公开(公告)号：US20070265256A1

公开(公告)日：2007-11-15

申请号：US11708866

申请日：2007-02-20

Applicant: Mark Arrington ,  Ruiping Liu ,  Allen Hopper ,  Richard Conticello ,  Truc Nguyen ,  Carla Gauss ,  Roland Burli ,  Stephen Hitchcock ,  Essa Hu ,  Roxanne Kunz ,  Thomas Nixey ,  Shannon Rumfelt ,  Nign Chen

Inventor： Mark Arrington ,  Ruiping Liu ,  Allen Hopper ,  Richard Conticello ,  Truc Nguyen ,  Carla Gauss ,  Roland Burli ,  Stephen Hitchcock ,  Essa Hu ,  Roxanne Kunz ,  Thomas Nixey ,  Shannon Rumfelt ,  Nign Chen

IPC: A61K31/535 ,  A61K31/50 ,  A61P25/18 ,  C07D237/26 ,  C07D413/00

CPC classification number: C07D237/28 ,  C07D401/04 ,  C07D401/12 ,  C07D401/14 ,  C07D403/04 ,  C07D403/10 ,  C07D405/10 ,  C07D405/14 ,  C07D409/10 ,  C07D409/14 ,  C07D413/04 ,  C07D413/10 ,  C07D413/14 ,  C07D417/04 ,  C07D417/10 ,  C07D417/14 ,  C07D471/04 ,  C07D487/04 ,  C07D513/04

Abstract: The present invention is directed to certain cinnoline compounds that are PDE10 inhibitors, pharmaceutical compositions containing such compounds and process for preparing such compounds. This invention is also directed to methods of treating diseases treatable by inhibition of PDE10 enzyme, such as obesity, non-insulin dependent diabetes, schizophrenia, bipolar disorder, obsessive-compulsive disorder, and the like.

Abstract translation: 本发明涉及某些作为PDE10抑制剂的噌啉化合物，含有这些化合物的药物组合物及其制备方法。 本发明还涉及通过抑制PDE10酶如肥胖症，非胰岛素依赖型糖尿病，精神分裂症，双相情感障碍，强迫症等治疗疾病的方法。

公开(公告)号：US5825054A

公开(公告)日：1998-10-20

申请号：US581246

申请日：1995-12-29

Applicant: Biing-Jye Lee ,  Horng-Nign Chen ,  Jung-Tsung Hsu

Inventor： Biing-Jye Lee ,  Horng-Nign Chen ,  Jung-Tsung Hsu

IPC: H01L23/29 ,  H01L23/31 ,  H01L33/48 ,  H01L33/58 ,  H01L33/64 ,  H01S5/00 ,  H01S5/022 ,  H01L33/00

CPC classification number: H01L33/483 ,  H01L33/58 ,  H01L33/642 ,  H01S5/02244 ,  H01L2224/45144 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/01079 ,  H01S5/0222 ,  H01S5/02228 ,  H01S5/02288

Abstract: A plastic-molded apparatus for a semiconductor laser is disclosed, which comprise: a first lead having a broad end thereof serving as a mounting plate; a second lead located at one side of the first lead; a third lead located at other side of the first lead; a submount, disposed on a front end of the mounting plate, having a semiconductor laser chip disposed thereon, electrically connected to the second lead, and a monitor detector disposed on the mounting plate closely adjacent to the submount, electrically connected to the third lead, for receiving backward light from the semiconductor laser chip; a plastic-molded header to fix the first lead, the second lead and the third lead; and a transparent cap, adapted to the plastic-molded header, for sealing all components including the laser chip, the monitor detector and peripheral parts on the plastic-molded header.

Abstract translation: 公开了一种用于半导体激光器的塑料成型装置，其包括：具有其宽端作为安装板的第一引线; 位于第一引线一侧的第二引线; 第三个引线位于第一引线的另一侧; 设置在安装板的前端上的基座，其上设置有与第二引线电连接的半导体激光器芯片，以及监视器检测器，与第二引线紧密相邻的安装板设置， 用于从半导体激光芯片接收反向光; 用于固定第一引线，第二引线和第三引线的塑料模制接头; 以及适用于塑料模制头部的透明盖，用于密封包括激光芯片，监视器检测器和塑料模制头部上的周边部件的所有部件。