Apparatus for electrical and optical interconnection
    1.
    发明授权
    Apparatus for electrical and optical interconnection 有权
    用于电气和光学互连的设备

    公开(公告)号:US07660128B2

    公开(公告)日:2010-02-09

    申请号:US10955876

    申请日:2004-09-30

    IPC分类号: H05K1/18

    摘要: A circuit package includes a circuit substrate having a cutout portion defined therein, an interconnect electrically coupled to the circuit substrate and an active circuit component disposed off the circuit substrate within the cutout portion and electrically coupled to the interconnect. An optical circuit includes a lead frame and an optical component electrically coupled to the lead frame. The lead frame includes a first lead portion at a first level having an upper surface and a lower surface, and a second lead portion at a second level lower than the first level and electrically connected to the first lead portion. The lower surface of the first lead portion is arranged to electrically connect to a surface of a circuit substrate. The second lead portion includes an upper surface and a lower surface. The optical component is disposed on the upper surface of the second lead portion.

    摘要翻译: 电路封装包括具有限定在其中的切口部分的电路基板,电耦合到电路基板的互连和在切除部分内设置在电路基板之外的电连接到互连的有源电路部件。 光学电路包括引线框架和电耦合到引线框架的光学部件。 引线框架包括具有上表面和下表面的第一级的第一引线部分和低于第一级别的第二级别的电连接到第一引线部分的第二引线部分。 第一引线部分的下表面被布置成电连接到电路基板的表面。 第二引线部分包括上表面和下表面。 光学部件设置在第二引线部分的上表面上。

    Transceiver for LC connector
    3.
    发明授权
    Transceiver for LC connector 有权
    LC连接器收发器

    公开(公告)号:US06860649B2

    公开(公告)日:2005-03-01

    申请号:US10034792

    申请日:2001-12-27

    IPC分类号: G02B6/42

    摘要: A testable optical subassembly comprising a unitary structure of an optically-clear moldable material having at least the following features: (a) an optical path for transmitting optical signals between a fiber and an optoelectric device (OED); (b) a ferrule-receiving bore for receiving a ferrule and aligning a fiber held therein to the optical path; and (c) an OED-receiving cavity for receiving a lead frame and aligning an OED mounted thereon to the optical path along one or more axes.

    摘要翻译: 一种可测试的光学子组件,其包括至少具有以下特征的光学透明可模制材料的整体结构:(a)用于在光纤和光电装置(OED)之间传输光信号的光路; (b)用于接收套圈并将其中保持的光纤对准光路的套圈容纳孔; 和(c)用于接收引线框架并将其上安装的OED与沿着一个或多个轴线的光路对准的OED接收腔。

    Parallel fiber optics communications module

    公开(公告)号:US06739760B2

    公开(公告)日:2004-05-25

    申请号:US09954130

    申请日:2001-09-17

    IPC分类号: G02B636

    CPC分类号: G02B6/4292 G02B6/425

    摘要: An optoelectronic subassembly for use in fiber optic communications systems where multiple parallel optical fibers are used in transmitting and receiving optical signals. The subassembly is adapted for optically connecting with a ferrule and electrically connecting to a larger computing or communications system. The ferrule supports a set of optical communications fibers disposed in an array. The subassembly supports an optoelectronic device having a set of photoactive components also disposed in an array corresponding to the fiber array. The optoelectronic device is operative for either converting photonic signals to electrical signals (in a receiver) or electrical signals to photonic signals (in a transmitter). The optoelectronic subassembly includes a carrier which is precisely fabricated using photolithography techniques for aligning and supporting the optoelectronic device and photoactive components within it. The carrier further includes a precisely positioned alignment structure for cooperating with the optical ferrule to align the photoactive components of the optoelectronic device with the fibers in the ferrule when the two are interconnected. Also, the carrier may include a thin film layer and one or more alignment marks applied to the film layer for use in accurately mounting the optoelectronic device on the carrier.

    Transceiver assembly for use in fiber optics communications
    8.
    发明授权
    Transceiver assembly for use in fiber optics communications 失效
    用于光纤通信的收发器组件

    公开(公告)号:US07073954B1

    公开(公告)日:2006-07-11

    申请号:US11366852

    申请日:2006-03-02

    IPC分类号: G02B6/36

    摘要: A frame section includes a flex circuit layer, a support layer, and a silicon substrate carrier. The flex circuit layer includes a plurality of communication lines and having a flex circuit window section. The support layer includes a support layer window smaller that the flex circuit window section so as to define an inwardly extending support shelf. The silicon substrate carrier is mounted on the support shelf in the support layer window and includes an optoelectronic device supported on the silicon substrate carrier. The optoelectronic device includes a set of photoactive components. The frame section is used for supporting the optoelectronic device within a fiber optic transceiver assembly which in turn is used for connecting to a fiber optic ferrule supporting a set of fiber optic communication fibers.

    摘要翻译: 框架部分包括柔性电路层,支撑层和硅衬底载体。 柔性电路层包括多条通信线路,并具有柔性电路窗口部分。 支撑层包括较小的柔性电路窗口部分以便限定向内延伸的支撑架的支撑层窗口。 硅衬底载体安装在支撑层窗口中的支撑架上,并且包括支撑在硅衬底载体上的光电器件。 光电子器件包括一组光敏元件。 框架部分用于支撑光纤收发器组件内的光电子器件,光纤收发器组件又用于连接到支持一组光纤通信光纤的光纤套圈。

    Transceiver assembly for use in fiber optics communications

    公开(公告)号:US07056032B2

    公开(公告)日:2006-06-06

    申请号:US09954133

    申请日:2001-09-17

    IPC分类号: G02B6/36

    摘要: A transceiver assembly for use in fiber optic communications systems where multiple optical fibers are used in transmitting and receiving optical signals. The assembly is adapted for being mechanically and optically connected with a ferrule supporting a set of optical communications fibers. The transceiver assembly supports an optoelectronic device having a corresponding set of photoactive components which are operative for either converting photonic signals to electrical signals (in a receiver) or converting electrical signals to photonic signals (in a transmitter). The transceiver assembly includes a frame section having a carrier which is precisely fabricated for supporting the optoelectronic device and includes an alignment structure for cooperating with the optical ferrule to align the photoactive components with the fibers in the ferrule. The frame section is part of a larger carrier assembly including a multilayer circuit board which may include a microcontroller chip, an edge connector for electrically connecting with a computer or communications system and a flex circuit which provides communications lines linking the frame section, circuit board and edge connector.