公开(公告)号：US07021836B2

公开(公告)日：2006-04-04

申请号：US09749282

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Richard F. Carson ,  Robert P. Bryan ,  Edwin B. Duckett, III ,  Shanalyn Adair Kemme ,  Frederick B. McCormick ,  David W. Peterson

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Richard F. Carson ,  Robert P. Bryan ,  Edwin B. Duckett, III ,  Shanalyn Adair Kemme ,  Frederick B. McCormick ,  David W. Peterson

IPC分类号： G02B6/42

CPC分类号： G02B6/3885 ,  G02B6/3881 ,  G02B6/4214 ,  G02B6/4228 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2924/01039 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/12041 ,  H01L2924/3025 ,  H05K1/189 ,  H01L2924/00014

摘要： An apparatus and method of attenuating and/or conditioning optical energy for an optical transmitter, receiver or transceiver module is disclosed. An apparatus for attenuating the optical output of an optoelectronic connector including: a mounting surface; an array of optoelectronic devices having at least a first end; an array of optical elements having at least a first end; the first end of the array of optical elements optically aligned with the first end of the array of optoelectronic devices; an optical path extending from the first end of the array of optoelectronic devices and ending at a second end of the array of optical elements; and an attenuator in the optical path for attenuating the optical energy emitted from the array of optoelectronic devices. Alternatively, a conditioner may be adapted in the optical path for conditioning the optical energy emitted from the array of optoelectronic devices.

摘要翻译： 公开了用于光发射机，接收机或收发器模块的衰减和/或调节光能的装置和方法。 一种用于衰减光电连接器的光输出的装置，包括：安装表面; 具有至少第一端的光电器件的阵列; 具有至少第一端的光学元件阵列; 光学元件阵列的第一端与光电子器件阵列的第一端光学对准; 从所述光电子器件阵列的第一端延伸并且终止于所述光学元件阵列的第二端的光路; 以及用于衰减从光电子器件阵列发射的光能的光路中的衰减器。 或者，可以在光路中调节调节器，用于调节从光电子器件阵列发射的光能。

公开(公告)号：US06867377B2

公开(公告)日：2005-03-15

申请号：US09749281

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Robert P. Bryan ,  Richard F. Carson ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  David W. Peterson ,  Gary D. Peterson ,  Bill H. Reysen

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Robert P. Bryan ,  Richard F. Carson ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  David W. Peterson ,  Gary D. Peterson ,  Bill H. Reysen

IPC分类号： G02B6/26 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42 ,  H05K1/18 ,  H05K1/00

CPC分类号： H05K1/189 ,  G02B6/266 ,  G02B6/3885 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4219 ,  G02B6/4221 ,  G02B6/4227 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/4253 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00

摘要： This invention relates to a flexible printed circuit board that is used in connection with an optical transmitter, receiver or transceiver module. In one embodiment, the flexible printed circuit board has flexible metal layers in between flexible insulating layers, and the circuit board comprises: (1) a main body region orientated in a first direction having at least one electrical or optoelectronic device; (2) a plurality of electrical contact pads integrated into the main body region, where the electrical contact pads function to connect the flexible printed circuit board to an external environment; (3) a buckle region extending from one end of the main body region; and (4) a head region extending from one end of the buckle region, and where the head region is orientated so that it is at an angle relative to the direction of the main body region. The electrical contact pads may be ball grid arrays, solder balls or land-grid arrays, and they function to connect the circuit board to an external environment. A driver or amplifier chip may be adapted to the head region of the flexible printed circuit board. In another embodiment, a heat spreader passes along a surface of the head region of the flexible printed circuit board, and a window is formed in the head region of the flexible printed circuit board. Optoelectronic devices are adapted to the head spreader in such a manner that they are accessible through the window in the flexible printed circuit board.

摘要翻译： 本发明涉及一种与光发射器，接收器或收发器模块结合使用的柔性印刷电路板。 在一个实施例中，柔性印刷电路板在柔性绝缘层之间具有柔性金属层，并且电路板包括：（1）沿第一方向定向的主体区域，具有至少一个电子或光电子器件; （2）集成到主体区域中的多个电接触焊盘，其中电接触焊盘用于将柔性印刷电路板连接到外部环境; （3）从主体区域的一端延伸的带扣区域; 以及（4）从所述带扣区域的一端延伸的头部区域，并且所述头部区域被定向成使得其相对于所述主体区域的方向成一角度。 电接触焊盘可以是球栅阵列，焊球或焊盘阵列，并且它们用于将电路板连接到外部环境。 驱动器或放大器芯片可适用于柔性印刷电路板的头部区域。 在另一个实施例中，散热器沿柔性印刷电路板的头部区域的表面通过，并且窗口形成在柔性印刷电路板的头部区域中。 光电子器件以这样的方式适用于头吊架，使得它们可通过柔性印刷电路板中的窗口接近。

