公开(公告)号：US08864141B2

公开(公告)日：2014-10-21

申请号：US12349116

申请日：2009-01-06

Applicant: Colin John West ,  David Alistair Sutton

Inventor： Colin John West ,  David Alistair Sutton

IPC: F16J15/08 ,  F16J15/10 ,  B29C43/14 ,  B29C43/20 ,  B29C43/00 ,  B29C43/52 ,  B29K307/00 ,  B29K105/00 ,  B29C65/00 ,  B29C43/36 ,  B29K21/00 ,  B29K83/00 ,  B29C35/02 ,  B29K105/24 ,  B29K27/12

CPC classification number: F16J15/104 ,  B29C35/02 ,  B29C43/003 ,  B29C43/146 ,  B29C43/203 ,  B29C43/52 ,  B29C66/7375 ,  B29C2043/148 ,  B29C2043/3634 ,  B29K2021/00 ,  B29K2027/12 ,  B29K2083/00 ,  B29K2105/0023 ,  B29K2105/246 ,  B29K2305/14 ,  B29K2307/00 ,  B29K2995/0005 ,  F05C2201/0421 ,  F05C2203/0808 ,  F05C2225/02 ,  B29C65/00

Abstract: A blade seal comprising: a base; a tip; a first part formed from an elastomeric material which extends continuously from the base to the tip; and a second part formed from an elastomeric material mixed with conductive filler which extends continuously from the base to the tip. The blade seal is manufactured by compressing the first and second parts together; and curing one or both of the parts as they are compressed together.

Abstract translation: 一种叶片密封件，包括：基部; 一个提示; 由弹性体材料形成的第一部分，其从基部连续延伸到尖端; 以及由与从底部连续延伸到尖端的导电填料混合的弹性体材料形成的第二部分。 叶片密封件通过将第一和第二部件压缩在一起来制造; 并且当它们被压缩在一起时固化部件中的一个或两个。

公开(公告)号：US20090114341A1

公开(公告)日：2009-05-07

申请号：US11718651

申请日：2006-07-11

Applicant: Yasuo Suzuki ,  Naohiro Morozumii

Inventor： Yasuo Suzuki ,  Naohiro Morozumii

IPC: C09J5/00

CPC classification number: B29C51/16 ,  B29C51/08 ,  B29C63/0073 ,  B29C65/1422 ,  B29C65/1432 ,  B29C65/1445 ,  B29C65/1467 ,  B29C65/4815 ,  B29C65/4835 ,  B29C65/5057 ,  B29C65/823 ,  B29C65/8253 ,  B29C65/8261 ,  B29C66/001 ,  B29C66/1122 ,  B29C66/301 ,  B29C66/344 ,  B29C66/5326 ,  B29C66/71 ,  B29C66/72321 ,  B29C66/73115 ,  B29C66/73117 ,  B29C66/8266 ,  B29C66/82661 ,  B29C66/91411 ,  B29C66/91921 ,  B29C2791/001 ,  B29C2791/006 ,  B29C2793/009 ,  B29C2795/002 ,  B29K2069/00 ,  B29K2101/12 ,  B29K2305/00 ,  B29K2305/02 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0022 ,  B29L2009/00 ,  B29L2009/003 ,  B29L2031/3005 ,  B29L2031/3055 ,  B29L2031/3067 ,  B29L2031/3076 ,  B29L2031/3091 ,  B29L2031/7172 ,  B29L2031/722 ,  B29K2067/003 ,  B29K2023/12

Abstract: A method of making a decorated formed product effectively using a decorative sheet without diminishing the beauty of its appearance includes the steps of: (A) providing a formed product body; (B) mounting a first sheet, including an adhesive layer, on the formed product body; (C) heating a second sheet including a decoration layer and a base member that supports the decoration layer thereon; and (D) putting the heated second sheet on the first sheet, thereby bonding the second sheet onto the formed product body.

