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    Thermal management of LED-based lighting systems
    4.
    发明授权
    Thermal management of LED-based lighting systems 有权
    LED照明系统的热管理

    公开(公告)号：US08425085B2

    公开(公告)日：2013-04-23

    申请号：US12431674

    申请日：2009-04-28

    申请人： Peter Van Laanen ,  Jeffrey Bisberg ,  Neil Cannon ,  Tracy Earles

    发明人： Peter Van Laanen ,  Jeffrey Bisberg ,  Neil Cannon ,  Tracy Earles

    IPC分类号： F21V29/00

    CPC分类号： F21V21/00 ,  F21V3/02 ,  F21V3/04 ,  F21V29/004 ,  F21V29/506 ,  F21V29/507 ,  F21V29/70 ,  F21V29/83 ,  F21Y2115/10 ,  H05K1/0203 ,  H05K1/181 ,  H05K3/0061 ,  H05K2201/0969 ,  H05K2201/10106 ,  H05K2203/1572 ,  Y02B20/386

    摘要： An LED-based lighting system includes a housing forming one or more apertures, a PCB having conductors on its front-side, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a top surface of the housing such that the LEDs emit light through the apertures, and heat generated by the one or more LEDs primarily dissipates through the conductors to the housing. A retrofit apparatus for a light fixture includes a PCB having conductors on its front-side thereof, and one or more LEDs mounted with the conductors. The PCB mounts with the conductors proximate to a surface of a mounting bracket that is configured for mounting to the light fixture, such that when the bracket mounts to the light fixture, heat generated by the one or more LEDs primarily dissipates through the conductors and the structural element to the light fixture.

    摘要翻译： 基于LED的照明系统包括形成一个或多个孔的壳体，其前侧具有导体的PCB以及安装有导体的一个或多个LED。 PCB安装有导体靠近壳体的顶表面，使得LED通过孔发射光，并且由一个或多个LED产生的热量主要通过导体散发到壳体。 一种用于灯具的改装设备包括其前侧具有导体的PCB和安装有导体的一个或多个LED。 PCB安装有导体靠近安装支架的表面，其被配置为安装到灯具，使得当支架安装到灯具上时，由一个或多个LED产生的热量主要通过导体和 结构元件到灯具。

    LED Chip-Based Lighting Products And Methods Of Building
    6.
    发明申请
    LED Chip-Based Lighting Products And Methods Of Building 失效
    LED芯片照明产品和建筑方法

    公开(公告)号：US20120042512A1

    公开(公告)日：2012-02-23

    申请号：US13287796

    申请日：2011-11-02

    申请人： Jeffrey Bisberg

    发明人： Jeffrey Bisberg

    IPC分类号： H05K3/30

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H05K1/056 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.

    摘要翻译： 构建基于发光二极管（LED）的照明产品的方法包括将多个未封装的LED芯片或LED直接安装在双面板的表面上的导体上，将面板与支撑结构集成以形成照明产品 所述面板的至少一个表面形成所述照明产品的外表面，并且耦合漫射器，所述扩散器与所述LED芯片或LED的表面距离相邻LED芯片或LED之间的平均间隔的至少两倍 。 构建基于LED芯片的照明产品的方法包括将未封装的LED芯片直接安装在形成在双面板的表面上的导体上，并将盖板安装到LED芯片上，使得从LED芯片发射的光通过 盖板。

    LED Chip-Based Lighting Products And Methods Of Building
    7.
    发明申请
    LED Chip-Based Lighting Products And Methods Of Building 有权
    LED芯片照明产品和建筑方法

    公开(公告)号：US20110121324A2

    公开(公告)日：2011-05-26

    申请号：US12857472

    申请日：2010-08-16

    申请人： Jeffrey Bisberg

    发明人： Jeffrey Bisberg

    IPC分类号： H01L33/58 ,  H01L33/00

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H05K1/056 ,  Y10T29/4913 ,  H01L2924/00

    摘要： Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.

    摘要翻译： 基于发光二极管（LED）芯片的照明产品和制造方法包括在面板的内表面上形成导体，将多个未封装的LED芯片直接安装在导体上，以及将面板与支撑结构集成以形成照明 产品，使得面板的外表面形成照明产品的外表面。 基于发光二极管（LED）的照明产品包括具有内表面和外表面的面板，所述外表面形成照明产品的外表面，在内表面上图案化的导体，以及直接安装到 导体。

    LED Chip-Based Lighting Products And Methods Of Building
    8.
    发明申请
    LED Chip-Based Lighting Products And Methods Of Building 有权
    LED芯片照明产品和建筑方法

    公开(公告)号：US20100308350A1

    公开(公告)日：2010-12-09

    申请号：US12857472

    申请日：2010-08-16

    申请人： Jeffrey Bisberg

    发明人： Jeffrey Bisberg

    IPC分类号： H01L33/58 ,  H01L33/00

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H05K1/056 ,  Y10T29/4913 ,  H01L2924/00

    摘要： Light-emitting diode (LED) chip-based lighting products and methods of manufacture include patterning conductors on an inside surface of a panel, mounting a plurality of unpackaged LED chips directly on the conductors, and integrating the panel with support structure to form the lighting product such that an outside surface of the panel forms an exterior surface of the lighting product. A light emitting diode (LED)-based lighting product includes a panel having an inner surface and an outer surface, the outer surface forming an external surface of the lighting product, conductors patterned on the inner surface, and a plurality of LEDs mounted directly to the conductors.