公开(公告)号：US06799902B2

公开(公告)日：2004-10-05

申请号：US09749283

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Johnny R. F. Baca ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  David W. Peterson ,  Gary D. Peterson ,  Cathleen A. Reber ,  Bill H. Reysen

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Johnny R. F. Baca ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  David W. Peterson ,  Gary D. Peterson ,  Cathleen A. Reber ,  Bill H. Reysen

IPC分类号： G02B636

CPC分类号： G02B6/4239 ,  G02B6/266 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4221 ,  G02B6/4224 ,  G02B6/4227 ,  G02B6/4253 ,  G02B6/4269 ,  G02B6/4277 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286 ,  G02B6/4292 ,  H01L2224/48091 ,  H01L2224/48137 ,  H01L2924/3025 ,  H01L2924/00014 ,  H01L2924/00

摘要： An optoelectronic mounting structure is provided that may be used in conjunction with an optical transmitter, receiver or transceiver module. The mounting structure may be a flexible printed circuit board. Thermal vias or heat pipes in the head region may transmit heat from the mounting structure to the heat spreader. The heat spreader may provide mechanical rigidity or stiffness to the heat region. In another embodiment, an electrical contact and ground plane may pass along a surface of the head region so as to provide an electrical contact path to the optoelectronic devices and limit electromagnetic interference. In yet another embodiment, a window may be formed in the head region of the mounting structure so as to provide access to the heat spreader. Optoelectronic devices may be adapted to the heat spreader in such a manner that the devices are accessible through the window in the mounting structure.

摘要翻译： 提供了可以与光发射器，接收器或收发器模块结合使用的光电安装结构。 安装结构可以是柔性印刷电路板。 头部区域中的热通孔或热管可以将热量从安装结构传递到散热器。 散热器可以为热区域提供机械刚度或刚度。 在另一个实施例中，电触点和接地平面可以沿着头部区域的表面通过，以便提供到光电子器件的电接触路径并限制电磁干扰。 在另一个实施例中，可以在安装结构的头部区域中形成窗口，以便提供对散热器的通路。 光电子器件可以以这样的方式适应于散热器，使得器件可通过安装结构中的窗口接近。

公开(公告)号：US06905260B2

公开(公告)日：2005-06-14

申请号：US09749287

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Rachel Knudsen Giunta ,  Robert T. Mitchell ,  Frederick B. McCormick ,  David W. Peterson ,  Merideth A. Rising ,  Cathleen A. Reber ,  Bill H. Reysen

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Robert P. Bryan ,  Richard F. Carson ,  Dahwey Chu ,  Edwin B. Duckett, III ,  Rachel Knudsen Giunta ,  Robert T. Mitchell ,  Frederick B. McCormick ,  David W. Peterson ,  Merideth A. Rising ,  Cathleen A. Reber ,  Bill H. Reysen

IPC分类号： G02B6/26 ,  G02B6/36 ,  G02B6/38 ,  G02B6/42

CPC分类号： G02B6/4277 ,  G02B6/266 ,  G02B6/3885 ,  G02B6/4201 ,  G02B6/4204 ,  G02B6/4206 ,  G02B6/4207 ,  G02B6/421 ,  G02B6/4212 ,  G02B6/4219 ,  G02B6/4227 ,  G02B6/4239 ,  G02B6/4249 ,  G02B6/426 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286

摘要： A process is provided for aligning and connecting at least one optical fiber to at least one optoelectronic device so as to couple light between at least one optical fiber and at least one optoelectronic device. One embodiment of this process comprises the following steps: (1) holding at least one optical element close to at least one optoelectronic device, at least one optical element having at least a first end; (2) aligning at least one optical element with at least one optoelectronic device; (3) depositing a first non-opaque material on a first end of at least one optoelectronic device; and (4) bringing the first end of at least one optical element proximate to the first end of at least one optoelectronic device in such a manner that the first non-opaque material contacts the first end of at least one optoelectronic device and the first end of at least one optical element. The optical element may be an optical fiber, and the optoelectronic device may be a vertical cavity surface emitting laser. The first non-opaque material may be a UV optical adhesive that provides an optical path and mechanical stability. In another embodiment of the alignment process, the first end of at least one optical element is brought proximate to the first end of at least one optoelectronic device in such a manner that an interstitial space exists between the first end of at least one optoelectronic device and the first end of at least one optical element.

