公开(公告)号：US5316786A

公开(公告)日：1994-05-31

申请号：US820069

申请日：1992-01-09

申请人： Norbert von der Lippe ,  Rudolf Graener ,  Peter Sommer

发明人： Norbert von der Lippe ,  Rudolf Graener ,  Peter Sommer

IPC分类号： H05K1/05 ,  H05K3/44 ,  C23C26/00

CPC分类号： H05K3/44 ,  H05K1/053 ,  H05K2203/025 ,  H05K2203/302

摘要： A method of pre-treating steel-hybrid circuit board substrates or carrier plates before the application of coatings that are to be burnt in or fired. In prior art steel-hybrid circuit boards of this type, the burning-in of the coatings in a kiln produces undesirable warping of the circuit boards due to the different coefficients of thermal expansion of the materials employed for the coatings and for the carrier plates, unless relatively thick steel-hybrid circuit board carrier plates are employed. This warping is avoided, while still permitting the use of steel hybrid circuit boards of a lesser thickness, by pre-treating the steel-hybrid circuit board carrier plates to provide same with a mechanical pre-stress causing a defined curvature which compensates for the warping of the circuit board to be expected during burn-in.

摘要翻译： 在施加要燃烧或发射的涂层之前，先对钢 - 混合电路板基板或承载板进行预处理的方法。 在现有技术的这种类型的钢 - 混合电路板中，由于用于涂层和载体板的材料的不同的热膨胀系数，窑中的涂层的燃烧会导致电路板的不期望的翘曲， 除非使用相对较厚的钢 - 混合电路板承载板。 避免这种翘曲，同时仍然允许使用较小厚度的钢混合电路板，通过预处理钢 - 混合电路板承载板以提供相同的机械预应力，产生限定曲率，补偿翘曲 的电路板预期在老化期间。

公开(公告)号：US5426568A

公开(公告)日：1995-06-20

申请号：US171473

申请日：1993-12-23

申请人： Johannes Lamers ,  Norbert von der Lippe ,  Peter Sommer ,  Dietmar Stoffels

发明人： Johannes Lamers ,  Norbert von der Lippe ,  Peter Sommer ,  Dietmar Stoffels

IPC分类号： H05K1/02 ,  H05K1/03 ,  H05K3/00 ,  H05K3/28 ,  H05K3/30 ,  H05K7/02 ,  H05K1/00 ,  H05K1/11

CPC分类号： H05K3/303 ,  H05K1/0271 ,  H05K3/0058 ,  H05K1/036 ,  H05K2201/0133 ,  H05K2201/0195 ,  H05K2201/09872 ,  H05K2201/10727 ,  H05K2201/2045 ,  H05K3/284 ,  H05K3/305 ,  Y02P70/613

摘要： A launch-protected electronic assembly including a printed circuit board having several conductor paths. An electronic component is provided that is secured to the printed circuit board. The electronic component has several electrical connections each contacting a corresponding conductor path. The assembly further includes a support and at least one of a flexible adhesive layer and a dot-shaped flexible adhesive location connecting the printed circuit board to the support.

摘要翻译： 发射保护的电子组件，其包括具有多个导体路径的印刷电路板。 提供固定到印刷电路板的电子部件。 电子部件具有多个电连接，每个接触相应的导体路径。 组件还包括支撑件和将印刷电路板连接到支撑件的柔性粘合剂层和点状柔性粘合剂位置中的至少一个。

公开(公告)号：US5375517A

公开(公告)日：1994-12-27

申请号：US15907

申请日：1993-02-10

申请人： Rudolf Graener ,  Norbert Von Der Lippe ,  Peter Sommer

发明人： Rudolf Graener ,  Norbert Von Der Lippe ,  Peter Sommer

IPC分类号： B41F15/08 ,  B41F15/18 ,  H05K3/12 ,  H05K3/44 ,  B41M1/12

CPC分类号： B41F15/18 ,  H05K3/1216

摘要： An apparatus for screen printing on a thin, curved steel hybrid board includes a receiving frame having a nest for seating the board therein; and a magnet accommodated in the receiving frame for maintaining the board in a flattened state during the screen printing operation.

摘要翻译： 一种用于在薄的弯曲钢混合板上进行丝网印刷的装置包括具有用于将板安置在其中的嵌套的接收框架; 以及容纳在接收框架中的磁体，用于在丝网印刷操作期间将板维持在平坦状态。