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公开(公告)号：US20080070022A1
公开(公告)日：2008-03-20
申请号：US11822110
申请日：2007-07-02
Applicant: Norio Umezu , Kazumasa Mizui
Inventor： Norio Umezu , Kazumasa Mizui
CPC classification number: B01D46/521 , B01D39/1623 , B01D2239/0659 , B01D2275/10 , F02M35/024 , Y10T428/249978 , Y10T428/249979 , Y10T428/24998 , Y10T442/666 , Y10T442/667 , Y10T442/682
Abstract: An air filter material includes a laminate of an air inlet layer and an air outlet layer, and has a mean flow pore size of 20 μm to 40 μm, a minimum pore size of 2.4 μm to 3.8 μm, and a maximum pore size of 80 μm or less. The air inlet layer is a needle punched nonwoven fabric layer having an areal fiber weight of 55 g/m2 to 100 g/m2. The air outlet layer is a laminated spunlace nonwoven fabric made by laminating at least two or more spunlace nonwoven fabric layers having an areal fiber weight of 20 g/m2 to 60 g/m2, a mean flow pore size of 50 μm to 90 μm, a minimum pore size of 3.0 μm to 10.0 μm, and a maximum pore size of 180 μm or less.
Abstract translation: 空气过滤材料包括空气入口层和空气出口层的叠层，平均流孔径为20〜40μm，最小孔径为2.4μm〜3.8μm，最大孔径为80μm 妈妈或更少。 进气层是面积纤维重量为55g / m 2〜100g / m 2的针刺无纺布层。 空气出口层是通过将至少两个以上的面积纤维重量为20g / m 2以上的水刺无纺布层层压至60g / m 2以上而制成的层压水刺无纺布， 平均流孔径为50〜90μm，最小孔径为3.0〜10.0μm，最大孔径为180μm以下。
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公开(公告)号：US5240767A
公开(公告)日：1993-08-31
申请号：US652979
申请日：1991-02-08
Applicant: Norio Umezu , Toshiyuki Nishijima , Sampei Kobayashi , Noboru Tsukahara , Shinichi Fukui
Inventor： Norio Umezu , Toshiyuki Nishijima , Sampei Kobayashi , Noboru Tsukahara , Shinichi Fukui
CPC classification number: D06P5/001 , D04H1/587 , D04H1/64 , Y10T442/2074 , Y10T442/2107
Abstract: A nonwoven fabric, particularly composed by long-stock synthetic resin yarns such as polyethylene and polypropylene is provided at one or both surfaces thereof with an ink-setting layer formed by coating, drying and curing a resin composition containing some of acrylic resins, synthetic rubbers and polyester resins. The ink-setting layer is excellent in the transfer property and fixing ability to an oil ink which is ordinarily used for offset printing, and prevents the nonwoven fabric from being swelled or transformed by a petroleum high-boiling-point solvent contained in the oil ink. Preferably, a low-temperature cross-linking agent is incorporated with the resin composition of the ink-setting layer so as to complete cross-linking of the resin composition at a low temperature at which heat shrinkage or heat damage of the nonwoven fabric will not be caused, in a shortened period of time. Moreover, when 10 to 40% by weight of non-calcined clay, 1 to 15% by weight of titanium dioxide and 1 to 10% by weight of calcium carbonate or calcined clay are incorporated as fillers in the resin composition of the ink-setting layer, the ink-setting layer has improved absorbability, drying ability and fixing ability to a printing ink. A preferable construction of the nonwoven fabric has a first layer containing the low-temperature cross-linking agent and a second layer containing the specific filler ingredients.
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公开(公告)号：US5198294A
公开(公告)日：1993-03-30
申请号：US732070
申请日：1991-07-18
Applicant: Takuichiro Masuda , Norio Umezu , Yutaka Saisho
Inventor： Takuichiro Masuda , Norio Umezu , Yutaka Saisho
CPC classification number: B32B5/06 , B01D39/1623 , D04H1/492 , D04H1/498 , B01D2239/0407 , B01D2239/0464 , B01D2239/065 , B01D2239/1233 , Y10T442/667 , Y10T442/682
Abstract: An air-filtering material exchangeably attached to a home-use or automobile air filter comprises a water jet type nonwoven fabric at an air outlet side and another type nonwoven fabric or fiber assembly at an air inlet side. These nonwoven fabric sheets are laminated on one another by needle punching. The water jet type nonwoven fabric is made from crowded finer fiber staples, and bits formed therein by penetration of needles of a needle punching machine may be stopped up by centripetally moving fiber staples surrounding the bits.