Abstract translation: 使用装饰片有效地制作装饰成形品的方法而不减少其外观的美观的方法包括以下步骤：（A）提供成形品; （B）在形成的产品主体上安装包括粘合剂层的第一片材​​; （C）加热包括装饰层的第二片材和在其上支撑装饰层的基底构件; 和（D）将加热的第二片材放置在第一片材上，从而将第二片材粘合到成形品上。

公开(公告)号：US20110059310A1

公开(公告)日：2011-03-10

申请号：US12879492

申请日：2010-09-10

Applicant: Ralf WEHRSPOHN ,  Martin Steinhart

Inventor： Ralf WEHRSPOHN ,  Martin Steinhart

IPC: B32B3/26 ,  B05D7/22 ,  C08F8/42

CPC classification number: C03C23/0095 ,  B29C65/64 ,  B29C66/05 ,  B29C66/30326 ,  B29C66/341 ,  B29C66/71 ,  B29C66/712 ,  B29C66/7392 ,  B29C66/7394 ,  B29C66/742 ,  B29C66/7461 ,  B29C66/7465 ,  B29C66/91411 ,  B29C66/919 ,  B29C66/91921 ,  B29C66/91933 ,  B29K2023/06 ,  B29K2025/00 ,  B29K2027/18 ,  B29K2033/08 ,  B29K2067/00 ,  B29K2069/00 ,  B29K2071/00 ,  B29K2083/00 ,  B29K2105/045 ,  B29K2305/10 ,  B29K2305/12 ,  B29K2305/14 ,  B29K2309/04 ,  B29K2309/08 ,  B29L2031/3406 ,  B29L2031/756 ,  Y10T428/249921 ,  Y10T428/249978 ,  B29K2081/06 ,  B29K2081/00 ,  B29K2079/08 ,  B29K2077/00 ,  B29K2075/00 ,  B29K2067/006 ,  B29K2067/003 ,  B29K2065/00 ,  B29K2033/26 ,  B29K2025/06 ,  B29K2023/38 ,  B29K2023/083 ,  B29K2023/00 ,  B29K2011/00 ,  B29K2009/00

Abstract: A three-dimensional molded body, a method for producing a three-dimensional molded body and a method for producing an adhesive bond between a polymer-containing material and a molded body having an inorganic porous framework structure in at least partial areas are described. In all cases the porous structure of the molded body comprising inorganic material is brought in contact with a polymer-containing material which is heated until the heated material enters into a joint connection with the molded body based on adhesive interactions, interfacial interactions, electrostatic interactions or any combination thereof, in which the pore-like voids of the porous structure are filled completely with the polymer-containing material, which stabilizes the molded body so that it has dimensional stability after cooling.

Abstract translation: 描述了三维成型体，三维成型体的制造方法以及含有聚合物的材料与至少部分区域中具有无机多孔骨架结构的成型体之间的粘结剂的制造方法。 在所有情况下，包含无机材料的成型体的多孔结构与含聚合物的材料接触，所述材料被加热直到加热的材料基于粘合剂相互作用，界面相互作用，静电相互作用或与其成为接合连接 其中多孔结构的孔状空隙完全被含聚合物的材料填充的任何组合，这使得成型体稳定，使得其在冷却后具有尺寸稳定性。

公开(公告)号：US06277771B1

公开(公告)日：2001-08-21

申请号：US09402981

申请日：1999-10-14

Applicant: Akira Nishimura ,  Takashi Kobayashi ,  Ikuo Horibe ,  Kiyoshi Homma

Inventor： Akira Nishimura ,  Takashi Kobayashi ,  Ikuo Horibe ,  Kiyoshi Homma

IPC: C08J524

CPC classification number: D03D15/02 ,  B29C70/22 ,  B29C70/885 ,  B29K2305/02 ,  B29K2305/10 ,  B29K2305/12 ,  B29K2305/14 ,  B29K2901/10 ,  D03D9/00 ,  D03D15/00 ,  D03D15/0011 ,  D03D15/0088 ,  D10B2101/06 ,  D10B2101/12 ,  D10B2101/20 ,  D10B2321/022 ,  D10B2331/021 ,  D10B2331/04 ,  D10B2401/062 ,  D10B2401/063 ,  D10B2401/16 ,  D10B2505/02 ,  Y10T428/29 ,  Y10T428/2913 ,  Y10T428/2915 ,  Y10T428/2933 ,  Y10T428/294 ,  Y10T428/30 ,  Y10T442/339 ,  Y10T442/361

