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    METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES
    1.
    发明申请
    METHOD OF DIE BONDING ONTO DISPENSED ADHESIVES 审中-公开
    将其粘合在分散的粘合剂上的方法

    公开(公告)号：US20120094440A1

    公开(公告)日：2012-04-19

    申请号：US12905413

    申请日：2010-10-15

    申请人： Kwok Kee CHUNG ,  Kui Kam LAM ,  Yen Hsi TANG ,  Kwok Kiu CHAN

    发明人： Kwok Kee CHUNG ,  Kui Kam LAM ,  Yen Hsi TANG ,  Kwok Kiu CHAN

    IPC分类号： H01L21/50

    CPC分类号： H01L24/83 ,  H01L24/27 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/2731 ,  H01L2224/2919 ,  H01L2224/83121 ,  H01L2224/83192 ,  H01L2224/838 ,  H01L2924/01033 ,  H01L2924/01082 ,  H01L2924/0665 ,  H01L2924/00

    摘要： A method of bonding semiconductor dice onto a substrate first uses an optical assembly to perform pattern recognition of a die bonding section of the substrate in which multiple die pads are located so as to identify positions of the multiple die pads simultaneously during such pattern recognition step. After pattern recognition of the said die bonding section, an adhesive is dispensed with an adhesive dispenser onto at least one of the die pads located in the die bonding section. While the adhesive dispenser is dispensing the adhesive to further die pads located in the die bonding section, a pick-and-place arm concurrently bonds a die onto each die pad where the adhesive has already been dispensed.

    摘要翻译： 将半导体晶片接合到基板上的方法首先使用光学组件来执行其中存在多个管芯焊盘的衬底的管芯接合部分的图案识别，以便在这种图案识别步骤期间同时识别多个管芯焊盘的位置。 在所述芯片接合部分的图案识别之后，将粘合剂分配到位于芯片接合部分中的至少一个芯片焊盘上。 当粘合剂分配器将粘合剂分配到位于管芯接合部分中的另外的管芯焊盘时，拾取和放置臂同时将管芯粘合到已经分配粘合剂的每个管芯焊盘上。

    Vision system for positioning a bonding tool
    2.
    发明授权
    Vision system for positioning a bonding tool 有权
    用于定位焊接工具的视觉系统

    公开(公告)号：US07810698B2

    公开(公告)日：2010-10-12

    申请号：US12274410

    申请日：2008-11-20

    申请人： Kwok Kee Chung ,  Wing Hong Leung ,  Ka Fai Fung ,  Chi Leung Vincent Mok ,  Shun Ming Kenneth Fung

    发明人： Kwok Kee Chung ,  Wing Hong Leung ,  Ka Fai Fung ,  Chi Leung Vincent Mok ,  Shun Ming Kenneth Fung

    IPC分类号： B23K20/00 ,  B23K37/00

    CPC分类号： G05B19/4015 ,  G05B2219/37559 ,  G05B2219/45033 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.

    摘要翻译： 用于在接合操作期间校正接合工具的位置偏移的装置包括与位于接合工具上的第一基准标记间隔开的第一基准标记和第二基准标记。 当第一和第二基准标记在参考位置被照亮时，第一成像路径从第一基准标记发出并且第二成像路径从第二基准标记发出。 沿着第一和第二成像路径定位光学系统以观看第一和第二基准标记的图像。 处理器可操作以计算接合工具的当前位置并将其与期望位置进行比较，使得可以通过将接合工具的位置偏移移动到期望位置来校正接合工具的位置偏移。

    Automatic level adjustment for die bonder
    4.
    发明授权
    Automatic level adjustment for die bonder 有权
    芯片焊接机的自动电平调整

    公开(公告)号：US08293043B2

    公开(公告)日：2012-10-23

    申请号：US11459503

    申请日：2006-07-24

    申请人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

    发明人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

    IPC分类号： B32B37/00

    CPC分类号： H01L24/83 ,  H01L22/26 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

    摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

    摘要翻译： 提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。 接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。 接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。 提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。

    AUTOMATIC LEVEL ADJUSTMENT FOR DIE BONDER
    5.
    发明申请
    AUTOMATIC LEVEL ADJUSTMENT FOR DIE BONDER 有权
    DIE BONDER自动调整水平