Abstract translation: 可交换地连接到家用或汽车空气过滤器的空气过滤材料包括在空气出口侧的喷水型无纺布和在空气入口侧的另一种类型的无纺布或纤维组件。 这些无纺织物片通过针刺彼此层压。 喷水型无纺布由拥挤的细纤维钉制成，并且通过针刺机的针穿刺形成的钻头可以通过向心地移动围绕钻头的纤维钉来停止。
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Patent Agency Ranking
公开(公告)号：US07652358B2
公开(公告)日：2010-01-26
申请号：US12136117
申请日：2008-06-10
Applicant: Atsushi Minakawa , Mamoru Sekiya , Norio Umezu
Inventor： Atsushi Minakawa , Mamoru Sekiya , Norio Umezu
IPC: H01L23/495
CPC classification number: H01L23/4006 , H01L25/112 , H01L2023/4056 , H01L2924/0002 , H05K1/0203 , H05K1/14 , H05K3/301 , H05K3/366 , H05K2201/10166 , H05K2201/10409 , H05K2201/1056 , H01L2924/00
Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.
Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主衬底散热片，其中，辅助基板散热器和主衬底散热片彼此固定，使得在辅助衬底和主衬底之间存在预定的位置关系 。
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5.发明申请SEMICONDUCTOR DEVICE INCLUDING MAIN SUBSTRATE AND SUB SUBSTRATES AND FABRICATION METHOD OF THE SAME 失效包括主基板和子基板的半导体器件及其制造方法公开(公告)号：US20090121342A1
公开(公告)日：2009-05-14
申请号：US12136117
申请日：2008-06-10
Applicant: Atsushi MINAKAWA , Mamoru SEKIYA , Norio UMEZU
Inventor： Atsushi MINAKAWA , Mamoru SEKIYA , Norio UMEZU
CPC classification number: H01L23/4006 , H01L25/112 , H01L2023/4056 , H01L2924/0002 , H05K1/0203 , H05K1/14 , H05K3/301 , H05K3/366 , H05K2201/10166 , H05K2201/10409 , H05K2201/1056 , H01L2924/00
Abstract: A semiconductor device according to a preferred embodiment of the present invention is a semiconductor device including a main substrate and one or more sub substrates, and the semiconductor device includes first heat generating devices mounted on the sub substrates, sub-substrate heatsinks mounted to the first heat generating devices, and a main-substrate heatsink mounted to the main substrate, wherein the sub-substrate heatsinks and the main-substrate heatsink are secured to each other, such that there is a predetermined positional relationship between the sub substrates and the main substrate.
Abstract translation: 根据本发明的优选实施例的半导体器件是包括主衬底和一个或多个子衬底的半导体器件，并且半导体器件包括安装在子衬底上的第一发热器件，安装到第一衬底的子衬底散热器 发热装置和安装在主基板上的主基板散热器，其中，辅助基板散热器和主基板散热器彼此固定，使得在子基板和主基板之间存在预定的位置关系 。
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公开(公告)号：US07968176B2
公开(公告)日：2011-06-28
申请号：US11822110
申请日：2007-07-02
Applicant: Norio Umezu , Kazumasa Mizui
Inventor： Norio Umezu , Kazumasa Mizui
IPC: B32B5/06
CPC classification number: B01D46/521 , B01D39/1623 , B01D2239/0659 , B01D2275/10 , F02M35/024 , Y10T428/249978 , Y10T428/249979 , Y10T428/24998 , Y10T442/666 , Y10T442/667 , Y10T442/682
Abstract: An air filter material includes a laminate of an air inlet layer and an air outlet layer, and has a mean flow pore size of 20 μm to 40 μm, a minimum pore size of 2.4 μm to 3.8 μm, and a maximum pore size of 80 μm or less. The air inlet layer is a needle punched nonwoven fabric layer having an areal fiber weight of 55 g/m2 to 100 g/m2. The air outlet layer is a laminated spunlace nonwoven fabric made by laminating at least two or more spunlace nonwoven fabric layers having an areal fiber weight of 20 g/m2 to 60 g/m2, a mean flow pore size of 50 μm to 90 μm, a minimum pore size of 3.0 μm to 10.0 μm, and a maximum pore size of 180 μm or less.
