公开(公告)号：US09678329B2

公开(公告)日：2017-06-13

申请号：US13624333

申请日：2012-09-21

Applicant: Robert L Holman ,  Kristopher A Lavery ,  Ming-Hau Tung

Inventor： Robert L Holman ,  Kristopher A Lavery ,  Ming-Hau Tung

IPC: G06F15/00 ,  G02B26/00 ,  G02F1/19 ,  G02B5/08 ,  G06F3/044

CPC classification number: G02B26/001 ,  G02B5/08 ,  G02F1/19 ,  G06F3/044 ,  G06F15/00

Abstract: This disclosure provides systems, methods and apparatus for provided masked structures on an embossed substrate. In one aspect, these masked structures may be reflected facets for use as part of a frontlight film. In another aspect, these masked structures may be masked wiring for use as part of a capacitive touchscreen array. In one aspect, the structures may have a discrete mask formed thereon, while in other aspects, these structures may have self-masking attributes, and may include an interferometric black mask.

公开(公告)号：US08410690B2

公开(公告)日：2013-04-02

申请号：US12371302

申请日：2009-02-13

Applicant: Bangalore R. Natarajan ,  Evgeni Gousev ,  Kristopher A. Lavery

Inventor： Bangalore R. Natarajan ,  Evgeni Gousev ,  Kristopher A. Lavery

IPC: B01J20/00

CPC classification number: B01J20/2808 ,  B01D53/261 ,  B01D53/28 ,  B01D2253/108 ,  B01J20/18 ,  B01J20/183 ,  B01J20/2803 ,  B01J2220/42 ,  B81B2201/047 ,  B81C1/00285 ,  B81C2201/112 ,  H01L23/26 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1433 ,  Y10T156/10 ,  H01L2924/00

Abstract: Systems and methods for providing MEMS devices with integrated desiccant are provided. In one embodiment, a dry composition comprising desiccant is impact sprayed onto the backplate or substrate of a MEMS device, and becomes fused with the substrate. In another embodiment, the desiccant is impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet another embodiment, the impact-sprayed surface is impregnated with the desiccant. In still another embodiment, the desiccant is combined with a suitable inorganic binder, then impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet a further embodiment, the desiccant is micronized or pulverized into a powder of desired particle size, and then impact sprayed onto a surface. Thus, the desiccant particles or powder are fused onto the target surface through the impact spraying process.

Abstract translation: 提供了提供MEMS器件集成干燥剂的系统和方法。 在一个实施方案中，将包含干燥剂的干组合物冲击喷射到MEMS装置的背板或基板上，并与基底熔合。 在另一个实施方案中，干燥剂被冲击喷雾，使得干燥剂粘附到冲击喷涂表面上。 在另一个实施例中，冲击喷射表面用干燥剂浸渍。 在另一个实施方案中，将干燥剂与合适的无机粘合剂组合，然后冲洗喷雾，使得干燥剂粘附到冲击喷涂表面。 在又一个实施方案中，干燥剂被微粉化或粉碎成所需粒度的粉末，然后冲击喷涂到表面上。 因此，干燥剂颗粒或粉末通过冲击喷涂工艺熔合到目标表面上。

公开(公告)号：US20120235970A1

公开(公告)日：2012-09-20

申请号：US13052018

申请日：2011-03-18

Applicant: Kristopher A. Lavery ,  Bangalore R. Natarajan

Inventor： Kristopher A. Lavery ,  Bangalore R. Natarajan

IPC: G06F3/038 ,  H05K7/04 ,  B23P19/00 ,  B65D81/26 ,  H05K13/00

CPC classification number: H01L23/26 ,  B81C1/00285 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  Y10T29/49117 ,  Y10T29/49826 ,  H01L2924/00

Abstract: This disclosure provides systems, methods and for providing a desiccant in a MEMS package. A MEMS device may be packaged with a desiccant to provide a moisture-free environment. In order to avoid undesirable effects on the MEMS device, the desiccant may be selected or treated so as to be compatible with a particular MEMS device, for instance, a very thin profile may be desired. A method for covalently bonding zeolite crystals with a substrate is provided such that a layer of zeolite crystals is covalently attached to a substrate surface of the MEMS device package. This bonding includes a change in the chemical structure of the zeolite such that is chemically adhered to the substrate.

