公开(公告)号：US20090046392A1

公开(公告)日：2009-02-19

申请号：US11898558

申请日：2007-09-13

申请人： JianFeng Xu ,  YanChu Xu ,  LingJun Kong ,  LiXin Wu ,  Thao Nguyen

发明人： JianFeng Xu ,  YanChu Xu ,  LingJun Kong ,  LiXin Wu ,  Thao Nguyen

IPC分类号： G11B5/55

CPC分类号： G11B5/4806 ,  G11B5/5521

摘要： A voice coil motor for a hard disk drive includes an inner core having an inner surface, an outer plate having an inner surface, a permanent magnet, and a coil of wire. The outer plate is positioned in spaced relation to the inner core such that a gap is defined between the inner surfaces of the inner core and the outer plate. The permanent magnet is located in the gap and attached to the inner surface of the outer plate. The coil of wire wraps around the inner core to form a solenoid coil. With such structure, the stiffness of the coil is increased. The invention also discloses a disk drive with such VCM in which the coil is directly bonded to the E-block of the hard disk drive. Therefore heat conduction of the hard disk drive is improved.

摘要翻译： 用于硬盘驱动器的音圈电动机包括具有内表面的内芯，具有内表面的外板，永磁体和线圈。 外板与内芯间隔开，从而在内芯和外板的内表面之间形成间隙。 永磁体位于间隙中并附着在外板的内表面上。 线圈卷绕在内芯上以形成电磁线圈。 通过这种结构，线圈的刚度增加。 本发明还公开了一种具有这种VCM的盘驱动器，其中线圈直接接合到硬盘驱动器的E块。 因此，提高了硬盘驱动器的热传导。

公开(公告)号：US20080111237A1

公开(公告)日：2008-05-15

申请号：US11559495

申请日：2006-11-14

申请人： Montray Cantrell Leavy ,  Jeffrey Alan West ,  Kyle James McPherson ,  Richard Allen Faust ,  Lixin Wu

发明人： Montray Cantrell Leavy ,  Jeffrey Alan West ,  Kyle James McPherson ,  Richard Allen Faust ,  Lixin Wu

IPC分类号： H01L23/52 ,  H01L21/4763

CPC分类号： H01L23/53238 ,  C25D3/38 ,  C25D5/02 ,  C25D5/10 ,  C25D7/123 ,  H01L21/2885 ,  H01L21/76873 ,  H01L21/76877 ,  H01L2924/0002 ,  H01L2924/00

摘要： A method of manufacturing a semiconductor device that comprises forming an insulating layer over a semiconductive substrate 110 and forming a copper interconnect. Forming the interconnect includes etching an interconnect opening in the insulating layer and filling the opening with copper plating. Filling with copper plating includes using a first and second ECD. An electrolyte solution of the first and second ECD contains organic additives, and a current of the first ECD is greater than a current of the second ECD.

摘要翻译： 一种制造半导体器件的方法，包括在半导体衬底110上形成绝缘层并形成铜互连。 形成互连包括蚀刻绝缘层中的互连开口并用铜电镀填充开口。 填充镀铜包括使用第一和第二ECD。 第一和第二ECD的电解质溶液含有有机添加剂，并且第一ECD的电流大于第二ECD的电流。

公开(公告)号：US20160310913A1

公开(公告)日：2016-10-27

申请号：US14849616

申请日：2015-09-10

申请人： Lixin Wu ,  Liang Yue ,  Shan Wang ,  Bao Li

发明人： Lixin Wu ,  Liang Yue ,  Shan Wang ,  Bao Li

IPC分类号： B01D71/80 ,  C08B37/16

CPC分类号： B01D71/80 ,  B01D2325/04 ,  C08B37/0015 ,  C08G83/007 ,  C08G83/008

摘要： The disclosure regards to the porous materials, concerning a flexible 2D single-layer supramolecular polymer and its application in precise nano size separation. It comprises the synthesis of a bolaform cationic molecule, preparation of a cationic bridging stick, a flexible 2D single-layer supramolecular polymer and supramolecular polymer membrane, and the application of the membrane in precise nano-size separation. A synergetic ionic self-assembly approach which is facile, convenient and based on the ionic bond without preferential direction is used to construct a flexible 2D single-layer supramolecular polymer. Furthermore, its distinctive properties such as uniform nanoporous structure and flexibility offer an unprecedented opportunity to fabricate ultrafiltration membrane towards precise nanosize separation.

