公开(公告)号：US08011799B2

公开(公告)日：2011-09-06

申请号：US12897593

申请日：2010-10-04

申请人： Peter Van Laanen ,  Jeff Bisberg

发明人： Peter Van Laanen ,  Jeff Bisberg

IPC分类号： F21V7/20 ,  H01L23/10 ,  H01L23/34

CPC分类号： H05K1/0203 ,  F21V19/0055 ,  F21V29/70 ,  F21V29/763 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/647 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10S362/80

摘要： An LED-based lighting system includes a printed circuit board (“PCB”) having conductors on a front-side thereof, one or more LEDs mounted with the conductors, and a structural element. The PCB is mounted with the conductors near to the structural element so that heat dissipation from the LEDs is primarily through the conductors and the structural element. A method of dissipating heat generated by an LED-based lighting system includes configuring a PCB with conductors on a front-side of the PCB, such that when one or more LEDs mounted to the conductors generates heat, the heat dissipates from the one or more LEDs to the conductors. The method also includes integrating a structural element such that at least portions of the conductors face the structural element, and the heat dissipates from the conductors to the structural element.

摘要翻译： 基于LED的照明系统包括在其前侧具有导体的一个印刷电路板（“PCB”），安装有导体的一个或多个LED以及结构元件。 印刷电路板安装有导体靠近结构元件，使得LED的散热主要通过导体和结构元件。 散发由基于LED的照明系统产生的热量的方法包括在PCB的前侧配置具有导体的PCB，使得当安装到导体的一个或多个LED产生热量时，热量从一个或多个 LED到导体。 该方法还包括集成结构元件，使得导体的至少一部分面向结构元件，并且热量从导体散发到结构元件。

公开(公告)号：US08390214B2

公开(公告)日：2013-03-05

申请号：US12859717

申请日：2010-08-19

申请人： Peter Van Laanen ,  Howard Vincent Derby

发明人： Peter Van Laanen ,  Howard Vincent Derby

IPC分类号： H05B37/02

CPC分类号： H05B33/0842 ,  H02M1/4225 ,  H02M3/33523 ,  H05B33/0815 ,  H05B33/0845 ,  H05B33/10 ,  Y02B20/347 ,  Y02B70/126 ,  Y10T29/49002

摘要： A power supply for powering one or more loads includes a boost circuit with power factor correction (PFC) that provides an operating voltage from an electrical power source, and a dimmer detection circuit that determines a dimming level applied to the electrical power source, and generates a pulse width modulated (PWM) signal based upon the dimming level. The power supply also includes one or more current control circuits, each current control circuit being associated with each of the one or more loads, and coupled in series with the operating voltage, its associated load, and a ground of the power supply, so as to control a current through its associated load in response to the PWM signal.

摘要翻译： 用于为一个或多个负载供电的电源包括具有提供来自电源的工作电压的功率因数校正（PFC）的升压电路和确定施加到电源的调光电平的调光器检测电路，并且产生 基于调光电平的脉宽调制（PWM）信号。 电源还包括一个或多个电流控制电路，每个电流控制电路与一个或多个负载中的每一个相关联，并且与工作电压，其相关联的负载和电源的接地串联耦合，以便 以响应于PWM信号来控制通过其相关负载的电流。

公开(公告)号：US20110019417A1

公开(公告)日：2011-01-27

申请号：US12897593

申请日：2010-10-04

申请人： Peter Van Laanen ,  Jeff Bisberg

发明人： Peter Van Laanen ,  Jeff Bisberg

IPC分类号： F21S4/00

CPC分类号： H05K1/0203 ,  F21V19/0055 ,  F21V29/70 ,  F21V29/763 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/647 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10S362/80

摘要： An LED-based lighting system includes a printed circuit board (“PCB”) having conductors on a front-side thereof, one or more LEDs mounted with the conductors, and a structural element. The PCB is mounted with the conductors near to the structural element so that heat dissipation from the LEDs is primarily through the conductors and the structural element. A method of dissipating heat generated by an LED-based lighting system includes configuring a PCB with conductors on a front-side of the PCB, such that when one or more LEDs mounted to the conductors generates heat, the heat dissipates from the one or more LEDs to the conductors. The method also includes integrating a structural element such that at least portions of the conductors face the structural element, and the heat dissipates from the conductors to the structural element.