Abstract translation: 本公开提供了用于在MEMS封装中提供干燥剂的系统，方法和用途。 MEMS器件可以与干燥剂一起包装以提供无湿度的环境。 为了避免对MEMS器件的不期望的影响，可以选择或处理干燥剂以便与特定的MEMS器件兼容，例如，可能需要非常薄的轮廓。 提供了将沸石晶体与基底共价结合的方法，使得沸石晶体层共价连接到MEMS器件封装的衬底表面。 这种键合包括沸石的化学结构的变化，从而化学附着到基底上。

公开(公告)号：US20140085317A1

公开(公告)日：2014-03-27

申请号：US13629043

申请日：2012-09-27

Applicant: Kristopher A. Lavery ,  David William Burns

Inventor： Kristopher A. Lavery ,  David William Burns

IPC: G06T1/00 ,  H05K7/06 ,  H05K3/00 ,  H05K1/11

CPC classification number: G06T1/00 ,  B81B7/0006 ,  B81C2201/019 ,  B81C2203/032 ,  H05K1/11 ,  H05K1/115 ,  H05K3/0058 ,  H05K7/06 ,  Y10T156/10

Abstract: This disclosure provides systems, methods and apparatus for providing a transparent multilayer structure having electrical connections between conductive components disposed throughout the structure. In one aspect, a thin transparent conductive adhesive is used to provide electrical connections between layers. These electrical connections can be made throughout the multilayer structure, even in portions of the structure that overlie a display in a display device, reducing the overall footprint of a display device including such a multilayer structure.

Abstract translation: 本公开提供了用于提供透明多层结构的系统，方法和装置，其在整个结构中布置的导电部件之间具有电连接。 在一个方面，使用薄的透明导电粘合剂来提供层之间的电连接。 即使在覆盖显示装置中的显示器的结构的部分中，也可以在整个多层结构中进行这些电连接，从而减少了包括这种多层结构的显示装置的整体占地面积。

公开(公告)号：US20130162656A1

公开(公告)日：2013-06-27

申请号：US13624333

申请日：2012-09-21

Applicant: Robert L. Holman ,  Kristopher A. Lavery ,  Ming-Hau Tung

Inventor： Robert L. Holman ,  Kristopher A. Lavery ,  Ming-Hau Tung

IPC: G02F1/19 ,  G06F15/00

CPC classification number: G02B26/001 ,  G02B5/08 ,  G02F1/19 ,  G06F3/044 ,  G06F15/00

Abstract: This disclosure provides systems, methods and apparatus for provided masked structures on an embossed substrate. In one aspect, these masked structures may be reflected facets for use as part of a frontlight film. In another aspect, these masked structures may be masked wiring for use as part of a capacitive touchscreen array. In one aspect, the structures may have a discrete mask formed thereon, while in other aspects, these structures may have self-masking attributes, and may include an interferometric black mask.

Abstract translation: 本公开提供了用于在压花基底上提供掩蔽结构的系统，方法和装置。 在一个方面，这些被掩蔽的结构可以是用作前照光膜的一部分的反射面。 在另一方面，这些掩模结构可以是用作电容式触摸屏阵列的一部分的掩模布线。 在一个方面，结构可以具有形成在其上的离散掩模，而在其它方面，这些结构可以具有自掩蔽属性，并且可以包括干涉式黑色掩模。

公开(公告)号：US20100206629A1

公开(公告)日：2010-08-19

申请号：US12371302

申请日：2009-02-13

Applicant: Bangalore R. Natarajan ,  Evgeni Gousev ,  Kristopher A. Lavery

Inventor： Bangalore R. Natarajan ,  Evgeni Gousev ,  Kristopher A. Lavery

IPC: H05K5/00 ,  B32B37/00 ,  B32B38/00 ,  B32B9/00 ,  B32B17/00 ,  B05D1/02

CPC classification number: B01J20/2808 ,  B01D53/261 ,  B01D53/28 ,  B01D2253/108 ,  B01J20/18 ,  B01J20/183 ,  B01J20/2803 ,  B01J2220/42 ,  B81B2201/047 ,  B81C1/00285 ,  B81C2201/112 ,  H01L23/26 ,  H01L51/5259 ,  H01L2924/0002 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/1433 ,  Y10T156/10 ,  H01L2924/00

Abstract: Systems and methods for providing MEMS devices with integrated desiccant are provided. In one embodiment, a dry composition comprising desiccant is impact sprayed onto the backplate or substrate of a MEMS device, and becomes fused with the substrate. In another embodiment, the desiccant is impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet another embodiment, the impact-sprayed surface is impregnated with the desiccant. In still another embodiment, the desiccant is combined with a suitable inorganic binder, then impact sprayed such that the desiccant adheres to the impact sprayed surface. In yet a further embodiment, the desiccant is micronized or pulverized into a powder of desired particle size, and then impact sprayed onto a surface. Thus, the desiccant particles or powder are fused onto the target surface through the impact spraying process.

Abstract translation: 提供了提供MEMS器件集成干燥剂的系统和方法。 在一个实施方案中，将包含干燥剂的干组合物冲击喷射到MEMS装置的背板或基板上，并与基底熔合。 在另一个实施方案中，干燥剂被冲击喷雾，使得干燥剂粘附到冲击喷涂表面上。 在另一个实施例中，冲击喷射表面用干燥剂浸渍。 在另一个实施方案中，将干燥剂与合适的无机粘合剂组合，然后冲洗喷雾，使得干燥剂粘附到冲击喷涂表面。 在又一个实施方案中，干燥剂被微粉化或粉碎成所需粒度的粉末，然后冲击喷涂到表面上。 因此，干燥剂颗粒或粉末通过冲击喷涂工艺熔合到目标表面上。