IMAGING MODULE, FABRICATING METHOD THEREFOR, AND IMAGING DEVICE
    4.
    发明申请
    IMAGING MODULE, FABRICATING METHOD THEREFOR, AND IMAGING DEVICE 有权
    成像模块,其制作方法及成像装置

    公开(公告)号:US20110180893A1

    公开(公告)日:2011-07-28

    申请号:US13007846

    申请日:2011-01-17

    IPC分类号: H01L31/0232 H01L21/66

    摘要: An imaging module includes an imaging chip including a micro-lens guiding incident light and an imaging element in a semiconductor substrate and converting the incident light into an electric signal, and a polarizing glass chip including a polarizing filter glass having a polarizer determining a polarization direction of the incident light arranged on a transparent substrate such that the polarizer faces the micro-lens and a spacer member connected to the polarizing filter glass to adjust a gap between the polarizer and the micro-lens of the imaging chip. In the imaging module, a melt-bonding surface of the spacer member is melt-bonded to the semiconductor substrate such that the polarizer of the polarizing glass chip and the micro-lens of the imaging chip are arranged close to each other via the gap, and the imaging element and the micro-lens of the imaging chip are sealed by the polarizing glass chip.

    摘要翻译: 一种成像模块包括:成像芯片,包括在半导体衬底中引导入射光和成像元件的微透镜,并将入射光转换为电信号;以及偏振玻璃芯片,其包括具有偏振器的偏振滤光片玻璃, 配置在透明基板上的入射光使得偏振器面向微透镜,以及与偏振滤光片玻璃连接的间隔构件,以调节偏振片与成像芯片的微透镜之间的间隙。 在成像模块中,间隔件的熔融粘合表面熔融粘合到半导体衬底上,使得偏振玻璃芯片的偏振器和成像芯片的微透镜经由间隙彼此靠近配置, 并且成像芯片的成像元件和微透镜被偏光玻璃芯片密封。

    OPERATING DEVICE, LIGHT DEFLECTOR, LIGHT DEFLECTING DEVICE, DISTANCE MEASUREMENT APPARATUS, IMAGE PROJECTION APPARATUS, AND MOBILE OBJECT

    公开(公告)号:US20220155582A1

    公开(公告)日:2022-05-19

    申请号:US17452264

    申请日:2021-10-26

    IPC分类号: G02B26/08 G01S7/481

    摘要: An operating device includes an oscillator oscillable around an oscillation axis; a support; and a movable portion. The movable portion includes: a first connecting portion on one end, connected to the oscillator; a second connecting portion on the other end, connected to the support; and a beam extending in a direction intersecting the oscillation axis. At least one of the first connecting portion and the second connecting portion includes: a first extending portion extending along the oscillation axis; and a first thick portion extending along the oscillation axis and having a thickness greater than a thickness of another portion other than the first thick portion in the at least one of the first connecting portion and the second connecting portion, at least a part of the first thick portion included in the first extending portion.