摘要翻译： 基于LED的照明系统包括在其前侧具有导体的一个印刷电路板（“PCB”），安装有导体的一个或多个LED以及结构元件。 印刷电路板安装有导体靠近结构元件，使得LED的散热主要通过导体和结构元件。 散发由基于LED的照明系统产生的热量的方法包括在PCB的前侧配置具有导体的PCB，使得当安装到导体的一个或多个LED产生热量时，热量从一个或多个 LED到导体。 该方法还包括集成结构元件，使得导体的至少一部分面向结构元件，并且热量从导体散发到结构元件。

公开(公告)号：US20100079262A1

公开(公告)日：2010-04-01

申请号：US12238705

申请日：2008-09-26

申请人： Peter Van Laanen

发明人： Peter Van Laanen

IPC分类号： G05B11/01

CPC分类号： H04B3/54 ,  G05B19/0423 ,  H04B3/546 ,  H04B2203/5416 ,  H04B2203/5458

摘要： Systems and methods convey information from a controller to at least one slave unit using a single wire referenced to an alternating current (AC) power supply. A control signal has a high voltage and a low voltage. The high voltage is greater than a voltage midpoint of the AC power supply and the low voltage is less than the voltage midpoint. The control signal is conveyed through the single wire to each of the at least one slave unit. At each slave unit, a comparison voltage, representative of the voltage midpoint, is generated by dividing substantially midway the potentials between the power lines of the AC power supply and the control signal is compared to the comparison voltage to determine low and high states of the control signal; the low and high states represent the information.

摘要翻译： 系统和方法使用参考交流（AC）电源的单线将信息从控制器传送到至少一个从单元。 控制信号具有高电压和低电压。 高电压大于交流电源的电压中点，低电压小于电压中点。 控制信号通过单个线传送到至少一个从属单元中的每一个。 在每个从单元处，代表电压中点的比较电压通过将交流电源的电力线之间的电位基本上中间分开并且将控制信号与比较电压进行比较来确定低电平和高电平状态 控制信号; 低和高的状态代表信息。

公开(公告)号：USD592786S1

公开(公告)日：2009-05-19

申请号：US29318648

申请日：2008-05-23

申请人： Jeffrey Bisberg ,  Peter Van Laanen ,  Neil Cannon ,  Tracy Earles ,  Christopher Wilke

设计人： Jeffrey Bisberg ,  Peter Van Laanen ,  Neil Cannon ,  Tracy Earles ,  Christopher Wilke

公开(公告)号：US08425085B2

公开(公告)日：2013-04-23

申请号：US12431674

申请日：2009-04-28

申请人： Peter Van Laanen ,  Jeffrey Bisberg ,  Neil Cannon ,  Tracy Earles

发明人： Peter Van Laanen ,  Jeffrey Bisberg ,  Neil Cannon ,  Tracy Earles

IPC分类号： F21V29/00

CPC分类号： F21V21/00 ,  F21V3/02 ,  F21V3/04 ,  F21V29/004 ,  F21V29/506 ,  F21V29/507 ,  F21V29/70 ,  F21V29/83 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2203/1572 ,  Y02B20/386

摘要： An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.

摘要翻译： 基于LED的照明系统包括形成一个或多个孔的壳体，其前侧具有导体的PCB以及安装有导体的一个或多个LED。 PCB安装有导体靠近壳体的顶表面，使得LED通过孔发射光，并且由一个或多个LED产生的热量主要通过导体散发到壳体。 一种用于灯具的改装设备包括其前侧具有导体的PCB和安装有导体的一个或多个LED。 PCB安装有导体靠近安装支架的表面，其被配置为安装到灯具，使得当支架安装到灯具上时，由一个或多个LED产生的热量主要通过导体和 结构元件到灯具。

公开(公告)号：US20120319622A1

公开(公告)日：2012-12-20

申请号：US13598195

申请日：2012-08-29

申请人： Peter Van Laanen

发明人： Peter Van Laanen

IPC分类号： H05B41/36 ,  G05B11/01

CPC分类号： H04B3/54 ,  G05B19/0423 ,  H04B3/546 ,  H04B2203/5416 ,  H04B2203/5458

摘要： Systems and methods convey information from a controller to at least one slave unit using a single wire referenced to an alternating current (AC) power supply. A control signal has a high voltage and a low voltage. The high voltage is greater than a voltage midpoint of the AC power supply and the low voltage is less than the voltage midpoint. The control signal is conveyed through the single wire to each of the at least one slave unit. At each slave unit, a comparison voltage, representative of the voltage midpoint, is generated by dividing substantially midway the potentials between the power lines of the AC power supply and the control signal is compared to the comparison voltage to determine low and high states of the control signal; the low and high states represent the information.

