摘要:
In a method for joining work pieces of transparent plastic material, wherein absorption layers are applied to an interface area between the work pieces to be joined and, wherein the work piece areas to be joined are firmly engaged and pressed together, and the interface area is subjected to laser radiation so that the absorption layer is heated and the work pieces are joined by welding, the absorption layer consists of carbon or gold with a thickness of 5 nm to 15 nm.
摘要:
A carrier structure (100), particularly for optical components, includes a carrier body (10) which is formed from ceramic with hollows (11), and at least one cover layer (21, 22) which is formed from glass, arranged on at least one surface of the carrier body (10), and is connected to the carrier body (10) by means of at least one bond connection (23, 24) produced by means of anodic bonding. Methods for producing the carrier structure (100) and the use of the carrier structure as a mirror body, carrier for optical components and/or mechanical carrier for dynamically moved components are also described.