公开(公告)号：US5279045A

公开(公告)日：1994-01-18

申请号：US649847

申请日：1991-01-31

申请人： Hitoshi Odashima ,  Hiroshi Hasegawa ,  Masayuki Kawaharata ,  Hideyuki Fukasawa

发明人： Hitoshi Odashima ,  Hiroshi Hasegawa ,  Masayuki Kawaharata ,  Hideyuki Fukasawa

IPC分类号： B23P19/00 ,  H01L21/60 ,  F26B3/08

CPC分类号： H01L24/11 ,  B23P19/003 ,  H01L2224/11003 ,  H01L2224/11334 ,  H01L2224/13099 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01033 ,  H01L2924/01039 ,  H01L2924/01074 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/12042 ,  H01L2924/15787

摘要： The present invention is to define an enclosed space by covering a holder which can hold numerous minute particles, and introduce a fluid into the enclosed space to stir up the numerous minute particles within the enclosed space with a turbulent flow of the fluid so that the minute particles are placed in and held by the holder After stirring up and loading the minute particles in the holder, the fluid is introduced into the enclosed space again to recover the remaining minute particles which have not been held by the holder. The number of minute particles required for one cycle of the loading operation are taken out by moving a particle push-up shaft vertically, having a recess at the distal end thereof, within a stocker which stores a large number of minute particles, and then delivered to the enclosed space with the fluid.

摘要翻译： 本发明是通过覆盖能够容纳许多微小颗粒的保持器来限定封闭空间，并且将流体引入封闭空间中以在流体的湍流中将封闭空间内的许多微小颗粒搅动，使得分钟 颗粒放置在保持器中并保持器在搅拌并将微小颗粒装载在保持器中之后，再次将流体引入封闭空间中以回收未被保持器保持的剩余的微小颗粒。 通过在储存有大量微小颗粒的储料器内移动具有在其远端具有凹部的垂直方向的颗粒上推轴来取出装载操作的一个循环所需的微小颗粒数，然后传送 到流体的封闭空间。

公开(公告)号：US06677553B2

公开(公告)日：2004-01-13

申请号：US10285516

申请日：2002-11-01

申请人： Takashi Matsumoto ,  Shinichi Kazui ,  Masayuki Kawaharata ,  Madoka Tanouchi ,  Masatake Muranaga

发明人： Takashi Matsumoto ,  Shinichi Kazui ,  Masayuki Kawaharata ,  Madoka Tanouchi ,  Masatake Muranaga

IPC分类号： B23K2908

CPC分类号： H05K3/0029 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/52 ,  B32B18/00 ,  B32B38/0004 ,  B32B2310/0843 ,  C04B35/185 ,  C04B2235/665 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/74 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/163

摘要： A laser processing apparatus includes a stage for mounting a workpiece, which moves the workpiece along two axes which are in parallel with the workpiece, the two axes being perpendicular to one other; a laser optical unit including a light source uniting laser light for irradiating the workpiece mounted on the stage with laser light, a stage controller for controlling the movement of the stage in each direction of the two axes, a collecting lens for collecting laser light and irradiating the workpiece with the laser light; a casing for placing the collecting lens on an optical path of the laser light, and a driving unit for moving the casing in a direction parallel to the optical path of the laser light. The driving unit moves the casing and focuses a focal point of the collecting lens on the workpiece.

摘要翻译： 激光加工装置包括用于安装工件的台，该工件沿着与工件平行的两个轴移动工件，两个轴线彼此垂直; 激光光学单元，其包括用激光照射安装在舞台上的工件的激光的光源，用于控制舞台在两个轴方向上的移动的舞台控制器，用于收集激光的聚光透镜和照射 工件用激光灯; 用于将聚光透镜放置在激光的光路上的壳体，以及用于沿着与激光的光路平行的方向移动壳体的驱动单元。 驱动单元移动壳体并将聚光透镜的焦点聚焦在工件上。

公开(公告)号：US06498319B1

公开(公告)日：2002-12-24

申请号：US09631949

申请日：2000-08-03

申请人： Takashi Matsumoto ,  Shinichi Kazui ,  Masayuki Kawaharata ,  Madoka Tanouchi ,  Masatake Muranaga

发明人： Takashi Matsumoto ,  Shinichi Kazui ,  Masayuki Kawaharata ,  Madoka Tanouchi ,  Masatake Muranaga

IPC分类号： B23K2638

CPC分类号： H05K3/0029 ,  B23K26/40 ,  B23K2101/42 ,  B23K2103/172 ,  B23K2103/52 ,  B32B18/00 ,  B32B38/0004 ,  B32B2310/0843 ,  C04B35/185 ,  C04B2235/665 ,  C04B2237/348 ,  C04B2237/365 ,  C04B2237/74 ,  H01L21/481 ,  H05K1/0306 ,  H05K3/0052 ,  H05K3/4611 ,  H05K3/4629 ,  H05K2203/163

摘要： A plurality of green sheets are prepared, and at least one board pattern is formed on each of the sheets. The sheets are laminated and bonded with each other to form a multi-layer board. The unsintered multi-layer board is cut by irradiating the periphery of at least one board pattern on the surface of the multi-layer board with laser light. When the multi-layer board is cut, the width of the cut portion of the multi-layer board is measured. The cutting width is held constant by controlling the velocity at which the multi-layer board is cut, according to the measured width. Thus a section in the multi-layer board where at least one board pattern is formed is cut away from the other section of the multi-layer board. The cut away multi-layer board is then sintered. As a result, a multi-layer board is produced.

摘要翻译： 制备多个生片，并且在每个片上形成至少一个板图案。 将这些片层压并粘合在一起形成多层板。 通过用激光照射多层板的表面上的至少一个板图案的周边来切割未烧结的多层板。 当多层板被切割时，测量多层板的切割部分的宽度。 根据测量的宽度，通过控制多层板被切割的速度来保持切割宽度不变。 因此，在多层板中形成有至少一个板图案的部分被切割成多层板的另一部分。 然后将切割的多层板烧结。 结果，制造了多层板。