-
公开(公告)号：US20180261567A1
公开(公告)日：2018-09-13
申请号：US15973782
申请日：2018-05-08
IPC分类号： H01L23/00
CPC分类号： H01L24/78 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/77 , H01L2224/40245 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/45147 , H01L2224/48247 , H01L2224/77704 , H01L2224/78301 , H01L2224/78704 , H01L2224/78744 , H01L2224/83801 , H01L2224/84801 , H01L2924/00014 , H01L2924/14 , H01L2924/20751 , H01L2924/00015 , H01L2224/37099
摘要： A wire bonding machine window clamp assembly. The assembly includes a support plate adapted to support a leadframe strip. The assembly also includes a frame structure defining a central clamp opening adapted to expose a portion of the leadframe strip. The frame structure includes at least one elongate frame member having a first surface portion adapted to engage a top surface of the leadframe strip and a second surface portion adapted to engage upper surfaces of integrated circuit (“IC”) component stacks mounted on the leadframe strip.
-
公开(公告)号：US09312234B2
公开(公告)日：2016-04-12
申请号：US14127187
申请日：2013-05-27
申请人： NSK Ltd.
发明人： Takashi Sunaga , Noboru Kaneko , Osamu Miyoshi
IPC分类号： H01L29/76 , H01L23/00 , H01L25/07 , H01L25/18 , H01L29/78 , H01L23/373 , H01L23/498
CPC分类号： H01L24/43 , H01L23/3735 , H01L23/49811 , H01L24/29 , H01L24/32 , H01L24/33 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/77 , H01L24/83 , H01L24/84 , H01L24/85 , H01L24/92 , H01L25/07 , H01L25/072 , H01L25/18 , H01L29/78 , H01L2224/05553 , H01L2224/0603 , H01L2224/291 , H01L2224/29101 , H01L2224/29294 , H01L2224/293 , H01L2224/32225 , H01L2224/32227 , H01L2224/32238 , H01L2224/33181 , H01L2224/352 , H01L2224/35847 , H01L2224/3701 , H01L2224/37011 , H01L2224/37013 , H01L2224/37147 , H01L2224/40095 , H01L2224/40227 , H01L2224/40475 , H01L2224/40499 , H01L2224/4103 , H01L2224/4112 , H01L2224/41175 , H01L2224/43848 , H01L2224/451 , H01L2224/48091 , H01L2224/48472 , H01L2224/494 , H01L2224/73263 , H01L2224/73265 , H01L2224/75272 , H01L2224/77272 , H01L2224/83191 , H01L2224/83192 , H01L2224/8321 , H01L2224/83424 , H01L2224/83447 , H01L2224/83801 , H01L2224/83815 , H01L2224/84424 , H01L2224/84447 , H01L2224/84801 , H01L2224/84815 , H01L2224/85 , H01L2224/85815 , H01L2224/9221 , H01L2924/00014 , H01L2924/00015 , H01L2924/01029 , H01L2924/014 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/15724 , H01L2924/19105 , H01L2924/3011 , H01L2924/351 , H01L2924/3701 , H05K1/181 , H05K2201/10166 , H05K2201/1031 , H05K2201/10409 , Y02P70/611 , H01L2924/00 , H01L2224/48 , H01L2224/83 , H01L2224/84 , H01L2224/33 , H01L2924/00012 , H01L2224/45099 , H01L2224/48227
摘要： There is provided a semiconductor module and a method for manufacturing the same which make it possible to joint the electrode of the bare-chip transistor and the wiring pattern on the substrate by solder mounting operation, in the same process of solder mounting operation for mounting the bare-chip transistor or other surface mounting devices on the wiring patterns on the substrate. A semiconductor module includes: a plurality of wiring patterns formed on an insulating layer; a bare-chip transistor mounted on one wiring pattern out of the plurality of wiring patterns via a solder; and a copper connector constituted of a copper plate for jointing an electrode formed on a top surface of the bare-chip transistor and another wiring pattern out of the plurality of wiring patterns via a solder.
