公开(公告)号：US20050078376A1

公开(公告)日：2005-04-14

申请号：US10993305

申请日：2004-11-19

Applicant: Dinesh Gupta ,  Brenda Peterson ,  Mark Pierson ,  Eugen Schenfeld ,  Subhash Shinde

Inventor： Dinesh Gupta ,  Brenda Peterson ,  Mark Pierson ,  Eugen Schenfeld ,  Subhash Shinde

IPC: G02B6/28 ,  G02B6/35 ,  G02B6/42 ,  G02B6/43 ,  G02B27/10 ,  H01L23/10 ,  H01L23/34

CPC classification number: G02B6/3522 ,  G02B6/2817 ,  G02B6/3544 ,  G02B6/3574 ,  G02B6/3598 ,  G02B6/4214 ,  G02B6/4244 ,  G02B6/4245 ,  G02B6/4246 ,  G02B6/4249 ,  G02B6/4259 ,  G02B6/4269 ,  G02B6/4281 ,  G02B6/43 ,  H01L2924/0002 ,  H01L2924/00

Abstract: Optical cubes and optical cube assemblies for directing optical beams are provided. The optical cubes are optically transparent modules that can be adapted to reflect, transmit, and/or partially reflect and transmit optical beams. The optical cubes may include bi-direction or multi-direction beam directing elements for directing optical beams. The optical cube assemblies may include flexible chip assemblies attached to optical cubes. The chip assemblies may include vertical cavity surface-emitting lasers for emitting optical beams or receivers for receiving optical beams mounted on a flexible and electrical interconnect mounting assembly.

Abstract translation: 提供用于引导光束的光学立方体和光学立方体组件。 光学立方体是可以适于反射，透射和/或部分地反射和透射光束的光学透明模块。 光学立方体可以包括用于引导光束的双向或多方向光束引导元件。 光学立方体组件可以包括附接到光学立方体的柔性芯片组件。 芯片组件可以包括用于发射光束的垂直腔表面发射激光器或用于接收安装在柔性和电互连安装组件上的光束的接收器。

公开(公告)号：US20070065894A1

公开(公告)日：2007-03-22

申请号：US11526147

申请日：2006-09-21

Applicant: Andrew Croteau ,  Mark Pierson ,  David Townsend ,  Ali Naqui

Inventor： Andrew Croteau ,  Mark Pierson ,  David Townsend ,  Ali Naqui

IPC: C12Q1/34 ,  C12M3/00

CPC classification number: B01L3/5088 ,  B01L3/5085 ,  B01L3/50853 ,  B01L2300/0803 ,  C12M23/12 ,  C12M23/20 ,  C12M23/22 ,  C12M23/38 ,  C12M25/14 ,  C12M35/08 ,  C12M37/00 ,  C12M41/36 ,  C12Q1/24

Abstract: Methods for the detection and/or quantification of a biological material in a sample. The method includes the steps of liquefying the sample (if necessary) and pouring the liquefied sample into the incubation vessel. The incubation vessel has a generally flat horizontal surface and the surface is divided into at least one incubation site. Each incubation site is adapted to hold an aliquot of liquid and is sized and shaped, and formed of a suitable material, to hold the aliquot within the well by surface tension. Any excess liquid from the liquefied sample is poured from the surface of the incubation vessel. The method then involves incubating that incubation vessel until the presence or absence of the biological material is determined. The presence of air bubbles can be dramatically reduced by the presence of a surface acting agent in the liquid sample deposited on the device surface. Such an agent can be added to the sterile diluent used to prepare the test reagent, can be separately added to the test reagent after it is prepared, or can be added to the test sample directly while it is being prepared for testing.

Abstract translation: 用于检测和/或定量样品中生物材料的方法。 该方法包括如下步骤：将样品液化（如有必要）并将液化的样品倒入培养容器中。 培养容器具有大致平坦的水平表面，并且将表面分成至少一个孵育位点。 每个孵化位点适于保持液体的等分试样，并且其尺寸和形状由合适的材料形成，以通过表面张力将等分试样保持在孔内。 从培养容器的表面倒出来自液化样品的任何多余的液体。 然后，该方法包括孵育该培养容器，直到确定生物材料的存在或不存在。 通过在沉积在器件表面上的液体样品中存在表面作用剂，可以显着降低气泡的存在。 可以将这样的试剂加入用于制备测试试剂的无菌稀释剂中，可以在制备试剂后分别添加到试验试剂中，或者可以在制备试剂时直接加入试验样品中。

公开(公告)号：US20050238541A1

公开(公告)日：2005-10-27

申请号：US11002599

申请日：2004-12-02

Applicant: Stanislaw Barski ,  Joseph Chiapperi ,  Mark Deacon ,  Mark Dumont ,  Mark Pierson ,  Timothy Keegan ,  Mark Loeser ,  Gerald Meiler ,  Ross Goldman ,  Carl Rich ,  Richard Versluys

Inventor： Stanislaw Barski ,  Joseph Chiapperi ,  Mark Deacon ,  Mark Dumont ,  Mark Pierson ,  Timothy Keegan ,  Mark Loeser ,  Gerald Meiler ,  Ross Goldman ,  Carl Rich ,  Richard Versluys

IPC: B01L9/00 ,  G01N33/543 ,  G01N35/00 ,  B01L3/00

CPC classification number: B01L9/52 ,  B01L2200/025 ,  B01L2300/0822 ,  G01N33/54386 ,  G01N35/00029 ,  G01N2035/00039 ,  G01N2035/00089 ,  G01N2035/00138

Abstract: A retaining clip for retaining reagent test slides in a stacked arrangement includes a first assembly having a first cover plate and at least two parallel, co-planar rails extending transversely from an inner surface of the first cover plate. A second assembly includes a second cover plate, and a rail receiving platform extending transversely from an inner surface of the second cover plate. The first cover plate and the second cover plate define between them a space for receiving the plurality of reagent test slides. The rails of the first assembly include ratchet teeth, and the rail receiving platform of the second assembly includes pawls. The pawls engage the ratchet teeth to prevent the separation of the first assembly and the second assembly and to securely but removably hold the plurality of reagent test slides in a stacked arrangement between the first and second cover plates.

Abstract translation: 用于保持试剂测试滑块的保持夹具堆叠布置包括具有第一盖板的第一组件和从第一盖板的内表面横向延伸的至少两个平行的共平面轨道。 第二组件包括第二盖板和从第二盖板的内表面横向延伸的导轨接收平台。 第一盖板和第二盖板在它们之间限定用于容纳多个试剂试验片的空间。 第一组件的轨道包括棘齿，并且第二组件的轨道接收平台包括棘爪。 棘爪接合棘齿以防止第一组件和第二组件的分离，并且牢固但可移除地将多个试剂测试滑块保持在第一和第二盖板之间的堆叠布置中。

公开(公告)号：US20050051608A1

公开(公告)日：2005-03-10

申请号：US10937654

申请日：2004-09-09

Applicant: Lisa Jimarez ,  Mark Pierson

Inventor： Lisa Jimarez ,  Mark Pierson

IPC: H05K3/32 ,  H05K3/34 ,  H05K3/46 ,  B23K31/00

CPC classification number: H05K3/462 ,  H05K3/321 ,  H05K3/3463 ,  H05K3/3484 ,  H05K3/4623 ,  H05K2201/096

Abstract: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

Abstract translation: 本发明提供了一种附接多个芯的方法，其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。 该方法提供将冶金膏施加到导电表面，从糊料中去除一部分助熔剂并连接两个芯。 本发明还提供了一种包括多个芯的结构，其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。