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    SUBSTRATE PROCESSING SEQUENCE IN A CARTESIAN ROBOT CLUSTER TOOL
    3.
    发明申请
    SUBSTRATE PROCESSING SEQUENCE IN A CARTESIAN ROBOT CLUSTER TOOL 有权
    卡特彼勒机器人工具中的基板处理序列

    公开(公告)号：US20070147976A1

    公开(公告)日：2007-06-28

    申请号：US11553820

    申请日：2006-10-27

    申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： H01L21/677

    CPC分类号： B25J11/008 ,  B25J18/00 ,  G03F7/70991 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67225 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    Cartesian robot cluster tool architecture
    5.
    发明申请
    Cartesian robot cluster tool architecture 有权
    笛卡尔机器人集群工具架构

    公开(公告)号：US20060182536A1

    公开(公告)日：2006-08-17

    申请号：US11315984

    申请日：2005-12-22

    申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： H01L21/677

    CPC分类号： H01L21/68707 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    COOLING PLATES AND SEMICONDUCTOR APPARATUS THEREOF
    6.
    发明申请
    COOLING PLATES AND SEMICONDUCTOR APPARATUS THEREOF 有权
    冷却板及其半导体装置

    公开(公告)号：US20090211742A1

    公开(公告)日：2009-08-27

    申请号：US12246020

    申请日：2008-10-06

    申请人： HELDER LEE ,  Miriam Schwartz ,  Michael Kuchar ,  Aaron Webb ,  Theodoss Costuros

    发明人： HELDER LEE ,  Miriam Schwartz ,  Michael Kuchar ,  Aaron Webb ,  Theodoss Costuros

    IPC分类号： F28F3/12

    CPC分类号： F28F3/12 ,  H01L21/67109

    摘要： A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.

    摘要翻译： 冷却板包括用于传输流体的通道，其中通道设置在基座内，并且通道具有第一部分和第二部分。 第一部分基本上沿着基部的周边边缘设置，并且第二部分联接到第一部分并且被设置为比第一部分更远离基部的周边边缘。 第二部分具有与第一部分的长度一样长的至少约35％的长度。 冷却板还包括设置在基座和通道上的盖，其中盖为基底提供支撑。

    Substrate gripper for a substrate handling robot
    7.
    发明授权
    Substrate gripper for a substrate handling robot 有权
    用于基板处理机器人的基板夹具

    公开(公告)号：US07374391B2

    公开(公告)日：2008-05-20

    申请号：US11315873

    申请日：2005-12-22

    申请人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Michael Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Mario David Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： B25J15/00

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    Method of retaining a substrate during a substrate transferring process
    8.
    发明申请
    Method of retaining a substrate during a substrate transferring process 有权
    在衬底转移过程中保持衬底的方法

    公开(公告)号：US20070147982A1

    公开(公告)日：2007-06-28

    申请号：US11398218

    申请日：2006-04-05

    申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean Hruzek ,  Mario Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： H01L21/677

    CPC分类号： H01L21/67178 ,  H01L21/67173 ,  H01L21/67276 ,  H01L21/67742 ,  H01L21/67745 ,  H01L21/67748 ,  H01L21/68707

    摘要： A method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, increased system reliability, improved device yield performance, a more repeatable wafer processing history (or wafer history), and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. In one aspect, the parallel processing configuration contains two or more robot assemblies that are adapted to move in a vertical and horizontal directions, to access the various processing chambers retained in generally adjacently positioned processing racks. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool. The flexible and modular architecture allows the user to configure the number of processing chambers, processing racks, and processing robots required to meet the throughput needs of the user.

