Abstract:
An ion implantation apparatus is disclosed in this invention. The ion implantation apparatus includes a target chamber for containing a target for implantation and an ion source chamber includes an ion source with a mass filter for generating an ion beam with certain mass and original energy. The ion source chamber further includes beam deceleration optics for decelerating the ion beam from the original energy to the desired final energy. The ion beam apparatus is able to accurately direct low energy ions to a target wafer. The beam deceleration optics further includes a plurality of electrodes for generating an electric field for spreading the charged ion beam over an angular range to accurately control the trajectory paths of ions of different energy levels. The purpose is to eliminate the energy contamination by more accurately controlling the energy range of the charged ions that reach the target for implantation and to block the neutralized particle and ions of higher energy from reaching the target for implantation.
Abstract:
An implanter is equipped with an ion beam current detector, a temperature sensor, a temperature controller and a cooling system to increase the ratio of a specific ion cluster in the ion source chamber of the implanter. Therefore, the implanting efficiency for a shallow ion implantation is increased consequently.
Abstract:
An implanter is equipped with an ion beam current detector, a temperature sensor, a temperature controller and a cooling system to increase the ratio of a specific ion cluster in the ion source chamber of the implanter. Therefore, the implanting efficiency for a shallow ion implantation is increased consequently.
Abstract:
An apparatus for ion beam neutralization is disclosed in this invention. The apparatus is a plasma flood source with an arc discharge chamber enclosed in a source housing with sufficient cooling so that the housing temperature is near room temperature. Arc discharge between a filament and the arc chamber ionizes the bleeding gas atoms or molecules in the arc chamber and produces plasma. The low energy electrons together with ions in the plasma drift out of the arc chamber and neutralize the passing ion beam. The sufficiently cooled source housing prevents radiation to the processed wafers, reduces metal particle concentration in the plasma and therefore metal contamination on the wafers, and keeps beamline pressure low while more electrons are extracted from the flood source through the apertures with larger area.