公开(公告)号：US20120105853A1

公开(公告)日：2012-05-03

申请号：US12943916

申请日：2010-11-10

Applicant: Lin Pang ,  Haiping Matthew Chen ,  Yeshaiahu Fainman

Inventor： Lin Pang ,  Haiping Matthew Chen ,  Yeshaiahu Fainman

IPC: G01N21/55

CPC classification number: G01N21/554 ,  G03H1/02

Abstract: Techniques, apparatus, material and systems are described for implementing a three-dimensional composite mushroom-like metallodielectric nanostructure. In one aspect, a surface plasmon based sensing device includes a substrate and a layer of an anti-reflective coating over the substrate. The surface Plasmon based sensing device includes a dielectric material on the anti-reflective coating shaped to form a 2-dimensional array of nanoholes spaced from one another. Also, the surface Plasmon based sensing device includes a layer of a metallic film formed on the 2-dimensional array of nanoholes to include openings over the nanoholes, respectively, wherein the sensing device is structured to support both propagating surface plasmon polariton (SPP) waves and localized surface plasmon resonant (LSPR) modes.

Abstract translation: 描述了用于实现三维复合蘑菇状金属介电纳米结构的技术，设备，材料和系统。 在一个方面，基于表面等离子体的感测装置包括衬底和衬底上的抗反射涂层层。 基于表面等离子体的感测装置包括在抗反射涂层上的介电材料，其被成形为形成彼此间隔开的纳米孔的二维阵列。 此外，表面等离子体感测装置还包括形成在纳米孔的二维阵列上的金属膜层，分别包括纳米孔上方的开口，其中感测装置构造成支持传播表面等离子体激元（SPP）波 和局部表面等离子体共振（LSPR）模式。

公开(公告)号：US08514398B2

公开(公告)日：2013-08-20

申请号：US12943916

申请日：2010-11-10

Applicant: Lin Pang ,  Haiping Matthew Chen ,  Yeshaiahu Fainman

Inventor： Lin Pang ,  Haiping Matthew Chen ,  Yeshaiahu Fainman

IPC: G01N21/55 ,  G01N21/00 ,  H01J49/00

CPC classification number: G01N21/554 ,  G03H1/02

Abstract: Techniques, apparatus, material and systems are described for implementing a three-dimensional composite mushroom-like metallodielectric nanostructure. In one aspect, a surface plasmon based sensing device includes a substrate and a layer of an anti-reflective coating over the substrate. The surface Plasmon based sensing device includes a dielectric material on the anti-reflective coating shaped to form a 2-dimensional array of nanoholes spaced from one another. Also, the surface Plasmon based sensing device includes a layer of a metallic film formed on the 2-dimensional array of nanoholes to include openings over the nanoholes, respectively, wherein the sensing device is structured to support both propagating surface plasmon polariton (SPP) waves and localized surface plasmon resonant (LSPR) modes.

Abstract translation: 描述了用于实现三维复合蘑菇状金属介电纳米结构的技术，设备，材料和系统。 在一个方面，基于表面等离子体的感测装置包括衬底和衬底上的抗反射涂层层。 基于表面等离子体的感测装置包括在抗反射涂层上的介电材料，其被成形为形成彼此间隔开的纳米孔的二维阵列。 此外，表面等离子体感测装置还包括形成在纳米孔的二维阵列上的金属膜层，分别包括纳米孔上方的开口，其中感测装置构造成支持传播表面等离子体激元（SPP）波 和局部表面等离子体共振（LSPR）模式。

公开(公告)号：US20140346686A1

公开(公告)日：2014-11-27

申请号：US14342157

申请日：2011-09-02

Applicant: Fu Peng ,  Zhong Lu ,  Chin Tien Chiu ,  Cheeman Yu ,  Matthew Chen ,  Weiting Jiang

Inventor： Fu Peng ,  Zhong Lu ,  Chin Tien Chiu ,  Cheeman Yu ,  Matthew Chen ,  Weiting Jiang

IPC: H01L23/544 ,  H01L23/28 ,  H01L21/56

CPC classification number: H01L21/565 ,  H01L21/56 ,  H01L21/561 ,  H01L21/566 ,  H01L23/28 ,  H01L23/544 ,  H01L23/552 ,  H01L24/73 ,  H01L24/97 ,  H01L2223/54406 ,  H01L2223/5442 ,  H01L2223/54433 ,  H01L2223/54486 ,  H01L2224/16225 ,  H01L2224/32145 ,  H01L2224/32245 ,  H01L2224/48091 ,  H01L2224/48227 ,  H01L2224/48247 ,  H01L2224/73265 ,  H01L2224/97 ,  H01L2225/0651 ,  H01L2225/06568 ,  H01L2924/1431 ,  H01L2924/1434 ,  H01L2924/181 ,  H01L2924/19041 ,  H01L2924/19042 ,  H01L2924/19043 ,  H01L2924/19105 ,  H01L2924/3025 ,  H01L2224/81 ,  H01L2224/85 ,  H01L2924/00012 ,  H01L2924/00 ,  H01L2924/00014

Abstract: A memory device including graphical content and a method of making the memory device with graphical content are disclosed. The graphical content is formed on a release media. The release media and the unencapsulated memory device are placed in a mold and encapsulated. During the encapsulation and curing of the molding compound, the graphical content is transferred from the release media to the encapsulated memory device.

Abstract translation: 公开了一种包括图形内容的存储设备和使具有图形内容的存储设备的方法。 图形内容形成在释放介质上。 将释放介质和未封装的存储器件放置在模具中并封装。 在模塑料的包封和固化期间，图形内容从释放介质转移到封装的存储器件。