利索-全球专利检索

  1. 登录
  2. 注册

搜索结果

52 条记录 (耗时 0.028 秒)

    Semiconductor device
    1.
    发明授权
    Semiconductor device 有权
    半导体器件

    公开(公告)号：US08735904B2

    公开(公告)日：2014-05-27

    申请号：US13368662

    申请日：2012-02-08

    申请人： Yi Chang ,  Chia-Hua Chang ,  Yueh-Chin Lin ,  Yu-Kong Chen ,  Ting-En Shie

    发明人： Yi Chang ,  Chia-Hua Chang ,  Yueh-Chin Lin ,  Yu-Kong Chen ,  Ting-En Shie

    IPC分类号： H01L29/15 ,  H01L21/336

    CPC分类号： H01L29/7786 ,  H01L29/2003 ,  H01L29/452

    摘要： A semiconductor device includes a main body made of a GaN-based semiconductor material, and at least one electrode structure. The electrode structure includes an ohmic contact layer that is formed on the main body, a buffer layer that is formed on the ohmic contact layer opposite to the main body, and a circuit layer that is made of a copper-based material and that is formed on the buffer layer opposite to the ohmic contact layer. The ohmic contact layer is made of a material selected from titanium, aluminum, nickel, and alloys thereof. The buffer layer is made of a material different from the material of the ohmic contact layer and selected from titanium, tungsten, titanium nitride, tungsten nitride, and combinations thereof.

    摘要翻译： 半导体器件包括由GaN基半导体材料制成的主体和至少一个电极结构。 电极结构包括形成在主体上的欧姆接触层，形成在与主体相反的欧姆接触层上的缓冲层，以及由铜基材料制成并形成的电路层 在与欧姆接触层相反的缓冲层上。 欧姆接触层由选自钛，铝，镍及其合金的材料制成。 缓冲层由不同于欧姆接触层材料的材料制成，选自钛，钨，氮化钛，氮化钨及其组合。

    Split electrical contacts in an electronic assembly
    3.
    发明授权
    Split electrical contacts in an electronic assembly 有权
    在电子组件中拆分电气触点

    公开(公告)号：US08547707B2

    公开(公告)日：2013-10-01

    申请号：US13551520

    申请日：2012-07-17

    申请人： Kong-Chen Chen

    发明人： Kong-Chen Chen

    IPC分类号： H05K7/00

    CPC分类号： H05K1/145 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10015 ,  H05K2201/10022

    摘要： An electronic device is disclosed for coupling to a target platform, which includes a multitude of pad contacts. The electronic device includes a substrate, a multitude of pad contacts on the substrate, and a multitude of contact regions in one of the of pad contacts on the substrate. Each of the multitude of pad contacts on the substrate electrically couples to a corresponding one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled. The multitude of contact regions corresponds to one of the multitude of pad contacts on the target platform when the substrate and the target platform are assembled.

    摘要翻译： 公开了一种用于耦合到目标平台的电子设备，其包括多个焊盘触点。 电子器件包括衬底，衬底上的多个衬垫触点，以及衬底上的焊盘触点之一中的多个接触区域。 当基板和目标平台组装时，基板上的多个焊盘触点中的每一个电耦合到目标平台上的多个焊盘触点中的相应的一个焊盘触点。 当组装基板和目标平台时，多个接触区域对应于目标平台上的多个焊盘触点中的一个。

    Semiconductor Device
    4.
    发明申请
    Semiconductor Device 有权
    半导体器件

    公开(公告)号：US20120313107A1

    公开(公告)日：2012-12-13

    申请号：US13368662

    申请日：2012-02-08

    申请人： Yi CHANG ,  Chia-Hua CHANG ,  Yueh-Chin LIN ,  Yu-Kong CHEN ,  Ting-En SHIE

    发明人： Yi CHANG ,  Chia-Hua CHANG ,  Yueh-Chin LIN ,  Yu-Kong CHEN ,  Ting-En SHIE

    IPC分类号： H01L29/20

    CPC分类号： H01L29/7786 ,  H01L29/2003 ,  H01L29/452

    摘要： A semiconductor device includes a main body made of a GaN-based semiconductor material, and at least one electrode structure. The electrode structure includes an ohmic contact layer that is formed on the main body, a buffer layer that is formed on the ohmic contact layer opposite to the main body, and a circuit layer that is made of a copper-based material and that is formed on the buffer layer opposite to the ohmic contact layer. The ohmic contact layer is made of a material selected from titanium, aluminum, nickel, and alloys thereof. The buffer layer is made of a material different from the material of the ohmic contact layer and selected from titanium, tungsten, titanium nitride, tungsten nitride, and combinations thereof.

