公开(公告)号：US4630095A

公开(公告)日：1986-12-16

申请号：US626200

申请日：1984-06-29

申请人： Kanji Otsuka ,  Kunizou Sahara ,  Masao Sekibata ,  Kazumichi Mitsusada ,  Katsumi Ogiue

发明人： Kanji Otsuka ,  Kunizou Sahara ,  Masao Sekibata ,  Kazumichi Mitsusada ,  Katsumi Ogiue

IPC分类号： H01L23/02 ,  H01L23/057 ,  H01L23/26 ,  H01L23/31 ,  H01L23/556 ,  H01L23/10 ,  H01L23/04 ,  H01L23/16 ,  H01L23/30

CPC分类号： H01L23/26 ,  H01L23/057 ,  H01L23/3157 ,  H01L23/3171 ,  H01L23/556 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2224/8592 ,  H01L24/45 ,  H01L24/48 ,  H01L2924/0102 ,  H01L2924/01039 ,  H01L2924/01046 ,  H01L2924/01079 ,  H01L2924/01322 ,  H01L2924/09701 ,  H01L2924/12044 ,  H01L2924/15153 ,  H01L2924/15165 ,  H01L2924/16152 ,  H01L2924/1617 ,  H01L2924/16195 ,  H01L2924/3025

摘要： A packaged semiconductor device structure includes a semiconductor chip with an organic material covering thereon. The semiconductor chip is placed in a package and hermetically sealed with a low melting point glass. The organic covering serve to suppress undesirable influence on the semiconductor chip by .alpha.-rays which may be radiated from the package, and a getter material is placed in the package for decreasing undesirable gases in the package which may be emitted by the organic covering during the sealing process.

摘要翻译： 封装的半导体器件结构包括其上覆盖有机材料的半导体芯片。 将半导体芯片放置在封装中并用低熔点玻璃密封。 有机覆盖物用于通过可以从封装辐射的α-射线来抑制对半导体芯片的不期望的影响，并且将吸气剂材料放置在包装中以减少包装中的不期望的气体，这可能由有机覆盖物在 密封过程。