Abstract: A sheet-shaped carbon fiber base material is made up from reinforcing carbon fiber and metal wire integrally formed into a carbon fiber base material which may be a a woven fabric, a tow sheet and a prepreg. The volume fraction of metal in the sheet-shaped reinforcing carbon fiber base material is no more than 4% of the carbon fiber. A laminate may also be formed from the sheet-shaped carbon fiber material, where the reinforcing carbon fiber and the metal wire are laid-up in such a way that the metal wire insertion positions are mutually different. Also disclosed is a method of detecting the number of plies in a laminate that includes non-destructively sensing with a detector the presence of metal wire in a laminate of plies of a sheet-shaped carbon fiber base material made up of reinforcing carbon fiber and metal wire integrally formed to make the sheet-shaped carbon fiber laminate material and determining the number of the plies in the laminate based on the metal wires detected.

Abstract translation: 片状碳纤维基材由增强碳纤维和一体形成碳纤维基材的金属丝构成，碳纤维基材可以是织物，丝束片和预浸料。 片状增强碳纤维基材中的金属体积分数不超过碳纤维的4％。 层压体也可以由片状碳纤维材料形成，其中增强碳纤维和金属丝以金属线插入位置相互不同的方式堆置。 还公开了一种检测层叠体中的层数的方法，其包括用检测器非破坏性地感测在由增强碳纤维和金属构成的片状碳纤维基材层的层叠体中存在金属丝 一体地形成为制造片状碳纤维层压材料的线材，并且基于检测到的金属线确定层压体中的层数。

公开(公告)号：US20130295369A1

公开(公告)日：2013-11-07

申请号：US13916036

申请日：2013-06-12

Applicant: Max-Planck-Gesellschaft zur Forderung der Wissenschaften e.V. ,  Fraunhofer-Gesellschaft zur Forderung der angewandten Forschung e.V.

Inventor： Ralf WEHRSPOHN ,  Martin STEINHART

IPC: C03C23/00

CPC classification number: C03C23/0095 ,  B29C65/64 ,  B29C66/05 ,  B29C66/30326 ,  B29C66/341 ,  B29C66/71 ,  B29C66/712 ,  B29C66/7392 ,  B29C66/7394 ,  B29C66/742 ,  B29C66/7461 ,  B29C66/7465 ,  B29C66/91411 ,  B29C66/919 ,  B29C66/91921 ,  B29C66/91933 ,  B29K2023/06 ,  B29K2025/00 ,  B29K2027/18 ,  B29K2033/08 ,  B29K2067/00 ,  B29K2069/00 ,  B29K2071/00 ,  B29K2083/00 ,  B29K2105/045 ,  B29K2305/10 ,  B29K2305/12 ,  B29K2305/14 ,  B29K2309/04 ,  B29K2309/08 ,  B29L2031/3406 ,  B29L2031/756 ,  Y10T428/249921 ,  Y10T428/249978 ,  B29K2081/06 ,  B29K2081/00 ,  B29K2079/08 ,  B29K2077/00 ,  B29K2075/00 ,  B29K2067/006 ,  B29K2067/003 ,  B29K2065/00 ,  B29K2033/26 ,  B29K2025/06 ,  B29K2023/38 ,  B29K2023/083 ,  B29K2023/00 ,  B29K2011/00 ,  B29K2009/00

Abstract: A three-dimensional molded body, a method for producing a three-dimensional molded body and a method for producing an adhesive bond between a polymer-containing material and a molded body having an inorganic porous framework structure in at least partial areas are described. In all cases the porous structure of the molded body comprising inorganic material is brought in contact with a polymer-containing material which is heated until the heated material enters into a joint connection with the molded body based on adhesive interactions, interfacial interactions, electrostatic interactions or any combination thereof, in which the pore-like voids of the porous structure are filled completely with the polymer-containing material, which stabilizes the molded body so that it has dimensional stability after cooling.

