公开(公告)号：US20020173081A1

公开(公告)日：2002-11-21

申请号：US10174057

申请日：2002-06-17

发明人： Rudolf Lehner

IPC分类号： H01L029/74 ,  H01L021/48

CPC分类号： H01L24/744 ,  B23K2101/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material is disposed, so that the electrical connection connects the circuit to the carrier in a bonding process. In this manner an efficient and cost effective method for connecting the circuit to carrier is performed.

摘要翻译： 描述用于接触电路的配置和方法。 载体邻近电路设置，并且设置由导电材料形成的电连接的设置元件，使得电连接在接合过程中将电路连接到载体。 以这种方式，执行用于将电路连接到载体的有效且成本有效的方法。

公开(公告)号：US20240021436A1

公开(公告)日：2024-01-18

申请号：US18353611

申请日：2023-07-17

申请人： ZF Friedrichshafen AG

发明人： Ake Ewald ,  Fabian Hohmann ,  Stefan Hain

IPC分类号： H01L21/48 ,  H01L23/495 ,  H01L23/00 ,  B60K1/00 ,  B60K23/00

CPC分类号： H01L21/4842 ,  H01L23/49551 ,  H01L24/35 ,  H01L24/37 ,  H01L24/744 ,  B60K1/00 ,  B60K23/00 ,  H01L24/40 ,  H01L2224/37013 ,  H01L2224/352 ,  H01L2224/40137 ,  H01L2224/48225 ,  H01L24/48 ,  H01L24/73 ,  H01L2224/73221 ,  H01L2224/37011

摘要： A method for manufacturing a terminal apparatus for connecting a component for an electrical module includes bending a pre-machined sheet metal element, having a first electric terminal device for connecting to a first potential, a control terminal having a control contact, and a second electric terminal device arranged between the first electric terminal device and the control terminal and separated from the first electric terminal device by a gap, and for connecting to a second electrical potential, further having a path section including a first path for contact-connection with a terminal for the second electrical potential of the component, and a second path arranged in parallel with the first, and wherein an edge region of the sheet metal is bent such that the first electric terminal device and the path section are brought together such that the first electric terminal device and the path section overlap.

公开(公告)号：US11735505B2

公开(公告)日：2023-08-22

申请号：US17316157

申请日：2021-05-10

申请人： Kabushiki Kaisha Toshiba ,  Toshiba Electronic Devices & Storage Corporation

发明人： Hidetoshi Kuraya ,  Satoshi Hattori ,  Kyo Tanabiki

IPC分类号： H01L23/49 ,  H01L23/495 ,  H01L23/00 ,  H01L21/48 ,  H01L23/31 ,  H01L23/29

CPC分类号： H01L23/495 ,  H01L21/4842 ,  H01L23/49524 ,  H01L23/49562 ,  H01L24/29 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/41 ,  H01L24/49 ,  H01L24/744 ,  H01L24/77 ,  H01L24/83 ,  H01L24/84 ,  H01L24/85 ,  H01L23/295 ,  H01L23/3107 ,  H01L23/49513 ,  H01L24/32 ,  H01L2224/29101 ,  H01L2224/29118 ,  H01L2224/32245 ,  H01L2224/37011 ,  H01L2224/37013 ,  H01L2224/37147 ,  H01L2224/4007 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2224/4103 ,  H01L2224/73263 ,  H01L2224/83192 ,  H01L2224/83801 ,  H01L2224/84138 ,  H01L2224/84345 ,  H01L2224/84385 ,  H01L2224/84801 ,  H01L2224/92246 ,  H01L2924/15747 ,  H01L2924/181 ,  H01L2924/3512 ,  H01L2224/84801 ,  H01L2924/00014 ,  H01L2224/83801 ,  H01L2924/00014 ,  H01L2924/181 ,  H01L2924/00012 ,  H01L2224/37147 ,  H01L2924/00014 ,  H01L2224/29118 ,  H01L2924/01047 ,  H01L2224/29118 ,  H01L2924/0105

摘要： According to one embodiment, a semiconductor device includes a semiconductor chip, first and second conductive members, a first connection member, and a resin portion. The first conductive member includes first and second portions. The second portion is electrically connected to the semiconductor chip. A direction from the semiconductor chip toward the second portion is aligned with a first direction. A direction from the second portion toward the first portion is aligned with a second direction crossing the first direction. The second conductive member includes a third portion. The first connection member is provided between the first and third portion. The first connection member is conductive. The resin portion includes a first partial region. The first partial region is provided around the first and third portions, and the first connection member. The first portion has a first surface opposing the first connection member and including a recess and a protrusion.

公开(公告)号：US11676934B2

公开(公告)日：2023-06-13

申请号：US17076817

申请日：2020-10-22

申请人： UTAC Headquarters Pte. Ltd.

