公开(公告)号：US20050224924A1

公开(公告)日：2005-10-13

申请号：US10811857

申请日：2004-03-30

Applicant: Kwang Koh ,  Song Kim ,  Sang Park

Inventor： Kwang Koh ,  Song Kim ,  Sang Park

IPC: H01L23/31 ,  H01L23/495

CPC classification number: H01L24/48 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

Abstract: A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a range of 10 to 20 mils. The semiconductor device is electrically coupled to one of the leads. A package body is formed over the semiconductor device and the leads in a manner that the lower surfaces of the die pad and the leads are exposed through the package body. Preferably, the first semiconductor device is electrically coupled to one of the leads by at least one heavy gauge aluminum wire. The present invention further provides a method of producing the semiconductor package described above.

Abstract translation: 无引线半导体封装主要包括通过焊膏牢固地附接到管芯焊盘的上表面的半导体器件和围绕管芯焊盘的周边布置的多个引线。 引线和芯片焊盘的厚度在10至20密耳的范围内。 半导体器件电耦合到引线之一。 在半导体器件和引线上形成封装体，使得芯片焊盘和引线的下表面通过封装主体露出。 优选地，第一半导体器件通过至少一个大规格铝线电耦合到引线之一。 本发明还提供了一种制造上述半导体封装的方法。

公开(公告)号：US20060223238A1

公开(公告)日：2006-10-05

申请号：US11416102

申请日：2006-05-03

Applicant: Kwang Koh ,  Song Kim ,  Sang Park

Inventor： Kwang Koh ,  Song Kim ,  Sang Park

IPC: H01L21/00

CPC classification number: H01L24/48 ,  H01L23/3107 ,  H01L23/4952 ,  H01L23/49548 ,  H01L23/49562 ,  H01L23/49575 ,  H01L24/40 ,  H01L24/45 ,  H01L24/49 ,  H01L24/73 ,  H01L2224/05552 ,  H01L2224/05554 ,  H01L2224/05639 ,  H01L2224/0603 ,  H01L2224/32245 ,  H01L2224/40091 ,  H01L2224/40247 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2224/48247 ,  H01L2224/48472 ,  H01L2224/48599 ,  H01L2224/48699 ,  H01L2224/4903 ,  H01L2224/49051 ,  H01L2224/73221 ,  H01L2224/73265 ,  H01L2224/83801 ,  H01L2224/8385 ,  H01L2224/85205 ,  H01L2924/00014 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01028 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01051 ,  H01L2924/01076 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/01083 ,  H01L2924/014 ,  H01L2924/14 ,  H01L2924/181 ,  H01L2924/3011 ,  H01L2924/00 ,  H01L2924/00012 ,  H01L2224/85399

Abstract: A leadless semiconductor package mainly includes a semiconductor device securely attached to an upper surface of a die pad by solder paste and a plurality of leads arranged about the periphery of the die pad. The thickness of the leads and the die pad are within a range of 10 to 20 mils. The semiconductor device is electrically coupled to one of the leads. A package body is formed over the semiconductor device and the leads in a manner that the lower surfaces of the die pad and the leads are exposed through the package body. Preferably, the first semiconductor device is electrically coupled to one of the leads by at least one heavy gauge aluminum wire. The present invention further provides a method of producing the semiconductor package described above.

Abstract translation: 无引线半导体封装主要包括通过焊膏牢固地附接到管芯焊盘的上表面的半导体器件和围绕管芯焊盘的周边布置的多个引线。 引线和芯片焊盘的厚度在10至20密耳的范围内。 半导体器件电耦合到引线之一。 在半导体器件和引线上形成封装体，使得芯片焊盘和引线的下表面通过封装主体露出。 优选地，第一半导体器件通过至少一个大规格铝线电耦合到引线之一。 本发明还提供了一种制造上述半导体封装的方法。

公开(公告)号：US20050198104A1

公开(公告)日：2005-09-08

申请号：US11044557

申请日：2005-01-27

Applicant: Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

Inventor： Oh Kwon ,  Jae Hahm ,  Sang Kim ,  Jong Lee ,  Hyung Park ,  Kyung Park ,  Shin Kim ,  Kwang Koh

IPC: G06F15/163 ,  G06F15/16

CPC classification number: G06F9/5072

Abstract: Disclosed is a file-based grid MPI job allocation system for a middleware-based grid computing system in which computers having a plurality of resources including an MPI program are distributed and connected to each other through a network, wherein the grid MPI job allocation system differentiates functions of a middleware and the MPI program, thereby achieving MPI initialization without intervention of a separate arbitration process. The job submission service module generates a file containing an address, a port number, etc. of each node, which are necessary for the MPI initialization, and sends the file to the job execution service module of the corresponding node. Each job execution service module executes the MPI job, and the MPI program waits for the generation of the file and then performs initialization by using the information in the file. The present invention clearly differentiates the jobs to be done by the MPI program and by the job submission service module in the middleware, thereby enabling the MPI program to be executed in the grid computing system regardless of the design of the middleware.

Abstract translation: 公开了一种用于基于中间件的网格计算系统的基于文件的网格MPI作业分配系统，其中包括MPI程序的多个资源的计算机通过网络分布并彼此连接，其中网格MPI作业分配系统区分 中间件和MPI程序的功能，从而实现MPI初始化，而不需要单独的仲裁过程。 作业提交服务模块生成包含MPI初始化所需的每个节点的地址，端口号等的文件，并将该文件发送到相应节点的作业执行服务模块。 每个作业执行服务模块执行MPI作业，并且MPI程序等待文件的生成，然后使用文件中的信息执行初始化。 本发明明确区分由MPI程序和作业提交服务模块在中间件中完成的作业，从而使得能够在网格计算系统中执行MPI程序，而不管中间件的设计如何。