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1.发明授权公开(公告)号：US08258016B2
公开(公告)日：2012-09-04
申请号：US12337519
申请日：2008-12-17
IPC分类号： H01L21/44
CPC分类号： H01L23/60 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/16251 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
摘要翻译： 本发明的实施例包括半导体集成电路封装，其包括具有附接到其上的集成电路管芯的衬底。 该封装包括附接到基板的ESD屏蔽。 ESD屏蔽被配置为增加封装的ESD硬度。 ESD屏蔽件可进一步用于加强封装以防止翘曲并作为散热器进行操作。
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2.发明申请公开(公告)号：US20070132083A1
公开(公告)日：2007-06-14
申请号：US11304862
申请日：2005-12-14
IPC分类号： H01L23/02
CPC分类号： H01L23/60 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/16251 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
摘要翻译： 本发明的实施例包括半导体集成电路封装，其包括具有附接到其上的集成电路管芯的衬底。 该封装包括附接到基板的ESD屏蔽。 ESD屏蔽被配置为增加封装的ESD硬度。 ESD屏蔽件可进一步用于加强封装以防止翘曲并作为散热器进行操作。
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3.发明授权公开(公告)号：US07145232B2
公开(公告)日：2006-12-05
申请号：US10954940
申请日：2004-09-30
IPC分类号： H01L23/34
CPC分类号： H01L23/433 , H01L23/42 , H01L2224/16 , H01L2224/32014 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/3511 , H01L2224/0401
摘要： A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.
摘要翻译： 旨在提高热性能的半导体封装结构。 提供了具有附着在其上的金属合金预制件的散热器。 然后，在模具周围分配几点导电环氧树脂。 将具有预制金属合金的散热器压在粘合剂上，然后将部件固化。 通过将模具与导电环氧树脂耦合到散热器，模具受到翘曲限制。 通过去除涂覆模具的必要性，制造成本降低。 在后端分配点，只有非常边际的成本增加。 为此，后台已经存在过程和设备。 通过减少模具背面翘曲，芯片保持与散热器的良好接触，从而提高热性能。
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公开(公告)号：US20060043603A1
公开(公告)日：2006-03-02
申请号：US10932174
申请日：2004-08-31
CPC分类号： H01L24/81 , H01L23/49816 , H01L23/49833 , H01L2224/16225 , H01L2224/81801 , H01L2924/00011 , H01L2924/00014 , H01L2924/01006 , H01L2924/01029 , H01L2924/01033 , H01L2924/01047 , H01L2924/01049 , H01L2924/0105 , H01L2924/01079 , H01L2924/01082 , H01L2924/014 , H01L2924/14 , H01L2924/15311 , H05K3/3436 , H05K3/3463 , H05K2201/10378 , H05K2201/10992 , Y02P70/613 , H01L2224/0401
摘要： Techniques for utilizing a bonding agent that allows a solder reflow process to occur at a lower reflow temperature. One area of use includes semiconductor device manufacturing processes. The bonding agent is placed between a solder ball and a contact surface. The bonding agent has a melting temperature that is lower than that of the solder ball. Reflow is then performed at a relative low temperature that is high enough for reflowing the bonding agent, yet at the same time, lower than what would be necessary to reflow the solder material. Since, the electrical system is not subjected to the high temperatures necessary for reflowing the solder material, the electronic system experiences less high-temperature related damage.
摘要翻译： 用于利用允许焊料回流工艺在较低回流温度下发生的粘结剂的技术。 一个使用领域包括半导体器件制造工艺。 粘结剂置于焊球和接触表面之间。 粘合剂的熔融温度低于焊球的熔融温度。 然后在足够高的回流焊接剂的相对低温下进行回流，同时低于回流焊料材料所需的回流。 由于电气系统没有经受回流焊料所需的高温，所以电子系统的高温相关损害较少。
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5.发明申请公开(公告)号：US20090104735A1
公开(公告)日：2009-04-23
申请号：US12337519
申请日：2008-12-17
IPC分类号： H01L21/50
CPC分类号： H01L23/60 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/16251 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
摘要翻译： 本发明的实施例包括半导体集成电路封装，其包括具有附接到其上的集成电路管芯的衬底。 该封装包括附接到基板的ESD屏蔽。 ESD屏蔽被配置为增加封装的ESD硬度。 ESD屏蔽件可进一步用于加强封装以防止翘曲并作为散热器进行操作。
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6.发明授权公开(公告)号：US07498664B2
公开(公告)日：2009-03-03
申请号：US11304862
申请日：2005-12-14
IPC分类号： H01L23/552
CPC分类号： H01L23/60 , H01L23/552 , H01L24/48 , H01L24/73 , H01L2224/16225 , H01L2224/32225 , H01L2224/48091 , H01L2224/48227 , H01L2224/73204 , H01L2224/73215 , H01L2224/73253 , H01L2224/73265 , H01L2924/00014 , H01L2924/01087 , H01L2924/14 , H01L2924/15311 , H01L2924/16152 , H01L2924/16195 , H01L2924/16251 , H01L2924/3011 , H01L2924/3025 , H01L2924/00012 , H01L2924/00 , H01L2224/45099 , H01L2224/45015 , H01L2924/207
摘要： Embodiments of the invention include a semiconductor integrated circuit package that includes a substrate having an integrated circuit die attached thereto. The package includes a ESD shield attached to the substrate. The ESD shield configured to increase the ESD hardness of the package. The ESD shield can further serve to stiffen the package to prevent warping and operate as a heat spreader.
摘要翻译： 本发明的实施例包括半导体集成电路封装，其包括具有附接到其上的集成电路管芯的衬底。 该封装包括附接到基板的ESD屏蔽。 ESD屏蔽被配置为增加封装的ESD硬度。 ESD屏蔽件可进一步用于加强封装以防止翘曲并作为散热器进行操作。
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公开(公告)号：US20060071327A1
公开(公告)日：2006-04-06
申请号：US10954940
申请日：2004-09-30
IPC分类号： H01L23/34
CPC分类号： H01L23/433 , H01L23/42 , H01L2224/16 , H01L2224/32014 , H01L2224/73253 , H01L2924/00011 , H01L2924/00014 , H01L2924/3511 , H01L2224/0401
摘要： A semiconductor package construction aimed at improving thermal performance. A heatspreader is provided having a metal alloy preform attached to it already. Then, a few dots of conductive epoxy are dispensed around the die. The heatspreader with the preformed metal alloy is pressed on the adhesive and then the part is cured. By coupling the die to the heatspreader with conductive epoxy, the die is constrained from warping. By removing the necessity of coating the die, the cost of fabrication is reduced. There is only a very marginal cost increase in the back end for dispensing the dots. For this, the process and equipment already exists in the backend. By reducing die backside warpage due, the die remains in good contact with the heatspreader, thus improving thermal performance.
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