发明人： Albert Louis Bove ,  Hua Hong Tan ,  Aaron Lyn Foong Tan

IPC分类号： H01L23/00

CPC分类号： H01L24/77 ,  H01L24/34 ,  H01L24/35 ,  H01L24/40 ,  H01L24/744 ,  H01L24/84 ,  H01L2224/40245 ,  H01L2224/767 ,  H01L2224/7765 ,  H01L2224/77611 ,  H01L2224/77621 ,  H01L2224/77745 ,  H01L2224/8412 ,  H01L2224/95 ,  H01L2224/95122

摘要： The present disclosure is directed to a high throughput clip bonding tool or system which is flexible and easily adapts to different clip bond pitches or sizes. The clip bonding system may be an integrated system with various modules, including a clip singulation module, a feeder module, a transfer module and a clip attach module within a shared footprint. For example, an incoming clip source may be fed to the clip singulation module for clip singulation before the singulated clips are transferred by the feeder and transfer modules to a clip presentation area for clip alignment before pickup. A pickup tool of the clip attach module is configured to facilitate pickup and attachment of clips onto the semiconductor packages to be clip bonded. For example, the pickup head is programmable to facilitate clip bonding process of different applications which may require clips and packages with different sizes.

公开(公告)号：US12002700B2

公开(公告)日：2024-06-04

申请号：US17346743

申请日：2021-06-14

申请人： Kioxia Corporation

发明人： Sho Kawadahara

IPC分类号： H01L21/683 ,  H01L23/00

CPC分类号： H01L21/683 ,  H01L24/74 ,  H01L24/741 ,  H01L24/743 ,  H01L24/744 ,  H01L24/80 ,  H01L24/81 ,  H01L24/82 ,  H01L24/83 ,  H01L24/84 ,  H01L24/94 ,  H01L24/95 ,  H01L2224/75733 ,  H01L2224/75734 ,  H01L2224/76733 ,  H01L2224/77733 ,  H01L2224/8022 ,  H01L2224/8122 ,  H01L2224/8221 ,  H01L2224/8322 ,  H01L2224/8421 ,  H01L2224/9512 ,  H01L2224/95133 ,  H01L2224/95144 ,  H01L2224/95145

摘要： According to one embodiment, there is provided a substrate bonding apparatus including a first chuck stage and a second chuck stage. The first chuck stage includes a first electromagnetic force generation unit. The first chuck stage is chuckable for a first substrate. The second chuck stage includes a second electromagnetic force generation unit. The second electromagnetic force generation unit faces the first electromagnetic force generation unit. The second chuck stage is chuckable for a second substrate.

公开(公告)号：US07245026B2

公开(公告)日：2007-07-17

申请号：US10174057

申请日：2002-06-17

申请人： Rudolf Lehner

发明人： Rudolf Lehner

IPC分类号： H01L23/48

CPC分类号： H01L24/744 ,  B23K2101/40 ,  H01L24/37 ,  H01L24/40 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37144 ,  H01L2224/37147 ,  H01L2224/40095 ,  H01L2224/40245 ,  H01L2924/01005 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/14 ,  H01L2924/19042

摘要： A configuration and method for contacting a circuit is described. A carrier is disposed adjacent a circuit, and a setting element at which an electrical connection formed of a conductive material is disposed, so that the electrical connection connects the circuit to the carrier in a bonding process. In this manner an efficient and cost effective method for connecting the circuit to carrier is performed.

摘要翻译： 描述用于接触电路的配置和方法。 载体邻近电路设置，并且设置由导电材料形成的电连接的设置元件，使得电连接在接合过程中将电路连接到载体。 以这种方式，执行用于将电路连接到载体的有效且成本有效的方法。

公开(公告)号：US20060016855A1

公开(公告)日：2006-01-26

申请号：US11179596

申请日：2005-07-13

申请人： Shigeru Tanabe ,  Masataka Namba ,  Kaoru Nakamura ,  Kosuke Tosa

发明人： Shigeru Tanabe ,  Masataka Namba ,  Kaoru Nakamura ,  Kosuke Tosa

IPC分类号： B23K37/00

CPC分类号： H01L23/49524 ,  B23K20/10 ,  B23K2101/40 ,  H01L21/4825 ,  H01L21/67144 ,  H01L23/49562 ,  H01L24/35 ,  H01L24/37 ,  H01L24/40 ,  H01L24/744 ,  H01L24/77 ,  H01L24/84 ,  H01L2224/37124 ,  H01L2224/37147 ,  H01L2224/40091 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2224/83205 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/13055 ,  H01L2924/13091 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/48

摘要： There is provided a strap-bonding machine, including a metal ribbon tape storage portion configured to hold a metal ribbon tape, a metal ribbon tape-cutting portion configured to cut the metal ribbon tape fed from the metal ribbon tape storage portion to a metal strap having a predefined shape, a metal strap-carrying portion configured to feed the metal strap to a picking-position, a lead frame-carrying portion configured to carry a lead frame mounted a semiconductor chip on and having a lead terminal, and a bonding portion configured to pick up the metal strap at the picking-position, to carry the metal strap above the lead frame and to bond the metal strap to the semiconductor chip and the lead terminal.

摘要翻译： 提供了一种带状粘合机，包括金属带状收纳部，其配置为保持金属带状带;金属带切割部，其构造成将从金属带状带收纳部供给的金属带带切断成金属带 具有预定形状的金属带承载部分，被配置为将金属带馈送到拾取位置;引线框架承载部分，构造成承载安装有半导体芯片并具有引线端子的引线框架，以及接合部分 被配置为在拾取位置拾取金属带，以将金属带携带在引线框架上方并将金属带接合到半导体芯片和引线端子。