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公开(公告)号：US20060110678A1
公开(公告)日：2006-05-25
申请号：US10997701
申请日：2004-11-23
IPC分类号： G03C1/76
CPC分类号： H05K3/287 , G03F7/037 , Y10S430/106 , Y10S430/117 , Y10S430/127
摘要： The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
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2.发明申请Low temperature cure polyimide compositions resistant to arc tracking and methods relating thereto 有权耐电弧追踪的低温固化聚酰亚胺组合物及其相关方法公开(公告)号：US20070154726A1
公开(公告)日：2007-07-05
申请号：US11322586
申请日：2005-12-30
CPC分类号： H05K1/0346 , C08G73/10 , C08G73/1042 , C08G73/106 , C08G73/1064 , C08G73/1071 , Y10T428/31681
摘要： The polyimides of the present invention are derived from aliphatic diamines and show advantageous arc tracking performance (i.e., low arc tracking). These polyimides can be cured at low temperatures making them suitable as coverlay compositions in electronic circuitry. In addition, these polyimides are soluble and excellent in heat resistance and adhesion properties, showing a low dielectric constant even at 10 GHz or more.
摘要翻译： 本发明的聚酰亚胺衍生自脂肪族二胺，具有良好的电弧跟踪性能（即低电弧跟踪）。 这些聚酰亚胺可以在低温下固化，使它们适合作为电子电路中的覆盖物组合物。 此外，这些聚酰亚胺是可溶的，耐热性和粘附性优异，即使在10GHz以上也表现出低的介电常数。
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3.发明授权Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto 有权具有至少两个不同的聚酰亚胺层的多层基材，可用于电子学应用，以及与其相关的组合物公开(公告)号：US07285321B2
公开(公告)日：2007-10-23
申请号：US10706000
申请日：2003-11-12
CPC分类号： B32B27/281 , B32B7/02 , B32B15/08 , B32B27/08 , B32B27/34 , B32B2250/40 , C08G73/1042 , C08G73/1082 , C09J179/08 , H01L2924/0002 , H05K1/0346 , H05K1/036 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/31721 , H01L2924/00
摘要： The present invention relates to a multi-layer laminate having a low glass transition temperature polyimide layer, a high glass transition temperature polyimide layer, and a conductive layer.The low glass transition temperature polyimide layer is synthesized by contacting an aromatic dianhydride with a diamine component, the diamine component comprising about 50 to about 90 mole % aliphatic diamine (the remainder being aromatic diamine) having the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16. The low glass transition polyimide is an adhesive and has a glass transition temperature in the range of from 150° C. to 200° C.The high glass transition temperature polyimide layer has a glass transition temperature above the low glass transition temperature polyimide layer and is a thermoset polyimide.A multi-layer-layer substrate of the present invention has the high glass transition temperature polyimide layer positioned between the conductive layer and the low glass transition polyimide, or optionally contains an additional low glass transition temperature polyimide positioned between the conductive layer and the high glass transition polyimide layer.
摘要翻译： 本发明涉及具有低玻璃化转变温度聚酰亚胺层，高玻璃化转变温度聚酰亚胺层和导电层的多层层压体。 通过使芳族二酐与二胺组分接触来合成低玻璃化转变温度聚酰亚胺层，二胺组分包含具有结构式H 2 2的约50至约90摩尔％的脂族二胺（余量为芳族二胺） 其中R是C 4〜C 16的烃。 低玻璃化转变聚酰亚胺是粘合剂并且玻璃化转变温度在150℃至200℃的范围内。高玻璃化转变温度聚酰亚胺层的玻璃化转变温度高于低玻璃化转变温度聚酰亚胺层，并且是 热固性聚酰亚胺。 本发明的多层基板具有位于导电层和低玻璃化转变聚酰亚胺之间的高玻璃化转变温度聚酰亚胺层，或任选地包含位于导电层和高玻璃之间的额外的低玻璃化转变温度聚酰亚胺 过渡聚酰亚胺层。
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4.发明申请Multilayer substrates having at least two dissimilar polyimide layers, useful for electronics-type applications, and compositions relating thereto 有权具有至少两个不同的聚酰亚胺层的多层基材，可用于电子学应用，以及与其相关的组合物公开(公告)号：US20050100719A1
公开(公告)日：2005-05-12
申请号：US10706000
申请日：2003-11-12
IPC分类号： B32B15/08 , B32B27/34 , C08G73/10 , C09D179/08 , C09J179/08 , H01L23/14 , H05K1/00 , H05K1/03 , H05K3/38 , H05K3/46 , B32B7/00
CPC分类号： B32B27/281 , B32B7/02 , B32B15/08 , B32B27/08 , B32B27/34 , B32B2250/40 , C08G73/1042 , C08G73/1082 , C09J179/08 , H01L2924/0002 , H05K1/0346 , H05K1/036 , H05K3/4626 , H05K2201/0154 , H05K2201/0195 , Y10T428/24917 , Y10T428/31721 , H01L2924/00
摘要： The present invention relates to a multi-layer laminate having a low glass transition temperature polyimide layer, a high glass transition temperature polyimide layer, and a conductive layer. The low glass transition temperature polyimide layer is synthesized by contacting an aromatic dianhydride with a diamine component, the diamine component comprising about 50 to about 90 mole % aliphatic diamine (the remainder being aromatic diamine) having the structural formula H2N—R—NH2 wherein R is hydrocarbon from C4 to C16. The low glass transition polyimide is an adhesive and has a glass transition temperature in the range of from 150° C. to 200° C. The high glass transition temperature polyimide layer has a glass transition temperature above the low glass transition temperature polyimide layer and is a thermoset polyimide. A multi-layer-layer substrate of the present invention has the high glass transition temperature polyimide layer positioned between the conductive layer and the low glass transition polyimide, or optionally contains an additional low glass transition temperature polyimide positioned between the conductive layer and the high glass transition polyimide layer.