    公开(公告)号：US20080017293A1

    公开(公告)日：2008-01-24

    申请号：US11459503

    申请日：2006-07-24

    申请人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

    发明人： Kwok Kee Chung ,  Kui Kam Lam ,  Chi Keung Leung ,  Wai Yuen Cheung

    IPC分类号： B32B37/00

    CPC分类号： H01L24/83 ,  H01L22/26 ,  H01L24/29 ,  H01L24/75 ,  H01L2224/29101 ,  H01L2224/2919 ,  H01L2224/83 ,  H01L2224/83801 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01075 ,  H01L2924/01082 ,  H01L2924/01322 ,  H01L2924/014 ,  H01L2924/0665 ,  H01L2924/14 ,  H01L2924/00

    摘要： A die bonding apparatus and method is provided to automatically adjust a level of a die bonder to compensate for any physical changes occurring in the die bonder during bonding. A bond arm support is drivable to a bonding level to position a die onto a bonding surface, and a bond arm is slidably mounted to the bond arm support for holding and bonding the die. The bond arm is configured to be urged by the bonding surface to move relative to the bond arm support upon contact of the die onto the bonding surface. A measuring device is provided for determining a distance moved by the bond arm relative to the bond arm support during bonding, and a controller is responsive to the distance determined by the measuring device to change the bonding level to which the bond arm support is driven.

    摘要翻译： 提供管芯接合装置和方法来自动调节管芯接合器的水平以补偿在接合期间在管芯接合器中发生的任何物理变化。 接合臂支撑件可驱动到结合水平以将模具定位到接合表面上，并且接合臂可滑动地安装到接合臂支撑件以保持和接合模具。 接合臂被配置为当接合到接合表面时被接合表面推动以相对于接合臂支撑件移动。 提供测量装置，用于确定在接合期间由接合臂相对于接合臂支撑件移动的距离，并且控制器响应于由测量装置确定的距离，以改变键合臂支撑件被驱动到的结合水平。

    VISION SYSTEM FOR POSITIONING A BONDING TOOL
    7.
    发明申请
    VISION SYSTEM FOR POSITIONING A BONDING TOOL 有权
    用于定位连接工具的视觉系统

    公开(公告)号：US20100125348A1

    公开(公告)日：2010-05-20

    申请号：US12274410

    申请日：2008-11-20

    申请人： Kwok Kee CHUNG ,  Wing Hong LEUNG ,  Ka Fai FUNG ,  Chi Leung Vincent MOK ,  Shun Ming Kenneth FUNG

    发明人： Kwok Kee CHUNG ,  Wing Hong LEUNG ,  Ka Fai FUNG ,  Chi Leung Vincent MOK ,  Shun Ming Kenneth FUNG

    IPC分类号： G05B19/18 ,  G01B11/14

    CPC分类号： G05B19/4015 ,  G05B2219/37559 ,  G05B2219/45033 ,  H01L2924/0002 ,  H01L2924/00

    摘要： An apparatus for correcting a positional offset of a bonding tool during bonding operations comprises a first fiducial mark and a second fiducial mark spaced from the first fiducial mark located on the bonding tool. A first imaging path emanates from the first fiducial mark and a second imaging path emanates from the second fiducial mark when the first and second fiducial marks are illuminated at a reference position. An optical system is positioned along the first and second imaging paths to view images of the first and second fiducial marks. A processor is operative to calculate a current position of the bonding tool and to compare it to a desired position so that the bonding tool's positional offset may be corrected by moving it to the desired position.

    摘要翻译： 用于在接合操作期间校正接合工具的位置偏移的装置包括与位于接合工具上的第一基准标记间隔开的第一基准标记和第二基准标记。 当第一和第二基准标记在参考位置被照亮时，第一成像路径从第一基准标记发出，而第二成像路径从第二基准标记发出。 沿着第一和第二成像路径定位光学系统以观看第一和第二基准标记的图像。 处理器可操作以计算接合工具的当前位置并将其与期望位置进行比较，使得可以通过将接合工具的位置偏移移动到期望位置来校正接合工具的位置偏移。