Production method of multilayer ceramic electronic device
    4.
    发明申请
    Production method of multilayer ceramic electronic device 审中-公开
    多层陶瓷电子器件的生产方法

    公开(公告)号:US20070074806A1

    公开(公告)日:2007-04-05

    申请号:US11527574

    申请日:2006-09-27

    IPC分类号: C03B29/00

    摘要: By a production method for producing a multilayer ceramic electronic device including dielectric layers and internal electrode layers comprising the steps of forming a green sheet to be said dielectric layer after firing, forming a pre-fired electrode layer to be said internal electrode layer after firing in a predetermined pattern on said green sheet by using a conductive material paste, forming a green chip by successively stacking said green sheets and said pre-fired electrode layers, and firing said green chip: wherein the conductive material paste for forming said pre-fired electrode layer is composed at least of conductive material particles, a first common material composed of ceramic powder and a second common material composed of ceramic powder having a larger average particle diameter than that of said first common material; an average particle diameter of said first common material is 1/20 to ½ of an average particle diameter of said conductive material particles; and the average particle diameter of said second common material is 1/10 to ½ of an average thickness of said internal electrode layers after firing; a multilayer ceramic electronic device, such as a multilayer ceramic capacitor, wherein arising of cracks is effectively prevented, having a low short-circuit defect rate, a low voltage resistance defect rate and high capacitance is produced.

    摘要翻译: 通过制造包括电介质层和内部电极层的多层陶瓷电子器件的制造方法,包括以下步骤:在烧成后形成作为所述电介质层的生片,在烧成后形成作为所述内部电极层的预烧电极层 通过使用导电材料浆料在所述生片上的预定图案,通过连续堆叠所述生片和所述预烧电极层形成绿色芯片,并烧制所述生芯片:其中用于形成所述预烧电极的导电材料糊 至少由导电材料颗粒构成的第一普通材料,由陶瓷粉末组成的第一普通材料和平均粒径大于所述第一普通材料的陶瓷粉末的第二普通材料; 所述第一普通材料的平均粒径为所述导电材料颗粒的平均粒径的1/20至1/2; 所述第二普通材料的平均粒径为烧成后的内部电极层的平均厚度的1/10〜1/2; 可以有效地防止出现裂纹的多层陶瓷电子器件,如多层陶瓷电容器,具有低的短路缺陷率,低电压电阻缺陷率和高电容。

    Laminated electronic component
    5.
    发明授权
    Laminated electronic component 有权
    层压电子部件

    公开(公告)号:US07190566B2

    公开(公告)日:2007-03-13

    申请号:US11491282

    申请日:2006-07-24

    IPC分类号: H01G4/005 H01G4/06

    CPC分类号: H01G4/30 H01G4/012

    摘要: A laminated electronic component includes a ceramic body having an inner portion and a pair of outer portions disposed above and below the inner portion and a pair of external electrodes disposed on lateral sides of the ceramic body. A plurality of internal electrodes are embedded in the inner portion and alternately connected to the external electrodes. At least two layers of dummy electrodes are embedded in at least one of the outer portions and each connected to one of the external electrodes. An innermost one of the dummy electrodes has a same polarity as an adjacent outermost one of the internal electrodes. The dummy electrodes include at least one pair of adjacent dummy electrodes of opposite polarities.

    摘要翻译: 层叠电子部件包括陶瓷体,该陶瓷体具有内部和设置在内部的上下的一对外部,以及设置在陶瓷体的侧面上的一对外部电极。 多个内部电极嵌入在内部部分中并交替地连接到外部电极。 在至少一个外部部分中嵌入至少两层虚拟电极,并且各自连接到一个外部电极。 虚拟电极中最内侧的一个与相邻的最内部电极之一具有相同的极性。 虚拟电极包括至少一对具有相反极性的相邻虚拟电极。

    LAMINATED CERAMIC ELECTRONIC COMPONENT
    7.
    发明申请
    LAMINATED CERAMIC ELECTRONIC COMPONENT 有权
    层压陶瓷电子元件

    公开(公告)号:US20070211404A1

    公开(公告)日:2007-09-13

    申请号:US11669973

    申请日:2007-02-01

    IPC分类号: H01G4/005

    CPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0

    摘要翻译: 层叠陶瓷电子部件具有嵌入陶瓷基板中的多个导电层。 层叠陶瓷电子部件包括:由多个导电层和介于其间的陶瓷层构成的功能区域; 以及形成在功能区域周围以形成环状横截面的保护区域。 层叠陶瓷电子部件满足以下条件:<?in-line-formula description =“In-line formula”end =“lead”?> 0 其中t表示垂直方向上的保护区域的壁厚,Wg表示横向保护区域的壁厚。

    Laminated ceramic electronic component
    10.
    发明授权
    Laminated ceramic electronic component 有权
    层压陶瓷电子元件

    公开(公告)号:US07324325B2

    公开(公告)日:2008-01-29

    申请号:US11669973

    申请日:2007-02-01

    IPC分类号: H01G4/06 H01G4/00

    CPC分类号: H01G4/30 H01G4/012 H01G4/12

    摘要: A laminated ceramic electronic component has a plurality of conductive layers embedded in a ceramic substrate. The laminated ceramic electronic component includes: a functional area composed of the plurality of conductive layers and ceramic layers interposed therebetween; and a protective area formed around the functional area to have a ring-like cross section. The laminated ceramic electronic component satisfies the following condition: 0

    摘要翻译: 层叠陶瓷电子部件具有嵌入陶瓷基板中的多个导电层。 层叠陶瓷电子部件包括:由多个导电层和介于其间的陶瓷层构成的功能区域; 以及形成在功能区域周围以形成环状横截面的保护区域。 层叠陶瓷电子部件满足以下条件:<?in-line-formula description =“In-line formula”end =“lead”?> 0 其中t表示垂直方向上的保护区域的壁厚,Wg表示横向保护区域的壁厚。