摘要翻译： 本发明涉及多孔材料，涉及柔性2D单层超分子聚合物及其在精确纳米尺寸分离中的应用。 它包括合成阳离子阳离子分子，制备阳离子桥接棒，柔性2D单层超分子聚合物和超分子聚合物膜，以及膜在精确纳米尺寸分离中的应用。 使用易于，方便，基于没有优先方向的离子键的协同离子自组装方法构建柔性2D单层超分子聚合物。 此外，其独特的性质如均匀的纳米孔结构和柔性提供了前所未有的机会，以制造超滤膜，以实现精确的纳米级分离。

公开(公告)号：US06667231B1

公开(公告)日：2003-12-23

申请号：US10195006

申请日：2002-07-12

申请人： Lixin Wu

发明人： Lixin Wu

IPC分类号： H01L214763

CPC分类号： H01L21/76843 ,  H01L21/2855 ,  H01L21/76808 ,  H01L21/76814

摘要： An integrated circuit structure and method of making the same is disclosed, in which the adhesion of copper conductors (12, 22) to a low-dielectric constant insulating layer (10, 16) is improved. During the fabrication of the structure, exposed surfaces of the low-k insulating layers (10, 16), including the surfaces of these layers within contact, via, or trench openings, are exposed to nitrogen gas, preferably in a sputtering chamber. An optional plasma treatment of the insulating layers (10, 16) in the presence of nitrogen gas may also be performed. As a result, the surface portions of the insulating layers (10, 16) is made to be nitrogen-rich. A liner layer (8, 21) is then formed by reactive sputtering of tantalum nitride over the nitrogen-rich surfaces of the insulating layers (10, 16), followed by the sputtering of tantalum. Copper electrodes (12, 22) are then deposited into the openings in the corresponding insulating layers (10, 16) with improved adhesion resulting.

摘要翻译： 公开了一种集成电路结构及其制造方法，其中铜导体（12,22）对低介电常数绝缘层（10,16）的粘附性得到改善。 在制造结构期间，包括这些层在接触，通孔或沟槽开口中的表面的低k绝缘层（10,16）的暴露表面暴露于氮气，优选在溅射室中。 还可以在氮气存在下对绝缘层（10,16）进行任选的等离子体处理。 结果，使绝缘层（10,16）的表面部分富氮。 然后通过在绝缘层（10,16）的富氮表面上的氮化钽的反应溅射形成衬垫层（8,21），随后溅射钽。 然后将铜电极（12,22）沉积到相应的绝缘层（10,16）中的开口中，具有改善的粘附力。

公开(公告)号：US06303517B1

公开(公告)日：2001-10-16

申请号：US09361793

申请日：1999-07-27

申请人： Changfeng Xia ,  Lixin Wu

发明人： Changfeng Xia ,  Lixin Wu

IPC分类号： C23C1600

CPC分类号： C23C16/345 ,  C23C16/402 ,  C23C16/46 ,  C23C16/54

摘要： An apparatus and method for depositing thin films on the surface of a device such as a spherical shaped devices. The apparatus includes an enclosure containing a plurality of apertures and a conductor coil. The apertures connect to conduits for inputting and outputting the devices as well as injecting and releasing different gases and/or processing constituents. A chamber is formed within the enclosure and is configured to be coaxial with the conductor coil. Devices move through the input conduit where they are preheated by a resistance-type furnace. The preheated devices then move into the chamber where chemical precursors are added and the devices are further heated to a predefined temperature associated with the chemical precursors by radio frequency energy from the conductor coil. At this time, the gases and/or processing constituents react with the heated device thereby growing a thin film on its outer surface.

摘要翻译： 一种用于在诸如球形装置的装置的表面上沉积薄膜的装置和方法。 该装置包括包含多个孔和外壳的外壳。 孔连接到用于输入和输出装置的管道，以及注入和释放不同气体和/或处理成分。 腔室形成在外壳内并被构造成与导体线圈同轴。 设备移动通过输入导管，在那里它们被电阻型炉预热。 然后，预热的装置移动到其中添加化学前体的室中，并且通过来自导体线圈的射频能量将装置进一步加热到与化学前体相关联的预定温度。 此时，气体和/或处理成分与加热的装置反应，从而在其外表面上生长薄膜。