FINGERPRINT SENSOR WITH LIVENESS DETECTION
    1.
    发明申请

    公开(公告)号:US20200302143A1

    公开(公告)日:2020-09-24

    申请号:US16860730

    申请日:2020-04-28

    摘要: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

    Fingerprint sensor with liveness detection

    公开(公告)号:US10664684B2

    公开(公告)日:2020-05-26

    申请号:US15748943

    申请日:2017-06-02

    摘要: A fingerprint sensor device with built-in liveness detection capabilities includes: an area sensor disposed on a top surface of a substrate; a stiffener disposed below a bottom surface of the substrate; a printed circuit making electrical connection to the sensor disposed below the stiffener; and a light source and a photodetector. At least one of the light source and photodetector is disposed on the printed circuit below the area sensor. The stiffener includes at least one through-hole located with respect to the light source or photodetector to allow light from the light source to transmit through the stiffener towards a finger located on the area sensor or to allow light reflected from the finger to pass through the stiffener to the photodetector.

    THERMALLY CONDUCTIVE AND PROTECTIVE COATING FOR ELECTRONIC DEVICE

    公开(公告)号:US20200019750A1

    公开(公告)日:2020-01-16

    申请号:US16506629

    申请日:2019-07-09

    IPC分类号: G06K9/00 H01L23/28

    摘要: A protective coating layer, an electronic device including such a protective coating layer, and the methods of making the same are provided. The electronic device includes a substrate, a thin film circuit layer disposed over the substrate, and a protective coating layer disposed over the thin film circuit layer. The protective coating layer includes a first coating and a second coating disposed over the first coating. Each coating has a cross-plane thermal conductivity in a direction normal to a respective coating surface equal to or higher than 0.5 W/(m*K). The first coating and the second coating have different crystal structures, or different crystalline orientations, or different compositions, or a combination thereof to provide different nanoindentation hardness. The first coating has a hardness lower than that of the second coating.

    SENSOR AND SYSTEM FOR BIOMETRIC SENSING HAVING MULTI-SEGMENT ARCHITECTURE, AND METHODS OF USING THE SAME

    公开(公告)号:US20240029468A1

    公开(公告)日:2024-01-25

    申请号:US18479454

    申请日:2023-10-02

    IPC分类号: G06V40/13 G06V40/12

    CPC分类号: G06V40/13 G06V40/1359

    摘要: A multi-segment pixel matrix, a sensor or device, a system, and a method, for biometric sensing, are provided. Such a device or system includes a sensor comprising a pixel matrix having two or more pixel arrays as separate segments logically divided in the pixel matrix. The pixel matrix may include both thermal sensing pixels and capacitive sensing nodes. The device or system may include a plurality of application-specific intergrade circuits (ASICs) coupled to the sensor. Each ASIC is configured to capture image data of a biometric pattern measured by at least one pixel array. Each pixel array is independently driven and scanned by one or more of the plurality of the ASICs. The device or system further includes a microcontroller unit coupled to the plurality of ASICs and are used to process the image data and/or control operation of the system. Such a sensor can be a fingerprint sensor.

    Sensors configured to operate at multiple resolutions

    公开(公告)号:US11132522B2

    公开(公告)日:2021-09-28

    申请号:US16536918

    申请日:2019-08-09

    IPC分类号: G06K9/00 G06K9/03

    摘要: In one aspect, a sensor includes an image acquisition controller and a pixel array. The pixel array includes a first set of pixels electrically coupled to the controller and a second set of pixels electrically coupled to the controller. The sensor is configured to operate in a first mode and a second mode. When operating in the first mode, the controller is configured to acquire signals from only the first set of pixels for generating a low-resolution image. When operating in the second mode, the controller is configured to acquire signals from both the first set of pixels and the second set of pixels for generating a high-resolution image.

    SENSORS CONFIGURED TO OPERATE AT MULTIPLE RESOLUTIONS

    公开(公告)号:US20210042489A1

    公开(公告)日:2021-02-11

    申请号:US16536918

    申请日:2019-08-09

    IPC分类号: G06K9/00 G06K9/03

    摘要: In one aspect, a sensor includes an image acquisition controller and a pixel array. The pixel array includes a first set of pixels electrically coupled to the controller and a second set of pixels electrically coupled to the controller. The sensor is configured to operate in a first mode and a second mode. When operating in the first mode, the controller is configured to acquire signals from only the first set of pixels for generating a low-resolution image. When operating in the second mode, the controller is configured to acquire signals from both the first set of pixels and the second set of pixels for generating a high-resolution image.

    Sensor and system for biometric sensing having multi-segment architecture, and methods of using the same

    公开(公告)号:US11790684B2

    公开(公告)日:2023-10-17

    申请号:US17568181

    申请日:2022-01-04

    IPC分类号: G06V40/13 G06V40/12

    CPC分类号: G06V40/13 G06V40/1359

    摘要: A multi-segment pixel matrix, a sensor or device, a system, and a method, for biometric sensing, are provided. Such a device or system includes a sensor comprising a pixel matrix having two or more pixel arrays as separate segments logically divided in the pixel matrix. The pixel matrix may include both thermal sensing pixels and capacitive sensing nodes. The device or system may include a plurality of application-specific intergrade circuits (ASICs) coupled to the sensor. Each ASIC is configured to capture image data of a biometric pattern measured by at least one pixel array. Each pixel array is independently driven and scanned by one or more of the plurality of the ASICs. The device or system further includes a microcontroller unit coupled to the plurality of ASICs and are used to process the image data and/or control operation of the system. Such a sensor can be a fingerprint sensor.

    BIOMETRIC SENSOR WITH PRESENCE SENSORS

    公开(公告)号:US20220366718A1

    公开(公告)日:2022-11-17

    申请号:US17642834

    申请日:2020-09-21

    IPC分类号: G06V40/13 G06V40/12

    摘要: In one embodiment, a sensor system includes an active thermal sensor pixel matrix, a plurality of presence sensors, and an image acquisition controller. The pixel matrix includes a plurality of pixels arranged in a plurality of rows and a plurality of columns and a boundary defining a perimeter. The plurality of presence sensors is disposed at least partially within the boundary of the pixel matrix. The image acquisition controller is coupled to the pixel matrix and the plurality of presence sensors. The image acquisition controller is configured to: (i) receive signals from the presence sensors; (ii) identify, based on the signals, a scan region, wherein the scan region is a portion of the pixel matrix that is in contact with or adjacent to a specimen; and (iii) obtain image data only from pixels that are within the scan region for generating an image of the specimen.

    SYSTEMS AND METHODS FOR MANUFACTURING FLEXIBLE ELECTRONICS

    公开(公告)号:US20200335397A1

    公开(公告)日:2020-10-22

    申请号:US16850729

    申请日:2020-04-16

    IPC分类号: H01L21/78 H01L21/56 H01L21/84

    摘要: Systems and methods for manufacturing flexible electronics are described herein. Methods in accordance with embodiments of the present technology can include disposing electrical features, such as thin film circuits, on a first side of a glass substrate, applying a first protective material over the electronic features, and exposing a second side of the glass substrate to a chemical etching tank to thin the glass substrate to a predetermined thickness. The thinning process can remove cracks and other defects from the second side of the glass substrate and enhance the flexibility of the electronic assembly. A second protective material can be disposed on the second side of the thinned glass substrate to maintain the enhanced backside surface of the glass substrate. In some embodiments, the method also includes singulating the plurality of electronic features into individual electronic components by submerging the electronic assembly into a chemical etching tank.