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    Microchannel heat exchangers and methods of manufacturing the same
    2.
    发明申请
    Microchannel heat exchangers and methods of manufacturing the same 有权
    微通道热交换器及其制造方法

    公开(公告)号：US20050039885A1

    公开(公告)日：2005-02-24

    申请号：US10767483

    申请日：2004-01-28

    申请人： K. Vaidyanathan ,  Alfonso Ortega ,  Marlene Platero ,  Prathib Skandakumaran ,  Chad Bower

    发明人： K. Vaidyanathan ,  Alfonso Ortega ,  Marlene Platero ,  Prathib Skandakumaran ,  Chad Bower

    IPC分类号： F28D20060101 ,  H01L21/48 ,  H01L23/373 ,  H05K5/06

    CPC分类号： B23P15/26 ,  F28F7/02 ,  F28F2255/16 ,  F28F2260/02 ,  H01L21/4871 ,  H01L23/3731 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49359 ,  H01L2924/00

    摘要： A heat exchanger device includes an extruded body that includes one or more layers of channels for coolant flow therethrough, the channels generally having inner diameters of between about 50 microns to about 2000 microns. The device is formed of a material having a high thermal conductivity to facilitate transfer of heat from the heating components present in the subject cooling application to the coolant passing through the heat exchanger and to be compatible with materials of the heating components. The device material is selected from the group consisting of ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic suicides, metals, and intermetallics, and combinations thereof. The heat exchanger device is formed from an extruded filament that is arranged to give the desired channel configuration. The filament includes a central, removable material and an outer material that forms the channel walls upon removal of the central material.

    摘要翻译： 热交换器装置包括挤出主体，其包括用于冷却剂流过其中的一个或多个通道层，通道通常具有介于约50微米至约2000微米之间的内径。 该装置由具有高热导率的材料形成，以便于将热量从本体冷却应用中存在的加热组件转移到通过热交换器的冷却剂，并与加热部件的材料兼容。 器件材料选自陶瓷氧化物，陶瓷碳化物，陶瓷氮化物，陶瓷硼化物，陶瓷硅化物，金属和金属间化合物，以及它们的组合。 热交换器装置由布置成提供期望的通道构造的挤出细丝形成。 长丝包括中心的可移除材料和在去除中心材料时形成通道壁的外部材料。

    Method of manufacturing microchannel heat exchangers
    6.
    发明授权
    Method of manufacturing microchannel heat exchangers 有权
    微通道热交换器的制造方法

    公开(公告)号：US07360309B2

    公开(公告)日：2008-04-22

    申请号：US10767483

    申请日：2004-01-28

    申请人： K. Ranji Vaidyanathan ,  Alfonso Ortega ,  Marlene Platero ,  Prathib Skandakumaran ,  Chad Bower

    发明人： K. Ranji Vaidyanathan ,  Alfonso Ortega ,  Marlene Platero ,  Prathib Skandakumaran ,  Chad Bower

    IPC分类号： B23P15/26 ,  B28B1/30 ,  B22F3/11

    CPC分类号： B23P15/26 ,  F28F7/02 ,  F28F2255/16 ,  F28F2260/02 ,  H01L21/4871 ,  H01L23/3731 ,  H01L23/473 ,  H01L2924/0002 ,  Y10T29/4935 ,  Y10T29/49359 ,  H01L2924/00

    摘要： A heat exchanger device includes an extruded body that includes one or more layers of channels for coolant flow therethrough, the channels generally having inner diameters of between about 50 microns to about 2000 microns. The device is formed of a material having a high thermal conductivity to facilitate transfer of heat from the heating components present in the subject cooling application to the coolant passing through the heat exchanger and to be compatible with materials of the heating components. The device material is selected from the group consisting of ceramic oxides, ceramic carbides, ceramic nitrides, ceramic borides, ceramic silicides, metals, and intermetallics, and combinations thereof. The heat exchanger device is formed from an extruded filament that is arranged to give the desired channel configuration. The filament includes a central, removable material and an outer material that forms the channel walls upon removal of the central material.

    摘要翻译： 热交换器装置包括挤出主体，其包括用于冷却剂流过其中的一个或多个通道层，通道通常具有介于约50微米至约2000微米之间的内径。 该装置由具有高热导率的材料形成，以便于将热量从本体冷却应用中存在的加热组件转移到通过热交换器的冷却剂，并与加热部件的材料兼容。 器件材料选自陶瓷氧化物，陶瓷碳化物，陶瓷氮化物，陶瓷硼化物，陶瓷硅化物，金属和金属间化合物，以及它们的组合。 热交换器装置由布置成提供期望的通道构造的挤出细丝形成。 长丝包括中心的可移除材料和在去除中心材料时形成通道壁的外部材料。