摘要翻译： 提供了一种半导体模块及其制造方法，其可以通过焊接安装操作将裸芯片晶体管的电极和布线图案与基板上的布线图案相连接，在相同的焊接安装操作过程中， 裸芯片晶体管或其他表面安装器件在基板上的布线图案上。 半导体模块包括：形成在绝缘层上的多个布线图案; 通过焊料在多个布线图案中安装在一个布线图案上的裸芯片晶体管; 以及铜连接器，其由用于通过焊料将形成在裸芯片晶体管的顶表面上的电极和多个布线图案中的另一布线图案连接的铜板构成。
-
3.发明申请公开(公告)号：US20150206830A1
公开(公告)日：2015-07-23
申请号：US14422351
申请日：2012-09-24
发明人： Keita Takada , Tadatoshi Danno , Toshiyuki Hata
IPC分类号： H01L23/495 , H01L23/31 , H01L21/56
CPC分类号： H01L23/49524 , H01L21/561 , H01L21/565 , H01L21/568 , H01L23/3107 , H01L23/3114 , H01L23/49513 , H01L23/49551 , H01L23/49562 , H01L23/49575 , H01L23/49582 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/77 , H01L24/84 , H01L24/92 , H01L2224/05554 , H01L2224/29111 , H01L2224/32245 , H01L2224/3701 , H01L2224/37147 , H01L2224/40091 , H01L2224/40095 , H01L2224/40132 , H01L2224/40245 , H01L2224/45014 , H01L2224/45015 , H01L2224/451 , H01L2224/45144 , H01L2224/48091 , H01L2224/48132 , H01L2224/48137 , H01L2224/48247 , H01L2224/48465 , H01L2224/4903 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/7755 , H01L2224/77611 , H01L2224/83801 , H01L2224/8385 , H01L2224/84005 , H01L2224/84205 , H01L2224/84345 , H01L2224/85005 , H01L2224/85205 , H01L2224/92246 , H01L2224/92247 , H01L2924/00014 , H01L2924/0132 , H01L2924/1305 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/3011 , H01L2924/00012 , H01L2924/00 , H01L2924/20752 , H01L2924/20753 , H01L2924/20754 , H01L2924/20755 , H01L2924/01047 , H01L2924/0105 , H01L2924/207 , H01L2924/206
摘要： A lead frame having a first chip-mounting part on which a first semiconductor chip is mounted and having a second chip-mounting part on which a second semiconductor chip is mounted is prepared. Moreover, a process is provided, the process connecting a first electrode pad, which is formed on a top surface of the first semiconductor chip, with a first end of a first metal ribbon and connecting a ribbon-connecting surface on the second chip-mounting part with a second end of the first metal ribbon on the opposite side of the first end. Moreover, in a plan view, the ribbon-connecting surface of the second chip-mounting part is positioned between the first semiconductor chip and the second semiconductor chip. Moreover, the height of the ribbon-connecting surface is positioned at a position higher than the height of a mounting surface of the second semiconductor chip of the second chip-mounting part.