摘要翻译： 系统和方法使用参考交流（AC）电源的单线将信息从控制器传送到至少一个从单元。 控制信号具有高电压和低电压。 高电压大于交流电源的电压中点，低电压小于电压中点。 控制信号通过单个线传送到至少一个从属单元中的每一个。 在每个从单元处，代表电压中点的比较电压通过将交流电源的电力线之间的电位基本上中间分开并且将控制信号与比较电压进行比较来确定低电平和高电平状态 控制信号; 低和高的状态代表信息。

公开(公告)号：USD632418S1

公开(公告)日：2011-02-08

申请号：US29325189

申请日：2008-09-26

申请人： Jeffrey Bisberg ,  Peter Van Laanen ,  Neil Cannon ,  Tracy Earles ,  Christopher Wilke

设计人： Jeffrey Bisberg ,  Peter Van Laanen ,  Neil Cannon ,  Tracy Earles ,  Christopher Wilke

公开(公告)号：US07806574B2

公开(公告)日：2010-10-05

申请号：US11735903

申请日：2007-04-16

申请人： Peter Van Laanen ,  Jeff Bisberg

发明人： Peter Van Laanen ,  Jeff Bisberg

IPC分类号： B60Q1/00

CPC分类号： H05K1/0203 ,  F21V19/0055 ,  F21V29/70 ,  F21V29/763 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/647 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10S362/80

摘要： An LED-based lighting system includes a printed circuit board (“PCB”) having conductors on a front-side thereof, one or more LEDs mounted with the conductors, and a structural element. The PCB is mounted with the conductors near to the structural element so that heat dissipation from the LEDs is primarily through the conductors and the structural element. A method of dissipating heat generated by an LED-based lighting system includes configuring a PCB with conductors on a front-side of the PCB, such that when one or more LEDs mounted to the conductors generates heat, the heat dissipates from the one or more LEDs to the conductors. The method also includes integrating a structural element such that at least portions of the conductors face the structural element, and the heat dissipates from the conductors to the structural element.

摘要翻译： 基于LED的照明系统包括在其前侧具有导体的一个印刷电路板（“PCB”），安装有导体的一个或多个LED以及结构元件。 印刷电路板安装有导体靠近结构元件，使得LED的散热主要通过导体和结构元件。 散发由基于LED的照明系统产生的热量的方法包括在PCB的前侧配置具有导体的PCB，使得当安装到导体的一个或多个LED产生热量时，热量从一个或多个 LED到导体。 该方法还包括集成结构元件，使得导体的至少一部分面向结构元件，并且热量从导体散发到结构元件。

公开(公告)号：US20070242462A1

公开(公告)日：2007-10-18

申请号：US11735903

申请日：2007-04-16

申请人： Peter Van Laanen ,  Jeff Bisberg

发明人： Peter Van Laanen ,  Jeff Bisberg

IPC分类号： F21V29/00

CPC分类号： H05K1/0203 ,  F21V19/0055 ,  F21V29/70 ,  F21V29/763 ,  F21V29/89 ,  F21Y2103/10 ,  F21Y2115/10 ,  H01L33/647 ,  H05K1/0209 ,  H05K3/0061 ,  H05K2201/10106 ,  Y10S362/80

摘要： An LED-based lighting system includes a printed circuit board (“PCB”) having conductors on a front-side thereof, one or more LEDs mounted with the conductors, and a structural element. The PCB is mounted with the conductors near to the structural element so that heat dissipation from the LEDs is primarily through the conductors and the structural element. A method of dissipating heat generated by an LED-based lighting system includes configuring a PCB with conductors on a front-side of the PCB, such that when one or more LEDs mounted to the conductors generates heat, the heat dissipates from the one or more LEDs to the conductors. The method also includes integrating a structural element such that at least portions of the conductors face the structural element, and the heat dissipates from the conductors to the structural element.

摘要翻译： 基于LED的照明系统包括在其前侧具有导体的一个印刷电路板（“PCB”），安装有导体的一个或多个LED以及结构元件。 印刷电路板安装有导体靠近结构元件，使得LED的散热主要通过导体和结构元件。 散发由基于LED的照明系统产生的热量的方法包括在PCB的前侧配置具有导体的PCB，使得当安装到导体的一个或多个LED产生热量时，热量从一个或多个 LED到导体。 该方法还包括集成结构元件，使得导体的至少一部分面向结构元件，并且热量从导体散发到结构元件。