Abstract:
An integrally formed multi-layer light-emitting device is provided, which includes a seat, a plurality of light-emitting elements, and two lead frames. The seat is integrally formed in such a manner that the light-emitting elements can fit in the chamber which is formed on the top portion of the central main body. The seat is made of metal, and thereby the seat can effectively absorb heat from the light-emitting elements, and rapidly transmit it to the surrounding environment. Therefore, the packing module is not needed to be used in the present invention so that the consumption of the package material is reduced, and the manufacturing process is simplified.
Abstract:
A multi-layer array type LED device is provided, which includes a substrate, an encapsulation body, two lead frames, a plurality of LED dices, and a set of optical lens. The outer circumferential edge and the upper and lower periphery of the substrate are completely encapsulated by the encapsulation body so that the multi-layer array type LED device can be tightly packaged. In the present invention, a fluorescent layer is disposed between an optical grease layer and a silica gel protection layer, and thereby the fluorescent layer is protected, and is capable of preventing moisture from permeating therein. On the other hand, in the present invention, the reflection coefficient of the optical grease layer is at least larger than a certain value so that the probability of the light emitted out of the optical chamber can be increased.
Abstract:
An integrally formed high-efficient multi-layer light-emitting device is provided, which includes a heat dissipation seat, a plurality of light-emitting dies, and a lead frame. The heat dissipation seat includes a chamber having an accommodating space, and a groove having two inclined inner sidewalls is formed around the periphery of a bottom of the chamber, The groove is very fine so that only very small amounts of the phosphor and silicone are used for filling the groove and covering the light-emitting dies, and thereby the material cost and the manufacturing cost are greatly reduced. The light can be reflected out of the chamber so that the brightness and the evenness of the light output will be improved.
Abstract:
A multi-layer array type LED device having a multi-layer heat dissipation structure includes a heat dissipation seat, an optical module, a housing, a power supply module, a wireless transmission module, a diffusion cover and a lamp head. In the present invention, the heat-generating components include the optical module, the power supply module and the wireless transmission module, and the heat-generating components are separately installed so that the heat accumulation effect can be decreased. In the present invention, the heat dissipation seat is used together with the housing having a plurality of the heat dissipation holes. The heat dissipation seat having excellent heat conductivity is used for rapidly absorbing heat and transferring it to the surrounding environment, and the surrounding air can be introduced into the housing via the heat dissipation holes for further increasing the heat dissipation efficiency.
Abstract:
A package structure of multi-layer array type LED device is disclosed, wherein a peripheral area of a substrate and a surface of lead frame are respectively installed with a convex/concave surface structure. The convex/concave surface structure increases the surface roughness of the peripheral area of the substrate and the surface of the lead frame, so a liquid package material can be filled in cavities and concave parts; thus a package member formed through the package material being solidified can be firmly combined with the substrate and the lead frame as one piece. In addition, the bottom of a lens is provided with a binder for increasing the sealing level of the lens. Moreover, the present invention adopted a soldering paste added with material having good heat conductivity, so heat generated by LED dices can be rapidly dissipated to the exterior.
Abstract:
An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
Abstract:
An optical lens having a fluorescent layer is provided. The optical lens is adapted for being employed in an LED packaging structure. The optical lens includes a substrate, at least one lens body, a lens shade, and a packaging member. The substrate is positioned at a bottommost side of the packaging structure, and the lens shade is positioned at a topmost side of the packaging structure. The lens body is positioned over the substrate and beneath the lens shade. A plurality of light emitting units are disposed on the substrate. The packaging member is adapted for packaging the substrate and the lens shade. The lens body is secured by the packing member so as to be positioned over the light emitting units. The lens body includes a fluorescent layer buried inside the lens body, and the lens body is positioned apart from the light emitting units for a certain distance.
Abstract:
A method for manufacturing an integrally formed multi-layer light-emitting device is provided, in which a seat is integrally formed in such a manner that the light-emitting elements can be directly disposed in the chamber. The lens mask is used to seal the light-emitting elements in the chamber of the seat so that some packaging steps can be omitted, and the manufacturing process is simplified. The seat is made of metal having good thermal conductivity instead of plastic materials. The consumption of the package material is reduced, and the heat-dissipation efficiency is increased in the present invention.
Abstract:
An integrated multi-layered illuminating unit and an integrated multi-layered illuminating assembling unit are provided in the disclosure. The illuminating unit provided in the present invention can be adapted to different purposes and locations of use through a flexible number of heat dissipating bases used and adaptable assembling methods, in other words, the present invention provides an illuminating unit which can be assembled into specific forms depending on different applications and purposes. The illuminating unit and can provide various irradiation intensity and rage, wherein the heat dissipating bases are connected and assembled with each other through connecting members with an easy, fast and convenient method, thus the illuminating unit provided is very time and effort saving regarding its production and maintenance.
Abstract:
A multi-layer array type LED device is provided, which includes a substrate, an encapsulation body, two lead frames, a plurality of LED dices, and a set of optical lens. The outer circumferential edge and the upper and lower periphery of the substrate are completely encapsulated by the encapsulation body so that the multi-layer array type LED device can be tightly packaged. In the present invention, a fluorescent layer is disposed between an optical grease layer and a silica gel protection layer, and thereby the fluorescent layer is protected, and is capable of preventing moisture from permeating therein. On the other hand, in the present invention, the reflection coefficient of the optical grease layer is at least larger than a certain value so that the probability of the light emitted out of the optical chamber can be increased.