摘要翻译： 一种具有第一芯片安装部分的引线框架，其上安装有第一半导体芯片，并且具有安装有第二半导体芯片的第二芯片安装部件。 此外，提供了一种处理，其将形成在第一半导体芯片的顶表面上的第一电极焊盘与第一金属带的第一端连接并将第二芯片安装上的带状连接表面连接 第一金属带的第二端在第一端的相对侧上。 此外，在平面图中，第二芯片安装部分的带状连接表面位于第一半导体芯片和第二半导体芯片之间。 此外，带状连接表面的高度位于比第二芯片安装部件的第二半导体芯片的安装表面的高度高的位置。
-
公开(公告)号：US20140284809A1
公开(公告)日：2014-09-25
申请号：US14223994
申请日：2014-03-24
发明人： Asako YONEGUCHI , Toshitake OHNISHI , Yasuhiro MAEDA , Hitoshi NISHIO , Yoshinobu SUHARA , Ryo IMAGAWA
IPC分类号： H01L23/00
CPC分类号： H01L24/13 , H01L24/29 , H01L24/32 , H01L24/37 , H01L24/40 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/75 , H01L24/77 , H01L24/83 , H01L24/84 , H01L2224/29101 , H01L2224/32225 , H01L2224/37013 , H01L2224/371 , H01L2224/4007 , H01L2224/40095 , H01L2224/40137 , H01L2224/40139 , H01L2224/48091 , H01L2224/49175 , H01L2224/73221 , H01L2224/73263 , H01L2224/73265 , H01L2224/75272 , H01L2224/77272 , H01L2224/83801 , H01L2224/83815 , H01L2224/84138 , H01L2224/84801 , H01L2224/84815 , H01L2224/849 , H01L2924/00014 , H01L2224/45099 , H01L2924/014
摘要： A power converter includes a bus bar, a semiconductor device, a lead, and solder. The bus bar has a vertical wall. The semiconductor device includes an electrode. The lead has one end connected to the bus bar and another end connected to the semiconductor device to supply power from the bus bar to the electrode of the semiconductor device via the lead. The one end of the lead includes a bending part which is spaced away from the bus bar by a predetermined distance and which is inclined in a vertical downward direction. The vertical wall of the bus bar and the bending part are bonded to each other via the solder. The vertical wall extends in a substantially vertical direction to face the bending part.
摘要翻译： 功率转换器包括母线，半导体器件，引线和焊料。 母线有一个垂直的墙壁。 半导体器件包括电极。 引线的一端连接到母线，另一端连接到半导体器件，以通过引线从母线向半导体器件的电极供电。 引线的一端包括弯曲部分，其与母线间隔开预定距离并且在垂直向下的方向上倾斜。 母线和弯曲部分的垂直壁通过焊料相互粘接。 垂直壁在基本垂直的方向上延伸以面对弯曲部分。
-
公开(公告)号：US08746537B2
公开(公告)日：2014-06-10
申请号：US14059572
申请日：2013-10-22
CPC分类号： B23K20/004 , B23K20/10 , H01L24/37 , H01L24/45 , H01L24/77 , H01L24/78 , H01L24/84 , H01L24/85 , H01L31/188 , H01L2224/37124 , H01L2224/37139 , H01L2224/37147 , H01L2224/45014 , H01L2224/773 , H01L2224/77313 , H01L2224/77315 , H01L2224/77316 , H01L2224/77321 , H01L2224/77343 , H01L2224/77352 , H01L2224/77611 , H01L2224/77702 , H01L2224/783 , H01L2224/78313 , H01L2224/78315 , H01L2224/78316 , H01L2224/78321 , H01L2224/78343 , H01L2224/78352 , H01L2224/78611 , H01L2224/78702 , H01L2224/8412 , H01L2224/84205 , H01L2224/8512 , H01L2224/85205 , H01L2924/00014 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01023 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01074 , H01L2924/01082 , H01L2924/014 , Y02E10/50 , H01L2224/45099 , H01L2924/01026 , H01L2924/04563 , H01L2924/00012
摘要： An ultrasonic bonding system is provided. The ultrasonic bonding system includes a bond head assembly and a bonding tool for bonding a conductive bonding material to a workpiece. The ultrasonic bonding system also includes a pressing member adapted to press against the workpiece, the pressing member being supported by the bond head assembly and being moveable with respect to the bond head assembly independent of the bonding tool. The pressing member includes a body portion and a plurality of pressing elements extending below the body portion, the pressing elements being configured to contact the workpiece.
