摘要:
A cutting apparatus is disclosed which includes a cutter knife which is reciprocally moveable along a path of travel; a track member mounted adjacent to the cutter knife and which mechanically cooperates with the cutter knife so as to define, at least in part, a first non-cutting position, and a second cutting position for the cutter knife; and a magnet is mounted in a location on the track member and which releasably, magnetically restrains the cutter knife when the cutter knife is in the first non-cutting position.
摘要:
In one embodiment, an apparatus comprises: a base structure adapted to be inserted within the burr hole; a lead securing member for securing the lead, the lead securing member comprising a first arm structure and a second arm structure, at least one spring loaded structure adapted to exert a force to bring the first arm structure and the second arm structure together; and a positioning tool having a distal end adapted to be inserted within the lead securing member. When the positioning tool is positioned within the lead securing member, the distal end holds the first and second arm structures a sufficient distance apart to receive a lead between the first and second arm structures; wherein the positioning tool comprises a control structure at a proximal end that, when engaged, causes the distal end of the positioning tool to be released from between the first and second arm structures.
摘要:
There is disclosed various embodiments of an implantable anchor for anchoring a medical lead within a patient. The implantable anchor includes a body having at least one lumen for receiving a medical lead, a cam integrated with the body and rotatable to extend into the lumen for engaging the medical lead and inhibiting the movement of the lead with respect to the anchor. The cam may include a handle for facilitating the rotation of the cam. A needle could be connected to the handle to facilitate the securing of the anchor to a portion of the patient.
摘要:
There is a method for forming a semiconductor device. Portions of a sacrificial layer are removed to expose a first seed layer region. The first seed layer region corresponds to a first semiconductor region, and a remaining portion of the sacrificial layer corresponds to a second semiconductor region. An epitaxial semiconductor material is deposited over the first seed layer region. A capping layer is formed to overlie the epitaxial semiconductor material and the remaining portion of the sacrificial layer. Portions of the capping layer are removed to form a capping structure that overlies a part of the remaining portion of the sacrificial layer. Portions of the sacrificial layer not covered by the capping structure are removed to form a sacrificial structure having sidewalls. Fin structures are formed adjoining the sidewalls by depositing a semiconductor material along the sidewalls. Portions of the capping structure are removed to expose portions of sacrificial layer between adjacent fin structures. Portions of the sacrificial material between the adjacent fin structures are removed.
摘要:
A semiconductor device is made by steps of removing portions of a first capping layer, removing portions of a sacrificial layer, recessing sidewalls, and forming fin structures. The step of removing portions of the first capping layer forms a first capping structure that covers portions of the sacrificial layer. The step of removing portions of the sacrificial layer removes portions of the sacrificial layer that are not covered by the first capping structure to define an intermediate structure. The step of recessing the sidewalls recesses sidewalls of the intermediate structure relative to edge regions of the first capping structure to form a sacrificial structure having recessed sidewalls. The step of forming fin structures forms fin structures adjacent to the recessed sidewalls.
摘要:
A read only memory implemented as a 3D integrated device has a first stratum, a second stratum, and bonded inter-strata connections for coupling the first stratum to the second stratum. The physical bonding between the two strata implements the programming of the read only memory. The stratum may be in wafer form or in die form. The first stratum includes functional active devices and at least one non-programmed active device. The second stratum includes at least conductive routing to be associated with the at least one non-programmed active device. The bonded inter-strata connections include at least one bonded programmable inter-strata connection for programming the at least one non-programmed active device and for providing conductive routing to the programmed active device. The two strata thus form a programmed ROM. Other types of programmable storage devices may be implemented by bonding the two strata.
摘要:
An automated method and system for identifying date-sensitive entries in a database wherein an obligation must be satisfied relative to the entry according to instructions provided by the beneficiary of the obligation. The method and system of the invention can be practiced from a location remote from the database and are particularly useful in a number of situations and particularly those wherein unticketed reservations are maintained in a storage medium for a time prior to issuance of a ticket to “firm up” the reservation to a ticketed status. The present system and methodology finds particular utility enforcing ticketing time limit rules on travel agency or other reservation and ticket issuers involved in the reserving and ticketing of airline bookings and the like and results in the reduction of no-shows and overbooking while increasing onboard load factors on sold-out flights in particular. The automated system of the invention is capable of operating essentially continually throughout seven days a week and twenty-four hours each day to constantly “firm” all or selected flights of a given carrier. Enforcement of ticket time limit rules can extend at the option of a user to booking class, market, point of sale and the like or any combination thereof.
摘要:
Both a non-volatile memory (NVM) and a dynamic nanocrystal memory (DNM) are integrated on a semiconductor substrate. Control gates and control dielectrics with embedded nanocrystals or discrete storage elements are formed over differing thicknesses of tunnel dielectrics to form the two memories. Source and drain regions are formed within the semiconductor substrate adjacent to the tunnel dielectrics. Various methods can be used to form a thin tunnel oxide and a thick tunnel oxide by adding minimum processing steps.
摘要:
A heteroepitaxial structure is made using nanocrystals that are formed closer together than normal lithography patterning would allow. The nanocrystals are oxidized and thus selectively etchable with respect to the substrate and surrounding material. In one case the oxidized nanocrystals are removed to expose the substrate at those locations and selective epitaxial germanium is then grown at those exposed substrate locations. The inevitable formation of the misfit dislocations does minimal harm because they are terminated at the surrounding material. In another case the surrounding material is removed and the germanium is epitaxially grown at the exposed substrate where the surrounding material is removed. The resulting misfit dislocations in the germanium terminate at the oxidized nanocrystals. By using nanocrystals that are able to be formed much closer together than is available for other features through lithography, the misfits are prevented from extending so far as to create harmful threading dislocations.
摘要:
A self-aligned magnetic clad bit line structure (274) for a magnetic memory element (240a) and its method of formation are disclosed, wherein the self-aligned magnetic clad bit line structure (274) extends within a trench (258) and includes a conductive material (250), magnetic cladding sidewalls (262) and a magnetic cladding cap (252). The magnetic cladding sidewalls (262) at least partially surround the conductive material (264) and the magnetic cladding cap (252) is substantially recessed within the trench with respect to the top of the trench.