Abstract translation: 描述了三维成型体，三维成型体的制造方法以及含有聚合物的材料与至少部分区域中具有无机多孔骨架结构的成型体之间的粘结剂的制造方法。 在所有情况下，包含无机材料的成型体的多孔结构与含聚合物的材料接触，所述材料被加热直到加热的材料基于粘合剂相互作用，界面相互作用，静电相互作用或与其成为接合连接 其中多孔结构的孔状空隙完全被含聚合物的材料填充的任何组合，这使得成型体稳定，使得其在冷却后具有尺寸稳定性。

公开(公告)号：US08165679B2

公开(公告)日：2012-04-24

申请号：US12196093

申请日：2008-08-21

Applicant: Tom Xiaohai He ,  Matthew Isaac Haller ,  Meredith L. Anderson

Inventor： Tom Xiaohai He ,  Matthew Isaac Haller ,  Meredith L. Anderson

IPC: A61N1/08 ,  A61N1/16

CPC classification number: A61N1/375 ,  B29C65/1606 ,  B29C65/1612 ,  B29C65/1616 ,  B29C65/1635 ,  B29C65/168 ,  B29C65/1683 ,  B29C65/3444 ,  B29C65/3468 ,  B29C65/3476 ,  B29C65/348 ,  B29C66/1312 ,  B29C66/54 ,  B29C66/71 ,  B29C66/73366 ,  B29C66/73921 ,  B29C66/8322 ,  B29C2035/0822 ,  B29K2023/00 ,  B29K2023/12 ,  B29K2071/00 ,  B29K2305/14 ,  B29K2995/0093 ,  B29L2022/002 ,  B29L2031/7532 ,  B29K2027/18 ,  B29K2023/14

Abstract: An implantable stimulator that includes a housing, a first plastic component, and a second plastic component, where the first and second plastic components form a polymer-polymer interface. A light absorbing metal layer is disposed over at least a portion of the interface and an electronic subassembly is disposed within the housing. The first and second plastic components can be welded together by irradiating the light absorbing metal layer which converts the light to heat.

Abstract translation: 一种可植入刺激器，其包括壳体，第一塑料部件和第二塑料部件，其中所述第一和第二塑料部件形成聚合物 - 聚合物界面。 光吸收金属层设置在界面的至少一部分上，并且电子子组件设置在壳体内。 通过照射将光转换成热的光吸收金属层，可以将第一和第二塑料部件焊接在一起。

公开(公告)号：US20100163289A1

公开(公告)日：2010-07-01

申请号：US12645191

申请日：2009-12-22

Applicant: Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

Inventor： Shoji ITO ,  Tomofumi Kitada ,  Tadanori Ominato

IPC: H05K1/02 ,  B29C65/00 ,  B29C65/48 ,  H05K1/11

CPC classification number: H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract translation: 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US08604354B2

公开(公告)日：2013-12-10

申请号：US12645191

申请日：2009-12-22

Applicant: Shoji Ito ,  Tomofumi Kitada ,  Tadanori Ominato

Inventor： Shoji Ito ,  Tomofumi Kitada ,  Tadanori Ominato

IPC: H05K1/02

CPC classification number: H05K3/4015 ,  B29C65/48 ,  B29C65/4815 ,  B29C65/483 ,  B29C65/5057 ,  B29C66/1122 ,  B29C66/43 ,  B29C66/472 ,  B29C66/474 ,  B29C66/8322 ,  B29K2027/18 ,  B29K2063/00 ,  B29K2077/10 ,  B29K2079/08 ,  B29K2101/12 ,  B29K2105/0079 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0005 ,  B29L2009/003 ,  B29L2031/3425 ,  H01L2224/2929 ,  H01L2224/293 ,  H01L2224/83851 ,  H05K3/281 ,  H05K3/305 ,  H05K3/361 ,  H05K2201/0221 ,  H05K2201/10234 ,  H05K2201/10977 ,  H05K2203/041 ,  H05K2203/1189 ,  Y10T156/10

Abstract: A printed wiring board including: an insulated substrate; a conductive circuit provided on one side of this insulated substrate; a cover layer covering the insulated substrate and the conductive circuit; and a conductive particle buried in this cover layer, wherein the conductive particle is buried in the cover layer so that the conductive particle contacts the conductive circuit and protrudes from the cover layer; and the conductive particle serves as an electric contact point.