摘要翻译： 提供超声波接合系统。 超声波接合系统包括接合头组件和用于将导电接合材料接合到工件的接合工具。 超声波接合系统还包括适于压靠工件的按压构件，该按压构件由接合头组件支撑，并且能够相对于接合头组件可独立于接合工具而移动。 按压构件包括主体部分和在主体部分下方延伸的多个按压元件，按压元件构造成接触工件。
-
公开(公告)号：US20130207252A1
公开(公告)日：2013-08-15
申请号：US13846730
申请日：2013-03-18
发明人： Kuniharu MUTO , Toshiyuki HATA , Hiroshi SATO , Hiroi OKA , Osamu IKEDA
IPC分类号： H01L23/495
CPC分类号： H01L23/49582 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49562 , H01L23/544 , H01L24/05 , H01L24/29 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/77 , H01L24/78 , H01L24/83 , H01L24/84 , H01L24/85 , H01L29/0615 , H01L29/41766 , H01L29/456 , H01L29/7397 , H01L29/7811 , H01L29/7813 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05624 , H01L2224/0603 , H01L2224/29294 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/4103 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4912 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/78 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85205 , H01L2224/85207 , H01L2224/85214 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/206
摘要： To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire.
摘要翻译： 实现密封在其中的功率MOSFET的小型表面安装封装的导通电阻的降低。 硅芯片安装在与构成漏极引线的引线集成的管芯焊盘部分上。 硅芯片在其主表面上具有源极焊盘和栅极焊盘。 硅芯片的背面配置功率MOSFET的漏极，并通过Ag浆料粘合到芯片焊盘部分的上表面。 构成源极引线的引线通过Al带电耦合到源极焊盘，而构成栅极引线的引线通过Au线电耦合到栅极焊盘。
-
公开(公告)号：US20120034742A1
公开(公告)日：2012-02-09
申请号：US13276995
申请日：2011-10-19
申请人： Kuniharu Muto , Toshiyuki Hata , Hiroshi Sato , Hiroi Oka , Osamu Ikeda
发明人： Kuniharu Muto , Toshiyuki Hata , Hiroshi Sato , Hiroi Oka , Osamu Ikeda
IPC分类号： H01L21/50
CPC分类号： H01L23/49582 , H01L23/49503 , H01L23/49524 , H01L23/49548 , H01L23/49562 , H01L23/544 , H01L24/05 , H01L24/29 , H01L24/35 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/49 , H01L24/73 , H01L24/77 , H01L24/78 , H01L24/83 , H01L24/84 , H01L24/85 , H01L29/0615 , H01L29/41766 , H01L29/456 , H01L29/7397 , H01L29/7811 , H01L29/7813 , H01L2223/54406 , H01L2223/54433 , H01L2223/54486 , H01L2224/04042 , H01L2224/05073 , H01L2224/05166 , H01L2224/05624 , H01L2224/0603 , H01L2224/29294 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/40091 , H01L2224/40245 , H01L2224/40247 , H01L2224/4103 , H01L2224/45014 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/4846 , H01L2224/48465 , H01L2224/48624 , H01L2224/48724 , H01L2224/4903 , H01L2224/49051 , H01L2224/49111 , H01L2224/4912 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/78 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85205 , H01L2224/85207 , H01L2224/85214 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01015 , H01L2924/01022 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01054 , H01L2924/01074 , H01L2924/01078 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/05042 , H01L2924/10253 , H01L2924/12042 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/14 , H01L2924/181 , H01L2924/19043 , H01L2924/00014 , H01L2924/00012 , H01L2924/00 , H01L2924/3512 , H01L2224/83205 , H01L2924/206
摘要： To actualize a reduction in the on-resistance of a small surface mounted package having a power MOSFET sealed therein. A silicon chip is mounted on a die pad portion integrated with leads configuring a drain lead. The silicon chip has, on the main surface thereof, a source pad and a gate pad. The backside of the silicon chip configures a drain of a power MOSFET and bonded to the upper surface of a die pad portion via an Ag paste. A lead configuring a source lead is electrically coupled to the source pad via an Al ribbon, while a lead configuring a gate lead is electrically coupled to the gate pad via an Au wire.
