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公开(公告)号：US20130154073A1
公开(公告)日：2013-06-20
申请号：US13327032
申请日：2011-12-15
IPC分类号： H01L23/495 , H01L21/50 , H01L21/28
CPC分类号： H01L23/49524 , H01L23/3107 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L2224/37147 , H01L2224/376 , H01L2224/40095 , H01L2224/40139 , H01L2224/40245 , H01L2224/48137 , H01L2224/49171 , H01L2224/73221 , H01L2924/00014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/84
摘要： In one embodiment, a leadframe for a semiconductor package includes a source connection area for one transistor and a drain connection point for a second transistor, and a common connection for using a connection clip to couple a drain of the first transistor to a source of the second transistor and to the common connection.
摘要翻译： 在一个实施例中，用于半导体封装的引线框架包括用于一个晶体管的源极连接区域和用于第二晶体管的漏极连接点，以及用于使用连接夹将第一晶体管的漏极耦合到第二晶体管的源极的公共连接 第二晶体管和公共连接。
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公开(公告)号：US08581416B2
公开(公告)日：2013-11-12
申请号：US13327032
申请日：2011-12-15
IPC分类号： H01L23/48 , H01L23/52 , H01L29/40 , H01L23/495 , H01L21/00
CPC分类号： H01L23/49524 , H01L23/3107 , H01L23/49575 , H01L24/37 , H01L24/40 , H01L2224/37147 , H01L2224/376 , H01L2224/40095 , H01L2224/40139 , H01L2224/40245 , H01L2224/48137 , H01L2224/49171 , H01L2224/73221 , H01L2924/00014 , H01L2924/1305 , H01L2924/13091 , H01L2924/181 , H01L2924/30107 , H01L2924/00 , H01L2924/00012 , H01L2224/84
摘要： In one embodiment, a leadframe for a semiconductor package includes a source connection area for one transistor and a drain connection point for a second transistor, and a common connection for using a connection clip to couple a drain of the first transistor to a source of the second transistor and to the common connection.
摘要翻译： 在一个实施例中，用于半导体封装的引线框架包括用于一个晶体管的源极连接区域和用于第二晶体管的漏极连接点，以及用于使用连接夹将第一晶体管的漏极耦合到第二晶体管的源极的公共连接 第二晶体管和公共连接。
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