摘要翻译： 提供了一种用于将至少一根光纤对准和连接到至少一个光电器件的工艺，以便在至少一个光纤与至少一个光电器件之间耦合光。 该方法的一个实施例包括以下步骤：（1）保持靠近至少一个光电子器件的至少一个光学元件，至少一个具有至少第一端的光学元件; （2）将至少一个光学元件与至少一个光电器件对准; （3）在至少一个光电器件的第一端上沉积第一不透明材料; 和（4）使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得第一不透明材料接触至少一个光电器件的第一端，而第一端 的至少一个光学元件。 光学元件可以是光纤，并且光电子器件可以是垂直腔表面发射激光器。 第一不透明材料可以是提供光路和机械稳定性的UV光学粘合剂。 在对准过程的另一实施例中，使至少一个光学元件的第一端靠近至少一个光电子器件的第一端，使得在至少一个光电器件的第一端和 至少一个光学元件的第一端。

公开(公告)号：US06863444B2

公开(公告)日：2005-03-08

申请号：US09749285

申请日：2000-12-26

申请人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Johnny R.F. Baca ,  Robert P. Bryan ,  Richard F. Carson ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  Gregory V. Miller ,  David W. Peterson ,  Terrance T. Smith

发明人： Gene R. Anderson ,  Marcelino G. Armendariz ,  Johnny R.F. Baca ,  Robert P. Bryan ,  Richard F. Carson ,  Edwin B. Duckett, III ,  Frederick B. McCormick ,  Gregory V. Miller ,  David W. Peterson ,  Terrance T. Smith

IPC分类号： G02B6/42 ,  H05K1/18 ,  G02B6/36

CPC分类号： G02B6/4277 ,  G02B6/421 ,  G02B6/4249 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/4283 ,  G02B6/4286 ,  G02B6/4292 ,  H05K1/189

摘要： This invention relates to an optical transmitter, receiver or transceiver module, and more particularly, to an apparatus for connecting a first optical connector to a second optical connector. The apparatus comprises: (1) a housing having at least a first end and at least a second end, the first end of the housing capable of receiving the first optical connector, and the second end of the housing capable of receiving the second optical connector; (2) a longitudinal cavity extending from the first end of the housing to the second end of the housing; and (3) an electromagnetic shield comprising at least a portion of the housing. This invention also relates to an apparatus for housing a flexible printed circuit board, and this apparatus comprises: (1) a mounting structure having at least a first surface and a second surface; (2) alignment ridges along the first and second surfaces of the mounting structure, the alignment ridges functioning to align and secure a flexible printed circuit board that is wrapped around and attached to the first and second surfaces of the mounting structure; and (3) a series of heat sink ridges adapted to the mounting structure, the heat sink ridges functioning to dissipate heat that is generated from the flexible printed circuit board.

摘要翻译： 本发明涉及一种光发射器，接收器或收发器模块，更具体地，涉及一种用于将第一光学连接器连接到第二光学连接器的装置。 所述装置包括：（1）具有至少第一端和至少第二端的壳体，所述壳体的第一端能够接收第一光学连接器，并且壳体的第二端能够接收第二光学连接器 ; （2）从壳体的第一端延伸到壳体的第二端的纵向腔; 和（3）包括壳体的至少一部分的电磁屏蔽。 本发明还涉及一种用于容纳柔性印刷电路板的装置，该装置包括：（1）至少具有第一表面和第二表面的安装结构; （2）沿着安装结构的第一和第二表面的对准脊，对准脊起到对准和固定柔性印刷电路板的作用，所述柔性印刷电路板缠绕并附接到安装结构的第一和第二表面; 和（3）适于安装结构的一系列散热脊，散热脊用于散发由柔性印刷电路板产生的热量。

公开(公告)号：US5790730A

公开(公告)日：1998-08-04

申请号：US336902

申请日：1994-11-10

申请人： Stanley H. Kravitz ,  G. Ronald Hadley ,  Mial E. Warren ,  Richard F. Carson ,  Marcelino G. Armendariz

发明人： Stanley H. Kravitz ,  G. Ronald Hadley ,  Mial E. Warren ,  Richard F. Carson ,  Marcelino G. Armendariz

IPC分类号： G02B6/12 ,  G02B6/30 ,  G02B6/36

CPC分类号： G02B6/30 ,  G02B2006/12102 ,  G02B2006/12107

摘要： A structure and method for packaging an integrated optic circuit. The package comprises a first wall having a plurality of microlenses formed therein to establish channels of optical communication with an integrated optic circuit within the package. A first registration pattern is provided on an inside surface of one of the walls of the package for alignment and attachment of the integrated optic circuit. The package in one embodiment may further comprise a fiber holder for aligning and attaching a plurality of optical fibers to the package and extending the channels of optical communication to the fibers outside the package. In another embodiment, a fiber holder may be used to hold the fibers and align the fibers to the package. The fiber holder may be detachably connected to the package.

摘要翻译： 一种用于封装集成光电路的结构和方法。 封装包括第一壁，其具有形成在其中的多个微透镜，以建立与封装内的集成光电路的光通信通道。 在封装的一个壁的内表面上提供第一配准图案，用于对齐和附接集成光电路。 在一个实施例中的包装可以进一步包括纤维保持器，用于将多个光纤对准和附​​接到包装并且将光通信通道延伸到包装外部的纤维。 在另一个实施例中，纤维保持器可用于保持纤维并使纤维对准包装。 纤维保持器可以可拆卸地连接到包装。