摘要翻译： 实现密封在其中的功率MOSFET的小型表面安装封装的导通电阻的降低。 硅芯片安装在与构成漏极引线的引线集成的管芯焊盘部分上。 硅芯片在其主表面上具有源极焊盘和栅极焊盘。 硅芯片的背面配置功率MOSFET的漏极，并通过Ag浆料粘合到芯片焊盘部分的上表面。 构成源极引线的引线通过Al带电耦合到源极焊盘，而构成栅极引线的引线通过Au线电耦合到栅极焊盘。
-
公开(公告)号：US08096463B2
公开(公告)日：2012-01-17
申请号：US11793290
申请日：2004-12-29
申请人： Giovanni Delrosso
发明人： Giovanni Delrosso
CPC分类号： H01L24/80 , H01C17/28 , H01G13/006 , H01L21/67138 , H01L24/45 , H01L24/77 , H01L24/78 , H01L2224/45015 , H01L2224/45118 , H01L2224/45139 , H01L2224/45144 , H01L2224/45147 , H01L2224/4516 , H01L2224/78 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01029 , H01L2924/0103 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01049 , H01L2924/01057 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/19042 , H01L2924/19043 , H01L2924/00014 , H01L2924/20754 , H01L2924/20756 , H01L2924/20755 , H01L2924/20757 , H01L2924/20758 , H01L2924/20759 , H01L2924/2076 , H01L2924/013 , H01L2924/01028
摘要： To permanently apply lead terminals to corresponding electrodes of electronic or electro-optic components, the following steps are carried out: a. providing a frame including at least one tensioned wire, b. providing a holding jig including at least one seat in which a respective one of the components can be removably and temporarily retained, c. applying the components to the seats with the respective electrodes aligned along a respective longitudinal direction; in this way a row of aligned components is obtained, each component having a corresponding electrode aligned to the subsequent one in the row, d. applying the holding jig to the frame and orienting the same so that the longitudinal direction corresponds to the direction of the tensioned wire, the tensioned wire being thereby brought substantially in contact with (all) the electrode(s) aligned to each other on a corresponding row of components, e. electrically and mechanically bonding the tensioned wire to the corresponding electrodes; in this way all components are simultaneously bonded to the wire, and f. cutting the wire to separate the components from each other thereby forming a respective lead terminal for each electrode.
摘要翻译： 为了将引线端子永久性地应用于电子或电光元件的相应电极，执行以下步骤：a。 提供包括至少一个张紧线的框架，b。 提供包括至少一个座椅的保持夹具，其中相应的一个部件可以可拆卸地且暂时地保持在其中; c。 将各部件沿相应的纵向方向对准，将各部件施加到座上; 以这种方式获得一排排列的部件，每个部件具有与行中随后的一个对准的对应电极，d。 将保持夹具施加到框架并使其定向，使得纵向方向对应于拉紧线的方向，从而使拉伸的线基本上与彼此对准的电极（所有）基本上接触， 行组成部分， 将张紧的电线电气和机械地结合到相应的电极; 以这种方式，所有组件同时粘合到导线上，f。 切割线以将部件彼此分离，从而为每个电极形成相应的引线端子。
-
公开(公告)号：US07863107B2
公开(公告)日：2011-01-04
申请号：US12334318
申请日：2008-12-12
申请人： Hideaki Tamimoto , Takumi Soba , Toru Ueguri , Kazuo Kudo
发明人： Hideaki Tamimoto , Takumi Soba , Toru Ueguri , Kazuo Kudo
IPC分类号： H01L21/00