    摘要翻译： 半导体器件包括由GaN基半导体材料制成的主体和至少一个电极结构。 电极结构包括形成在主体上的欧姆接触层，形成在与主体相反的欧姆接触层上的缓冲层，以及由铜基材料制成并形成的电路层 在与欧姆接触层相反的缓冲层上。 欧姆接触层由选自钛，铝，镍及其合金的材料制成。 缓冲层由不同于欧姆接触层材料的材料制成，选自钛，钨，氮化钛，氮化钨及其组合。

    Method of using conductive elastomer for electrical contacts in an assembly
    5.
    发明授权
    Method of using conductive elastomer for electrical contacts in an assembly 失效
    在组件中使用导电弹性体用于电接触的方法

    公开(公告)号：US08254142B2

    公开(公告)日：2012-08-28

    申请号：US12854030

    申请日：2010-08-10

    申请人： Kong-Chen Chen

    发明人： Kong-Chen Chen

    IPC分类号： H01K7/00 ,  H01L23/48

    CPC分类号： H05K1/145 ,  H05K1/023 ,  H05K1/0231 ,  H05K1/0234 ,  H05K3/325 ,  H05K2201/0314 ,  H05K2201/10015 ,  H05K2201/10022

    摘要： A manufacturing method for manufacturing an electronic device is disclosed. Conductive elastomers comprising of various configurations and resistivity are coupled to contact pads of an electronic device. The conductive elastomers are also coupled to substrate contacts on a substrate, allowing the conductive elastomers to function as electrical connection from device to substrate as well as to embed one or more passive components at the contact pads of the electronic device.

    摘要翻译： 公开了一种用于制造电子设备的制造方法。 包括各种结构和电阻率的导电弹性体耦合到电子设备的接触垫。 导电弹性体还耦合到衬底上的衬底触点，允许导电弹性体用作从器件到衬底的电连接，以及在电子器件的接触焊盘处嵌入一个或多个无源部件。

    Integrated DVD/CD controller
    9.
    发明授权
    Integrated DVD/CD controller 有权
    集成DVD / CD控制器

    公开(公告)号：US06466736B1

    公开(公告)日：2002-10-15

    申请号：US09224138

    申请日：1998-12-31

    申请人： Kong-Chen Chen ,  Chris Tsu ,  Wen Hsu

    发明人： Kong-Chen Chen ,  Chris Tsu ,  Wen Hsu

    IPC分类号： H04N591

    CPC分类号： H04N9/8042 ,  G11B20/10 ,  G11B20/14 ,  G11B20/18 ,  H04N5/85

    摘要： A controller architecture optimized for processing audio and video information in playback systems used for reproducing information stored on optical discs such as CDs and DVDs. The controller uses a unique parallel interface to facilitate the transfer of CD data and DVD data from the controller to a MPEG decoder. The controller also performs servo control operations, data processing and error detection and correction operations for CD data and DVD data, and provides shared memory resources for internal operations of the controller. DVD/CD playback systems incorporating the present invention occupy less real estate, have smaller pin counts, are less complex, and are cheaper to manufacture than conventional playback systems.

    摘要翻译： 用于处理用于再现存储在光盘（例如CD和DVD）上的信息的回放系统中的音频和视频信息的控制器架构。 控制器使用独特的并行接口来促进将CD数据和DVD数据从控制器传送到MPEG解码器。 控制器还对CD数据和DVD数据执行伺服控制操作，数据处理和错误检测和纠正操作，并为控制器的内部操作提供共享内存资源。 结合本发明的DVD / CD播放系统占据较少的房地产，具有较小的针数，较不复杂，并且制造成本比常规播放系统便宜。

    APPARATUS AND ARCHITETURE OF NON-VOLATILE MEMORY MODULE IN PARALLEL CONFIGURATION
    10.
    发明申请
    APPARATUS AND ARCHITETURE OF NON-VOLATILE MEMORY MODULE IN PARALLEL CONFIGURATION 有权

    公开(公告)号：US20210132856A1

    公开(公告)日：2021-05-06

    申请号：US17094787

    申请日：2020-11-10

    申请人： Kong-Chen Chen

    发明人： Kong-Chen Chen

    IPC分类号： G06F3/06

    摘要： A non-volatile memory module in parallel architecture is described. It includes memory function and data storage function in a single module. It enables host system to use memory bus to access storage devices and to use the same memory command protocol for storage device access. The parallel architecture enables contents in memory devices and storage devices to be exchanged freely on module under the control of host memory controller to boost performance of computer and to retain data even if power to computer is shut off. The configuration of non-volatile memory module can be partitioned or expanded into multiple independent channels on module seamlessly with or without ECC supports.