公开(公告)号：US20070212820A1

公开(公告)日：2007-09-13

申请号：US11308167

申请日：2006-03-09

Applicant: Rehan Choudhary ,  Benjamin Fasano ,  Sushumna Iruvanti ,  Daniel Reinhardt ,  Deborah Sylvester

Inventor： Rehan Choudhary ,  Benjamin Fasano ,  Sushumna Iruvanti ,  Daniel Reinhardt ,  Deborah Sylvester

IPC: H01L21/00

CPC classification number: H01L21/563 ,  C08G2650/40 ,  C08L71/00 ,  H01L23/556 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01084 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

Abstract translation: 提供了一种包括易于再加工的α粒子屏障的方法和装置。 在芯片的表面和基板的表面之间的空间中施加易于再加工的α粒子屏障，并且降低软错误率（SER）。 此外，易于再加工的α粒子阻挡材料选自有机材料，烃，更具体地是聚α-烯烃（PAO）油和聚合物或填充聚合物的组; 其中所述聚α-烯烃油的粘度低于1000cSt（在100℃）。 易于再加工的α粒子阻挡材料可以与多芯片模块（MCM）一起使用，允许一个或多个模具的简单的器件返工，而不会影响同一基板上的其他裸片。

公开(公告)号：US07615850B2

公开(公告)日：2009-11-10

申请号：US12104103

申请日：2008-04-16

Applicant: Rehan Choudhary ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

Inventor： Rehan Choudhary ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

IPC: H01L23/556

CPC classification number: H01L21/563 ,  C08G2650/40 ,  C08L71/00 ,  H01L23/556 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01084 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

Abstract translation: 提供了一种包括易于再加工的α粒子屏障的方法和装置。 在芯片的表面和基板的表面之间的空间中施加易于再加工的α粒子屏障，并且降低软错误率（SER）。 此外，易于再加工的α粒子阻挡材料选自有机材料，烃，更具体地是聚α-烯烃（PAO）油和聚合物或填充聚合物的组; 其中所述聚α-烯烃油的粘度低于1000cSt（在100℃）。 易于再加工的α粒子阻挡材料可以与多芯片模块（MCM）一起使用，允许一个或多个模具的简单的器件返工，而不会影响同一基板上的其他裸片。

公开(公告)号：US20080002363A1

公开(公告)日：2008-01-03

申请号：US11427380

申请日：2006-06-29

Applicant: Levi Campbell ,  Rehan Choudhary ,  Michael Ellsworth ,  Kenneth Marston ,  Hilton Toy

Inventor： Levi Campbell ,  Rehan Choudhary ,  Michael Ellsworth ,  Kenneth Marston ,  Hilton Toy

IPC: H05K7/20

CPC classification number: H01L23/4735 ,  H01L2924/0002 ,  H01L2924/00

Abstract: A direct liquid jet impingement module and associated method of providing such used in cooling of electronic components housed in an electronic package is provided. The module comprises a frame having an orifice to be placed over to-be-cooled components. A manifold is then disposed over the frame, such that the manifold opening is aligned with the frame orifice to ultimately enable fluid impingement on the to-be-cooled components. The manifold is formed to receive an inlet for the flow of coolants and an outlet fitting for removal of dissipated heat. A jet orifice plate is also provided inside the manifold opening, aligned with the frame orifice for directing fluid coolant flow over to-be-cooled components.

Abstract translation: 提供了一种直接液体喷射冲击模块和提供这种用于冷却容纳在电子封装中的电子部件的相关方法。 模块包括具有孔的框架，该孔被放置在待冷却的部件上。 然后将歧管设置在框架上方，使得歧管开口与框架孔对准，以最终使流体冲击待冷却的部件。 歧管形成为接收用于冷却剂流动的入口和用于消除散热的出口接头。 歧管开口内还设有喷射孔板，与框架孔对准，用于将流体冷却剂流体流过待冷却的部件。

公开(公告)号：US20080217793A1

公开(公告)日：2008-09-11

申请号：US12104103

申请日：2008-04-16

Applicant: Rehan CHOUDHARY ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

Inventor： Rehan CHOUDHARY ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

IPC: H01L23/29

CPC classification number: H01L21/563 ,  C08G2650/40 ,  C08L71/00 ,  H01L23/556 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01084 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

Abstract translation: 提供了一种包括易于再加工的α粒子屏障的方法和装置。 在芯片的表面和基板的表面之间的空间中施加易于再加工的α粒子屏障，并且降低软错误率（SER）。 此外，易于再加工的α粒子阻挡材料选自有机材料，烃，更具体地是聚α-烯烃（PAO）油和聚合物或填充聚合物的组; 其中所述聚α-烯烃油的粘度低于1000cSt（在100℃）。 易于再加工的α粒子阻挡材料可以与多芯片模块（MCM）一起使用，允许一个或多个模具的简单的器件返工，而不会影响同一基板上的其他裸片。

公开(公告)号：US07381590B2

公开(公告)日：2008-06-03

申请号：US11308167

申请日：2006-03-09

Applicant: Rehan Choudhary ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

Inventor： Rehan Choudhary ,  Benjamin V. Fasano ,  Sushumna Iruvanti ,  Daniel D. Reinhardt ,  Deborah A. Sylvester

IPC: H01L21/00 ,  H01L23/48

CPC classification number: H01L21/563 ,  C08G2650/40 ,  C08L71/00 ,  H01L23/556 ,  H01L24/13 ,  H01L24/16 ,  H01L24/29 ,  H01L24/32 ,  H01L2224/05568 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73203 ,  H01L2224/73204 ,  H01L2224/8388 ,  H01L2224/83885 ,  H01L2924/00014 ,  H01L2924/01084 ,  H01L2924/12044 ,  H01L2924/14 ,  H01L2924/3512 ,  H01L2924/00 ,  H01L2224/05599

Abstract: A method and device comprising an easily reworkable alpha particle barrier is provided. The easily reworkable alpha particle barrier is applied in the space between the surface of the chip and the surface of the substrate, and reduces soft error rate (SER). Further, the easily reworkable alpha particle barrier material is chosen from the group of an organic material, a hydrocarbon, more specifically a polyalphaolefin (PAO) oil, and a polymer or filled polymer; wherein the polyalphaolefin oil has a viscosity below 1000 cSt (at 100° C.). The easily reworkable alpha particle barrier material can be used with multichip modules (MCM's) allowing easy device rework of one or more dies without affecting other dies on the same substrate.

Abstract translation: 提供了一种包括易于再加工的α粒子屏障的方法和装置。 在芯片的表面和基板的表面之间的空间中施加易于再加工的α粒子屏障，并且降低软错误率（SER）。 此外，易于再加工的α粒子阻挡材料选自有机材料，烃，更具体地是聚α-烯烃（PAO）油和聚合物或填充聚合物的组; 其中所述聚α-烯烃油的粘度低于1000cSt（在100℃）。 易于再加工的α粒子阻挡材料可以与多芯片模块（MCM）一起使用，允许一个或多个模具的简单的器件返工，而不会影响同一基板上的其他裸片。