    摘要翻译： 一种使用多室处理系统或集群工具处理衬底的方法和设备，其具有增加的系统吞吐量，增加的系统可靠性，改进的器件产量性能，更可重复的晶片处理历史（或晶片历史）以及减少的 脚印。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 在一个方面，并行处理配置包括两个或更多个机器人组件，其适于在垂直和水平方向上移动，以访问保持在通常相邻定位的处理机架中的各种处理室。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。 灵活和模块化的架构允许用户配置满足用户吞吐量需求所需的处理室，处理机架和处理机器人的数量。

    Cooling plates and semiconductor apparatus thereof
    9.
    发明授权
    Cooling plates and semiconductor apparatus thereof 有权
    冷却板及其半导体装置

    公开(公告)号：US09091491B2

    公开(公告)日：2015-07-28

    申请号：US12246020

    申请日：2008-10-06

    申请人： Helder Lee ,  Miriam Schwartz ,  Michael Kuchar ,  Aaron Webb ,  Theodoss Costuros

    发明人： Helder Lee ,  Miriam Schwartz ,  Michael Kuchar ,  Aaron Webb ,  Theodoss Costuros

    IPC分类号： C23C16/50 ,  C23C16/00 ,  C23F1/00 ,  H01L21/306 ,  F28F3/12 ,  H01L21/67

    CPC分类号： F28F3/12 ,  H01L21/67109

    摘要： A cooling plate includes a channel to transmit a fluid, wherein the channel is disposed within a base and the channel has a first portion and a second portion. The first portion is disposed substantially along a peripheral edge of the base, and the second portion is coupled to the first portion and is disposed further away from the peripheral edge of the base than the first portion. The second portion has a length that is at least about 35% as long as the length of the first portion. The cooling plate also includes a lid disposed over the base and the channel, wherein the lid provides support for a substrate.

    摘要翻译： 冷却板包括用于传输流体的通道，其中通道设置在基座内，并且通道具有第一部分和第二部分。 第一部分基本上沿着基部的周边边缘设置，并且第二部分联接到第一部分并且被设置为比第一部分更远离基部的周边边缘。 第二部分具有与第一部分的长度一样长的至少约35％的长度。 冷却板还包括设置在基座和通道上的盖，其中盖为基底提供支撑。

    Cartesian robot cluster tool architecture
    10.
    发明授权
    Cartesian robot cluster tool architecture 有权
    笛卡尔机器人集群工具架构

    公开(公告)号：US07651306B2

    公开(公告)日：2010-01-26

    申请号：US11315984

    申请日：2005-12-22

    申请人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    发明人： Mike Rice ,  Jeffrey Hudgens ,  Charles Carlson ,  William Tyler Weaver ,  Robert Lowrance ,  Eric Englhardt ,  Dean C. Hruzek ,  Dave Silvetti ,  Michael Kuchar ,  Kirk Van Katwyk ,  Van Hoskins ,  Vinay Shah

    IPC分类号： H01L21/677

    CPC分类号： H01L21/68707 ,  H01L21/67173 ,  H01L21/67178 ,  H01L21/67184 ,  H01L21/67742 ,  H01L21/67745 ,  Y10S414/135

    摘要： Embodiments of the invention provide a method and apparatus for processing substrates using a multi-chamber processing system, or cluster tool, that has an increased system throughput, and a reduced footprint. The various embodiments of the cluster tool may utilize two or more robots that are configured in a parallel processing configuration to transfer substrates between the various processing chambers retained in the processing racks so that a desired processing sequence can be performed on the substrates. Generally, the various embodiments described herein are advantageous since each row or group of substrate processing chambers are serviced by two or more robots to allow for increased throughput and increased system reliability. Also, the various embodiments described herein are generally configured to minimize and control the particles generated by the substrate transferring mechanisms, to prevent device yield and substrate scrap problems that can affect the cost of ownership of the cluster tool.

    摘要翻译： 本发明的实施例提供了一种使用多室处理系统或集群工具处理衬底的方法和装置，其具有增加的系统吞吐量和减小的占地面积。 群集工具的各种实施例可以使用以并行处理配置配置的两个或更多个机器人，以在保留在处理机架中的各种处理室之间传送衬底，使得可以在衬底上执行期望的处理顺序。 通常，这里描述的各种实施例是有利的，因为每行或一组衬底处理室由两个或更多个机器人来维护，以允许增加的生产量和增加的系统可靠性。 此外，本文所述的各种实施例通常被配置为最小化和控制由衬底传送机构产生的颗粒，以防止可能影响群集工具的所有权成本的装置产量和衬底废料问题。