Method for quantification of biological material in a sample
    2.
    发明申请
    Method for quantification of biological material in a sample 审中-公开
    用于定量样品中生物材料的方法

    公开(公告)号:US20070065894A1

    公开(公告)日:2007-03-22

    申请号:US11526147

    申请日:2006-09-21

    IPC分类号: C12Q1/34 C12M3/00

    摘要: Methods for the detection and/or quantification of a biological material in a sample. The method includes the steps of liquefying the sample (if necessary) and pouring the liquefied sample into the incubation vessel. The incubation vessel has a generally flat horizontal surface and the surface is divided into at least one incubation site. Each incubation site is adapted to hold an aliquot of liquid and is sized and shaped, and formed of a suitable material, to hold the aliquot within the well by surface tension. Any excess liquid from the liquefied sample is poured from the surface of the incubation vessel. The method then involves incubating that incubation vessel until the presence or absence of the biological material is determined. The presence of air bubbles can be dramatically reduced by the presence of a surface acting agent in the liquid sample deposited on the device surface. Such an agent can be added to the sterile diluent used to prepare the test reagent, can be separately added to the test reagent after it is prepared, or can be added to the test sample directly while it is being prepared for testing.

    摘要翻译: 用于检测和/或定量样品中生物材料的方法。 该方法包括如下步骤:将样品液化(如有必要)并将液化的样品倒入培养容器中。 培养容器具有大致平坦的水平表面,并且将表面分成至少一个孵育位点。 每个孵化位点适于保持液体的等分试样,并且其尺寸和形状由合适的材料形成,以通过表面张力将等分试样保持在孔内。 从培养容器的表面倒出来自液化样品的任何多余的液体。 然后,该方法包括孵育该培养容器,直到确定生物材料的存在或不存在。 通过在沉积在器件表面上的液体样品中存在表面作用剂,可以显着降低气泡的存在。 可以将这样的试剂加入用于制备测试试剂的无菌稀释剂中,可以在制备试剂后分别添加到试验试剂中,或者可以在制备试剂时直接加入试验样品中。

    Z interconnect structure and method
    4.
    发明申请
    Z interconnect structure and method 有权
    Z互连结构和方法

    公开(公告)号:US20050051608A1

    公开(公告)日:2005-03-10

    申请号:US10937654

    申请日:2004-09-09

    摘要: The current invention provides a method of attaching a plurality of cores wherein a core has a via with a conductive surface to be electrically connected to a conductive surface on another core. The method provides for applying a metallurgical paste to a conductive surface, removing a portion of the flux from the paste and joining the two cores. The current invention also provides a structure including a plurality of cores wherein a metallurgical paste electrically connects a via with a conductive surface on a core to a conductive surface on another core.

    摘要翻译: 本发明提供了一种附接多个芯的方法,其中芯具有导电表面的通孔以电连接到另一芯上的导电表面。 该方法提供将冶金膏施加到导电表面,从糊料中去除一部分助熔剂并连接两个芯。 本发明还提供了一种包括多个芯的结构,其中冶金膏将通孔与芯上的导电表面电连接到另一芯上的导电表面。