Abstract translation: 一种印刷线路板，包括：绝缘基板; 设置在该绝缘基板一侧的导电电路; 覆盖绝缘基板和导电电路的覆盖层; 以及埋置在该覆盖层中的导电性粒子，其中，导电粒子被掩埋在覆盖层中，使得导电粒子与导电电路接触并从覆盖层突出; 并且导电粒子用作电接触点。

公开(公告)号：US20090184477A1

公开(公告)日：2009-07-23

申请号：US12349116

申请日：2009-01-06

Applicant: Colin John West ,  David Alistair Sutton

Inventor： Colin John West ,  David Alistair Sutton

IPC: F01D11/12 ,  B28B5/00

CPC classification number: F16J15/104 ,  B29C35/02 ,  B29C43/003 ,  B29C43/146 ,  B29C43/203 ,  B29C43/52 ,  B29C66/7375 ,  B29C2043/148 ,  B29C2043/3634 ,  B29K2021/00 ,  B29K2027/12 ,  B29K2083/00 ,  B29K2105/0023 ,  B29K2105/246 ,  B29K2305/14 ,  B29K2307/00 ,  B29K2995/0005 ,  F05C2201/0421 ,  F05C2203/0808 ,  F05C2225/02 ,  B29C65/00

Abstract: A blade seal comprising: a base; a tip; a first part formed from an elastomeric material which extends continuously from the base to the tip; and a second part formed from an elastomeric material mixed with conductive filler which extends continuously from the base to the tip. The blade seal is manufactured by compressing the first and second parts together; and curing one or both of the parts as they are compressed together.

Abstract translation: 一种叶片密封件，包括：基部; 一个提示; 由弹性体材料形成的第一部分，其从基部连续延伸到尖端; 以及由与从底部连续延伸到尖端的导电填料混合的弹性体材料形成的第二部分。 叶片密封件通过将第一和第二部件压缩在一起来制造; 并且当它们被压缩在一起时固化部件中的一个或两个。

公开(公告)号：US20090040620A1

公开(公告)日：2009-02-12

申请号：US12035487

申请日：2008-02-22

Applicant: Chen Peng ,  Fung-Hsu Wu ,  Chung-Cheng Chou ,  Wai Wang ,  Long Hsu ,  Cheng-Hsien Liu

Inventor： Chen Peng ,  Fung-Hsu Wu ,  Chung-Cheng Chou ,  Wai Wang ,  Long Hsu ,  Cheng-Hsien Liu

IPC: G02B27/14 ,  B29C65/48 ,  B29D11/00 ,  C23C14/34 ,  C23C16/44 ,  B05D3/12

CPC classification number: G02B21/32 ,  B29C65/48 ,  B29C65/4825 ,  B29C65/4855 ,  B29C65/52 ,  B29C65/521 ,  B29C66/45 ,  B29C66/54 ,  B29K2025/00 ,  B29K2033/12 ,  B29K2067/00 ,  B29K2069/00 ,  B29K2105/0008 ,  B29K2305/02 ,  B29K2305/10 ,  B29K2305/14 ,  B29K2995/0026 ,  B29K2995/003 ,  B29L2009/00 ,  B29L2009/003 ,  B29L2031/756 ,  B29L2031/7728 ,  C23C14/046 ,  C23C14/086 ,  C23C14/205 ,  C23C14/5886 ,  G02B5/0808 ,  Y10T156/10

Abstract: A disk structure is disposed in an optical tweezers device including a light source for producing incident laser light. The disk structure includes a first substrate, a second substrate and a reflective layer. The second substrate is disposed with respect to the first substrate. One of the first substrate and the second substrate has at least one flow path. The reflective layer, which is adhered to the second substrate, is disposed between the first substrate and the second substrate. After the incident laser light passes through the first substrate and then reaches the reflective layer, the incident laser light is reflected back as reflective laser light by the reflective layer to form reflective laser light. A tweezers light field is formed in the flow path by both the reflective laser light and the incident laser light.

Abstract translation: 盘结构设置在包括用于产生入射激光的光源的光学镊子装置中。 盘结构包括第一衬底，第二衬底和反射层。 第二基板相对于第一基板设置。 第一衬底和第二衬底中的一个具有至少一个流动路径。 附着在第二基板上的反射层设置在第一基板和第二基板之间。 在入射激光通过第一衬底然后到达反射层之后，入射的激光被反射层反射回作为反射激光，形成反射激光。 通过反射激光和入射激光两者在流路中形成镊子光场。