Abstract translation: 空气过滤材料包括空气入口层和空气出口层的叠层，平均流动孔径为20μm至40μm，最小孔径为2.4μm至3.8μm，最大孔径为80 μm以下。 进气层是面层纤维重量为55g / m 2〜100g / m 2的针刺无纺布层。 空气出口层是通过层叠至少两层以上的面层纤维重量为20g / m 2〜60g / m 2的平均流量孔径为50μm〜90μm的射流喷网制无纺布而制成的层叠水刺无纺布， 最小孔径为3.0μm〜10.0μm，最大孔径为180μm以下。
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公开(公告)号：US06765449B2
公开(公告)日：2004-07-20
申请号：US10368695
申请日：2003-02-19
Applicant: Kazutaka Murayama , Sadatoshi Hisamoto , Norio Umezu , Yoshitaka Handa , Shuichi Hiza
Inventor： Kazutaka Murayama , Sadatoshi Hisamoto , Norio Umezu , Yoshitaka Handa , Shuichi Hiza
IPC: H03K708
Abstract: A pulse width modulation circuit of the present invention includes: pulse generation means being provided with a first power supply and charged with a first current and a second current between which a constant current is distributed to turn ON/OFF a switching element, thereby generating a pulse from a first output section; pulse modulation means for controlling the charging while controlling a distribution ratio between the first current and the second current based on an input signal, thereby changing a pulse width of the output pulse; and first short circuit means for shorting the first output section with the first power supply when the pulse being output from the first output section transitions to a voltage of the first power supply.
Abstract translation: 本发明的脉冲宽度调制电路包括：脉冲发生装置，设有第一电源并充电第一电流和第二电流，在该第一电流和第二电流之间分配有恒定电流以使开关元件导通/断开，从而产生 来自第一输出部的脉冲; 脉冲调制装置，用于控制充电，同时基于输入信号控制第一电流和第二电流之间的分配比，从而改变输出脉冲的脉冲宽度; 以及第一短路装置，用于当从第一输出部分输出的脉冲转变到第一电源的电压时，用第一电源使第一输出部分短路。
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公开(公告)号：US06984887B2
公开(公告)日：2006-01-10
申请号：US10741472
申请日：2003-12-18
Applicant: Norio Umezu , Sadatoshi Hisamoto , Kazutaka Murayama
Inventor： Norio Umezu , Sadatoshi Hisamoto , Kazutaka Murayama
IPC: H01L23/10
CPC classification number: H01L23/367 , H01L2924/0002 , H01L2924/3011 , H05K1/0203 , H05K1/0231 , H05K2201/10166 , H05K2201/10446 , H05K2201/10454 , H01L2924/00
Abstract: A heatsink arrangement attached to a semiconductor device includes: a first heatsink placed in close contact with the semiconductor device; and second heatsink placed in close contact with the first heatsink, wherein the first heatsink and the second heatsink are connected to a power supply circuit for the semiconductor device via first connector and second connector, respectively. Thus, the present invention provides a heatsink arrangement for a semiconductor device used in an electric/electronic circuit that radiates less high-frequency noise even when a large current flows through the semiconductor device and that provides a high heat-radiating efficiency.
Abstract translation: 连接到半导体器件的散热器布置包括：与半导体器件紧密接触放置的第一散热器; 并且第二散热器与第一散热器紧密接触，其中第一散热器和第二散热器分别经由第一连接器和第二连接器连接到用于半导体器件的电源电路。 因此，本发明提供了一种用于电气/电子电路中的半导体器件的散热装置，即使当大电流流过半导体器件并且提供高的散热效率时，辐射较少的高频噪声。
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