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公开(公告)号：US09578795B2
公开(公告)日：2017-02-21
申请号：US14621876
申请日：2015-02-13
发明人： Lei Zhang , Ming-Tong Wang
CPC分类号： H05K13/0486 , B23K1/0008 , B23K1/018 , B32B38/10 , B32B43/006 , H05K3/22 , H05K2203/178 , Y10T156/1153 , Y10T156/1158 , Y10T156/1168 , Y10T156/1911 , Y10T156/1917
摘要： A method for extracting components includes the steps of heating an electronic device having one or more components to a predetermined temperature so as to substantially weaken a bonding substance arranged to bond the one or more components to the electronic device, and thereafter manipulating the electronic device to extract the one or more components from the electronic device.
摘要翻译： 一种用于提取部件的方法包括以下步骤：将具有一个或多个部件的电子设备加热到预定温度，以便基本上削弱布置成将一个或多个部件结合到电子设备上的粘合物质，然后将电子设备操作到 从电子设备中提取一个或多个组件。
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公开(公告)号：US09913420B2
公开(公告)日：2018-03-06
申请号：US14418248
申请日：2014-01-29
发明人： Lei Zhang , Ming-Tong Wang
CPC分类号： H05K13/0486 , B23K1/018 , B23K3/08 , B23K3/087 , H05K13/04 , Y10T29/49819 , Y10T29/49822 , Y10T29/53274
摘要： A method for extracting electronic components comprising the steps of heating an electronic device having one or more electronic components by delivering heat energy to the electronic device directly to a first side surface or a second side surface of the electronic device and disturbing the electronic device to separate the one or more electronic components from the electronic device.
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