摘要翻译： 本发明涉及具有低玻璃化转变温度聚酰亚胺层，高玻璃化转变温度聚酰亚胺层和导电层的多层层压体。 通过使芳族二酐与二胺组分接触来合成低玻璃化转变温度聚酰亚胺层，二胺组分包含具有结构式H 2 2的约50至约90摩尔％的脂族二胺（余量为芳族二胺） 其中R是C 4〜C 16的烃。 低玻璃化转变聚酰亚胺是粘合剂并且玻璃化转变温度在150℃至200℃的范围内。高玻璃化转变温度聚酰亚胺层的玻璃化转变温度高于低玻璃化转变温度聚酰亚胺层，并且是 热固性聚酰亚胺。 本发明的多层基板具有位于导电层和低玻璃化转变聚酰亚胺之间的高玻璃化转变温度聚酰亚胺层，或任选地包含位于导电层和高玻璃之间的额外的低玻璃化转变温度聚酰亚胺 过渡聚酰亚胺层。
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公开(公告)号：US20060110679A1
公开(公告)日：2006-05-25
申请号：US11271267
申请日：2005-11-10
IPC分类号： G03C1/76
CPC分类号： H05K3/287 , G03F7/037 , Y10S430/106 , Y10S430/117 , Y10S430/127
摘要： The invention relates to low-temperature curable photosensitive compositions containing a polyamic acid, which compositions are developable in aqueous alkaline solutions and are curable, at a temperature of at least 160° C. and up to 200° C., to low modulus polyimides suitable for use in electronic circuitry applications, and which are particularly suitable for use in flexible circuit applications where low curl, low temperature curing, and good adhesion is a significant advantage.
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6.发明申请Flame-retardant halogen-free polyimide films useful as thermal insulation in aircraft applications and methods relating thereto 审中-公开用作飞机应用中的隔热材料的阻燃无卤素聚酰亚胺膜及其相关方法公开(公告)号：US20060019102A1
公开(公告)日：2006-01-26
申请号：US10899460
申请日：2004-07-26
CPC分类号： C08K5/34928 , C08J5/18 , C08J2379/08 , C08L79/08 , Y10T428/31551 , C08L85/00
摘要： Flame-retardant, thin gauge polyimide films are disclosed which are generally useful in lightweight, aircraft thermal insulation, or similar type applications. These films contain additives having a nitrogen-containing condensed phosphoric acid compound where the additive component is present in a thin polyimide dry film at a weight ratio of about 3 to 15 weight percent. The thickness of these flame-retarding, thin polyimide films is between 8 and 45 microns. These films have a flame retardancy rating that meets or exceeds national standards according either UL 94 Thin Material Vertical Burning Test 94VTM-0, UL 94 Thin Material Vertical Burning Test 94VTM-1 or UL 94 Thin Material Vertical Burning Test 94VTM-2.
摘要翻译： 公开了阻燃型薄规格聚酰亚胺膜，其通常可用于轻质，飞机保温或类似类型的应用。 这些膜含有具有含氮缩合磷酸化合物的添加剂，其中添加剂组分以约3至15重量％的重量比存在于薄聚酰亚胺干燥膜中。 这些阻燃薄的聚酰亚胺膜的厚度在8和45微米之间。 这些膜的阻燃等级符合或超过国家标准UL 94薄材料垂直燃烧试验94VTM-0，UL 94薄材料垂直燃烧试验94VTM-1或UL 94薄材料垂直燃烧试验94VTM-2。
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