    摘要翻译： 基于发光二极管（LED）芯片的照明产品和制造方法包括在面板的内表面上形成导体，将多个未封装的LED芯片直接安装在导体上，以及将面板与支撑结构集成以形成照明 产品，使得面板的外表面形成照明产品的外表面。 基于发光二极管（LED）的照明产品包括具有内表面和外表面的面板，所述外表面形成照明产品的外表面，在内表面上图案化的导体，以及直接安装到 导体。

    LED chip-based lighting products and methods of building
    9.
    发明授权
    LED chip-based lighting products and methods of building 失效
    LED芯片照明产品和建筑方法

    公开(公告)号：US08338197B2

    公开(公告)日：2012-12-25

    申请号：US13287796

    申请日：2011-11-02

    申请人： Jeffrey Bisberg

    发明人： Jeffrey Bisberg

    IPC分类号： H01L21/00

    CPC分类号： H01L33/60 ,  H01L25/0753 ,  H01L33/54 ,  H01L33/58 ,  H01L33/62 ,  H01L2924/0002 ,  H01L2933/0033 ,  H05K1/056 ,  Y10T29/4913 ,  H01L2924/00

    摘要： A method of building a light-emitting diode (LED) based lighting product includes mounting a plurality of unpackaged LED chips or LEDs directly on conductors on a surface of a two-sided panel, integrating the panel with support structure to form the lighting product such that at least one surface of the panel forms an external surface of the lighting product, and coupling a diffuser, with a distance from the diffuser to the surface of the LED chips or LEDs being at least twice an average spacing between adjacent LED chips or LEDs. A method of building a an LED chip-based lighting product includes mounting unpackaged LED chips directly on conductors formed on a surface of a two-sided panel, and mounting a cover plate to the LED chips such that light emitted from the LED chips passes through the cover plate.

    摘要翻译： 构建基于发光二极管（LED）的照明产品的方法包括将多个未封装的LED芯片或LED直接安装在双面板的表面上的导体上，将面板与支撑结构集成以形成照明产品 所述面板的至少一个表面形成所述照明产品的外表面，并且耦合漫射器，所述扩散器与所述LED芯片或LED的表面距离相邻LED芯片或LED之间的平均间隔的至少两倍 。 构建基于LED芯片的照明产品的方法包括将未封装的LED芯片直接安装在形成在双面板的表面上的导体上，并将盖板安装到LED芯片上，使得从LED芯片发射的光通过 盖板。

    Method For Depositing A Phosphor Layer On LEDs, And Apparatus Made Thereby
    10.
    发明申请
    Method For Depositing A Phosphor Layer On LEDs, And Apparatus Made Thereby 审中-公开
    在LED上沉积荧光体层的方法，以及由此制成的装置

    公开(公告)号：US20120313120A1

    公开(公告)日：2012-12-13

    申请号：US13492393

    申请日：2012-06-08

    申请人： Jeffrey Bisberg

    发明人： Jeffrey Bisberg

    IPC分类号： H01L33/08 ,  H01L33/44

    CPC分类号： H01L33/505 ,  H01L33/504 ,  H01L2933/0041

    摘要： A method for depositing a phosphor layer on a light-emitting diode (“LED”) chip includes coating at least a light-emitting side of the LED chip with a phosphor-adhesive material, and applying phosphor particles to an exposed surface of the material such that the phosphor layer forms of phosphor particles that adhere to the exposed surface. A method for depositing phosphor layers on each of a plurality of LED chips includes mounting the LED chips to a common substrate, coating at least a light-emitting side of the LED chips with a phosphor-adhesive material, and applying phosphor particles to exposed surfaces of the material such that the phosphor layers form of phosphor particles that adhere to the material. A processed LED chip includes an unpackaged LED chip, a phosphor-adhesive material applied to a light-emitting side of the LED chip, and a phosphor layer formed of phosphor particles adhered to the material.

    摘要翻译： 在发光二极管（LED）芯片上沉积磷光体层的方法包括用荧光体粘合剂材料涂覆至少LED芯片的发光侧，并将荧光体颗粒施加到材料的暴露表面，使得 磷光体层形成的荧光体颗粒附着在暴露的表面上。 一种用于在多个LED芯片中的每一个上沉积磷光体层的方法包括将LED芯片安装到公共基板上，用荧光体粘合材料涂覆至少LED芯片的发光侧，并将荧光体颗粒施加到暴露表面 的材料，使得荧光体层形成粘附到材料上的荧光体颗粒。 经处理的LED芯片包括未封装的LED芯片，施加到LED芯片的发光侧的磷光体粘合剂材料和由附着到该材料上的荧光体颗粒形成的荧光体层。