请日:2011-05-25

    IPC分类号: B23P19/00

    摘要: An apparatus 200 for delivering semiconductor components 212 to a substrate 206a; 206b; 500a; 500b; 500c during semiconductor package manufacturing. The apparatus 200 comprises a platform 216 and a plurality of delivery modules 202a, 202b affixed to the platform 216. Each of the plurality of delivery modules 202a, 202b has a support device 204a; 204b for supporting the substrate 206a; 206b; 500a; 500b; 500c, as well as a delivery device 208a; 208b for delivering the semiconductor components 212 to the substrate 206a; 206b; 500a; 500b; 500c. In particular, heights of the support devices 204a, 204 are mutually leveled for conveying the substrate 206a; 206b; 500a; 500b; 500c between the plurality of delivery modules 202a, 202b.

    摘要翻译: 用于将半导体部件212输送到基板206a的装置200; 206b; 500a 500b; 500c在半导体封装制造过程中。 装置200包括平台216和固定到平台216的多个传送模块202a,202b。多个传送模块202a,202b中的每一个具有支撑装置204a; 204b,用于支撑基板206a; 206b; 500a; 500b; 500c,以及输送装置208a; 208b,用于将半导体部件212传送到基板206a; 206b; 500a; 500b; 500c。 特别地,支撑装置204a,204的高度相互平齐以输送基板206a; 206b; 500a; 500b; 500c在多个传送模块202a,202b之间。