CPC分类号： H01L23/49562 , H01L23/49524 , H01L24/03 , H01L24/05 , H01L24/29 , H01L24/37 , H01L24/40 , H01L24/41 , H01L24/45 , H01L24/48 , H01L24/73 , H01L24/77 , H01L24/84 , H01L24/85 , H01L24/95 , H01L2224/04042 , H01L2224/05554 , H01L2224/05639 , H01L2224/0603 , H01L2224/29339 , H01L2224/32245 , H01L2224/37124 , H01L2224/37147 , H01L2224/4007 , H01L2224/40091 , H01L2224/40245 , H01L2224/45014 , H01L2224/45015 , H01L2224/45124 , H01L2224/45144 , H01L2224/48091 , H01L2224/48247 , H01L2224/48465 , H01L2224/48639 , H01L2224/48739 , H01L2224/73219 , H01L2224/73221 , H01L2224/73265 , H01L2224/78313 , H01L2224/83801 , H01L2224/8385 , H01L2224/84205 , H01L2224/85205 , H01L2224/85207 , H01L2224/85439 , H01L2224/92 , H01L2224/92247 , H01L2924/00011 , H01L2924/01005 , H01L2924/01006 , H01L2924/01013 , H01L2924/01014 , H01L2924/01022 , H01L2924/01023 , H01L2924/01028 , H01L2924/01029 , H01L2924/01033 , H01L2924/01046 , H01L2924/01047 , H01L2924/01074 , H01L2924/01079 , H01L2924/01082 , H01L2924/01322 , H01L2924/014 , H01L2924/10253 , H01L2924/1305 , H01L2924/13055 , H01L2924/1306 , H01L2924/13091 , H01L2924/181 , H01L2924/00014 , H01L2224/83 , H01L2224/84 , H01L2924/01015 , H01L2924/00 , H01L2924/00012 , H01L2924/3512 , H01L2924/00015
摘要： The bonding time of a metallic ribbon is shortened in the semiconductor device which connects a lead frame with the bonding pad of a semiconductor chip with a metallic ribbon. The bottom of the wedge tool is divided into two by the V-groove at the first branch and the second branch. In order to do bonding of the Al ribbon to the source pad of the silicon chip, and the source post of the lead frame, first, the first branch and second branch of the wedge tool are contacted by pressure to Al ribbon on the source pad, and supersonic vibration is applied to it. Subsequently, the first branch is contacted by pressure to Al ribbon on the source post, and supersonic vibration is applied to it. Here, since the width of the first branch is narrower than the width of the source post, Al ribbon is not joined at the end surface of the width direction of the source post.
摘要翻译： 在将引线框与半导体芯片的焊盘与金属带连接的半导体器件中，金属带的接合时间缩短。 楔形工具的底部由第一分支和第二分支处的V形槽分成两部分。 为了使铝带与硅芯片的源极焊盘和引线框架的源极接合，首先，楔形工具的第一支路和第二支路通过压力与源极上的Al带接触 ，并施加超音速振动。 随后，第一分支通过压力与源柱上的Al带接触，并且对其施加超音速振动。 这里，由于第一分支的宽度比源极的宽度窄，所以在色谱柱的宽度方向的端面处没有接合Al带。
-
公开(公告)号：US20230299035A1
公开(公告)日：2023-09-21
申请号：US17698134
申请日：2022-03-18
申请人： Meta Platforms, Inc.
IPC分类号： H01L23/00 , H01L23/552
CPC分类号： H01L24/40 , H01L23/552 , H01L24/77 , H01L24/84 , H01L2224/40227 , H01L2224/77343 , H01L2224/7755 , H01L2224/84047 , H01L2224/8412 , H01L2224/84207 , H01L2924/3025
摘要： Embodiments relate to an integrated circuit package having an integrated circuit die connected to a package substrate through conductors of a flex cable. The flex cable includes an insulating housing made of an insulating material and a plurality of conductors disposed inside the insulating housing. Each conductor of the plurality of conductors is connected to a first contact of a plurality of contacts of the integrated circuit die and a second contact of a plurality of contacts of the package substrate.
-
-
-
-
-
-
-
-
-
搜索结果
62 条记录 (耗时 0.024 秒)
