公开(公告)号：US06464122B1

公开(公告)日：2002-10-15

申请号：US09645595

申请日：2000-08-25

申请人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

发明人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

IPC分类号： B23K3700

CPC分类号： B23K1/06 ,  B23K35/262 ,  B23K2101/40

摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

摘要翻译： 公开了一种用于焊接基材的方法和装置。 制备基本上由锡和可与锡形成共晶合金并且不含铅的金属组成的二元焊料。 其他金属成分的含量为0.1重量％以下，氧含量为100ppm以下。 二元焊料在非氧化环境中熔化，并在氧含量为2,000ppm以下的气氛中分配到基材，以用二元焊料来焊接基材。 焊接装置包括用于向基材提供频率为15KHz至1MHz的振荡波能量的振荡器。 焊接装置也可以以焊接喷嘴或烙铁的形式实现。

公开(公告)号：US6123248A

公开(公告)日：2000-09-26

申请号：US99522

申请日：1998-06-18

申请人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

发明人： Masahiro Tadauchi ,  Makoto Gonda ,  Yoshiyuki Goto ,  Tomiaki Furuya ,  Kouichi Teshima ,  Izuru Komatsu ,  Takeshi Gotanda

IPC分类号： B23K1/06 ,  B23K3/04 ,  B23K31/02 ,  B23K35/26 ,  C22C13/00 ,  H05K3/34 ,  B23K20/10 ,  B23K35/38

CPC分类号： B23K1/06 ,  B23K35/262 ,  B23K2201/40

摘要： Disclosed is a method and an apparatus for soldering a base material. A binary solder essentially consisting of tin and a metal which can form an eutectic alloy with tin and which is exclusive of lead is prepared. The content of other metallic components is 0.1% by weight or less and the content of oxygen is 100 ppm or less. The binary solder is melted in a non-oxidizing environment and dispensed to the base material in an atmosphere in which the oxygen content is 2,000 ppm or less, to solder the base material with the binary solder. The soldering apparatus comprises an oscillator for supplying oscillatory wave energy having frequency of 15 KHz to 1 MHz to the base material. The soldering apparatus can also be realized in the form of a soldering nozzle or a soldering iron.

公开(公告)号：US20100103699A1

公开(公告)日：2010-04-29

申请号：US12603223

申请日：2009-10-21

申请人： Makoto GONDA ,  Mitsuru Uchiyama ,  Satoshi Sasaki ,  Hirofumi Ishizeki

发明人： Makoto GONDA ,  Mitsuru Uchiyama ,  Satoshi Sasaki ,  Hirofumi Ishizeki

IPC分类号： F21V7/04 ,  C09K19/00 ,  B29D11/00

CPC分类号： G02B6/0065 ,  G02B6/0036 ,  G02B6/0083 ,  G02B6/0085 ,  Y10T428/105

摘要： The invention provides a light guide panel that improves luminance and reduces uneven luminance and color aberration. The light guide panel of the invention may be formed by irradiating laser light from a laser light source to the surface of an acrylic resin plate made of polymethylmethacrylate whose weight-average molecular weight is 10,000 to 100,000 or of a copolymer of 90 to 99.9% by weight of methyl methacrylate and 0.1 to 10% by weight of acrylic ester and whose weight-average molecular weight is 1,000 to 100,000 to form a light scattering pattern including a large number of concave portions each of which also includes a large number of micro-concavities and convexities therein.

摘要翻译： 本发明提供一种改善亮度并减少不均匀亮度和色差的导光板。 本发明的导光板可以通过将来自激光光源的激光照射到重均分子量为10,000〜100,000的聚甲基丙烯酸甲酯的丙烯酸树脂板的表面或90〜99.9％的共聚物的表面上，通过 重量的甲基丙烯酸甲酯和0.1至10重量％的丙烯酸酯，并且其重均分子量为1,000至100,000，以形成包括大量凹部的光散射图案，每个凹部还包括大量的微凹部 和凸度。