-
公开(公告)号：US07665196B2
公开(公告)日：2010-02-23
申请号：US11986788
申请日：2007-11-26
CPC分类号： H03H9/14538 , H03H3/08 , H05K3/048 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/49007 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
摘要翻译： 提供了在公共压电基板上制造多频表面声波（SAW）器件的方法。 该方法使用单个蚀刻步骤改变SAW器件的波导元件的谐振频率。 蚀刻步骤去除设置在衬底上的多层导电膜的子部分。
-
公开(公告)号：US20080222864A1
公开(公告)日：2008-09-18
申请号：US11986788
申请日：2007-11-26
CPC分类号： H03H9/14538 , H03H3/08 , H05K3/048 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/49007 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
摘要翻译： 提供了在公共压电基板上制造多频表面声波（SAW）器件的方法。 该方法使用单个蚀刻步骤改变SAW器件的波导元件的谐振频率。 蚀刻步骤去除设置在衬底上的多层导电膜的子部分。
-
公开(公告)号：US07299528B2
公开(公告)日：2007-11-27
申请号：US10288529
申请日：2002-11-05
CPC分类号： H03H9/14538 , H03H3/08 , H05K3/048 , Y10T29/42 , Y10T29/435 , Y10T29/49005 , Y10T29/49007 , Y10T29/4913 , Y10T29/49155 , Y10T29/49156
摘要： Provided is a method of manufacturing a multi-frequency surface acoustic wave (SAW) device on a common piezoelectric substrate. The method features varying the resonant frequency of waveguide elements of the SAW device using a single etch step. The etch step removes a sub-portion of multiple layers of conductive film disposed on the substrate.
摘要翻译： 提供了在公共压电基板上制造多频表面声波（SAW）器件的方法。 该方法使用单个蚀刻步骤改变SAW器件的波导元件的谐振频率。 蚀刻步骤去除设置在衬底上的多层导电膜的子部分。
-
-
搜索结果
3 条记录 (耗时 0.011 秒)
