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    Chip Cooling System with Convex Portion
    6.
    发明申请
    Chip Cooling System with Convex Portion 审中-公开
    带凸部的芯片冷却系统

    公开(公告)号：US20090109628A1

    公开(公告)日：2009-04-30

    申请号：US11928165

    申请日：2007-10-30

    申请人： Raschid J. Bezama ,  James N. Humenik ,  Sushumna Iruvanti ,  Govindarajan Natarajan

    发明人： Raschid J. Bezama ,  James N. Humenik ,  Sushumna Iruvanti ,  Govindarajan Natarajan

    IPC分类号： H01L23/367 ,  F28F7/00

    CPC分类号： H01L23/367 ,  F28F13/00 ,  H01L23/3736 ,  H01L2924/0002 ,  H01L2924/00

    摘要： Integrated circuit chip cooling methods and systems are disclosed. A method for cooling an integrated circuit chip may comprise: providing a cooling mechanism; positioning an interface medium between the cooling mechanism and the integrated circuit chip; and interfacing the cooling mechanism and the integrated circuit chip through the interface medium; wherein at least one of the cooling mechanism, the integrated circuit chip, or the interface medium includes a convex portion on an interface surface thereof.

    摘要翻译： 公开了集成电路芯片的冷却方法和系统。 用于冷却集成电路芯片的方法可以包括：提供冷却机构; 在冷却机构和集成电路芯片之间定位界面介质; 并通过接口介质与冷却机构和集成电路芯片接口; 其中所述冷却机构，所述集成电路芯片或所述界面介质中的至少一个在其界面表面上包括凸部。

    Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof
    8.
    发明授权
    Thermal paste preforms as a heat transfer media between a chip and a heat sink and method thereof 失效
    作为芯片和散热器之间的传热介质的热糊状预成型件及其方法

    公开(公告)号：US06444496B1

    公开(公告)日：2002-09-03

    申请号：US09619886

    申请日：2000-07-20

    申请人： David L. Edwards ,  Glenn G. Daves ,  Shaji Farooq ,  Sushumna Iruvanti ,  Frank L. Pompeo

    发明人： David L. Edwards ,  Glenn G. Daves ,  Shaji Farooq ,  Sushumna Iruvanti ,  Frank L. Pompeo

    IPC分类号： H01L2144

    CPC分类号： H05K7/20454 ,  H01L23/42 ,  H01L2224/16225 ,  H01L2224/73253 ,  H01L2924/16152

    摘要： The present invention relates generally to a new apparatus and method for introducing thermal paste into semiconductor packages. More particularly, the invention encompasses an apparatus and a method that uses at least one preform of thermal paste for the cooling of at least one chip in a sealed semiconductor package. The thermal paste preform is subcooled, and is transferred onto a module component from a separable transfer sheet, or is placed onto the module component using an attached and/or imbedded mesh. The preform of thermal paste may be of simple or complex shape, and enables cooling of one or more chips in a module.

    摘要翻译： 本发明一般涉及将热膏引入半导体封装的新设备和方法。 更具体地说，本发明包括使用至少一个热糊状物预制件来冷却密封半导体封装中的至少一个芯片的装置和方法。 将热糊预制件过冷，并从可分离转印片材转移到模块组件上，或者使用附接和/或嵌入的网格放置在模块部件上。 热糊状物的预制件可以是简单或复杂的形状，并且能够冷却模块中的一个或多个芯片。

    Method for bonding heatsink to multiple-height chip
    9.
    发明授权
    Method for bonding heatsink to multiple-height chip 失效
    将散热片连接到多芯片芯片的方法

    公开(公告)号：US06214647B1

    公开(公告)日：2001-04-10

    申请号：US09159239

    申请日：1998-09-23

    申请人： Giulio Di Giacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Sushumna Iruvanti ,  David J. Womac

    发明人： Giulio Di Giacomo ,  Stephen S. Drofitz, Jr. ,  David L. Edwards ,  Sushumna Iruvanti ,  David J. Womac

    IPC分类号： H01L2144

    CPC分类号： H01L23/4338 ,  H01L2224/16 ,  H01L2224/73253 ,  H01L2924/09701

    摘要： A method and structure for thermally connecting a thermal conductor to at least one chip, the thermal conductor including a lower surface and at least one piston extending from the lower surface corresponding to each of the chips, each of the chips having an upper surface opposing each of the pistons, the chips being mounted on a substrate, the method comprising steps of metalizing the lower surface of the thermal conductor and the pistons, applying a solder to the lower surface of the thermal conductor, applying a thermal paste between the upper surface of the chips and the pistons, positioning the substrate and the thermal conductor such that the substrate is aligned with the thermal conductor, biasing the thermal conductor toward the substrate, biasing the pistons toward the chips such that the thermal paste has a consistent thickness between each of the chips and the pistons, reflowing the solder, such that the solder bonds the substrate to the thermal conductor and the pistons form a metallurgical bond with the thermal conductor, wherein after the reflowing step, the pistons and the thermal conductor form a unitary structure for maintaining the consistent thickness of the thermal paste between each of the chips and the pistons which achieves a considerably thinner thermal paste layer and greater thermal conduction.

    摘要翻译： 一种用于将热导体热连接到至少一个芯片的方法和结构，所述热导体包括下表面和从与每个芯片对应的下表面延伸的至少一个活塞，每个芯片具有与每个芯片相对的上表面 的活塞，所述芯片安装在基板上，所述方法包括以下步骤：使所述导热体和所述活塞的下表面金属化，向所述导热体的下表面施加焊料，在所述导热体的上表面 芯片和活塞，定位衬底和热导体，使得衬底与热导体对准，将热导体偏压朝向衬底，将活塞偏压到芯片，使得热膏在每个之间具有一致的厚度 芯片和活塞，回流焊料，使得焊料将基板粘合到热导体和活塞上 与热导体进行冶金结合，其中在回流步骤之后，活塞和热导体形成整体结构，用于保持每个芯片和活塞之间的热粘合剂的厚度一致，其实现相当薄的热糊层，并且 更大的热传导。

    Flat plate cooling using a thermal paste retainer
    10.
    发明授权
    Flat plate cooling using a thermal paste retainer 失效
    平板冷却使用热粘贴保持器

    公开(公告)号：US5706171A

    公开(公告)日：1998-01-06

    申请号：US560568

    申请日：1995-11-20

    申请人： David Linn Edwards ,  Sushumna Iruvanti ,  Gaetano Paolo Messina ,  Raed A. Sherif

    发明人： David Linn Edwards ,  Sushumna Iruvanti ,  Gaetano Paolo Messina ,  Raed A. Sherif

    IPC分类号： H01L23/42 ,  H05K7/20

    CPC分类号： H05K7/20454 ,  H01L23/42 ,  H01L2224/16 ,  H01L2224/16225 ,  H01L2224/32245 ,  H01L2224/73253 ,  H01L2924/01019 ,  H01L2924/1305 ,  H01L2924/3011

    摘要： Thermal material such as a paste or gel is confined within a paste gap between a surface of a flat cooling plate and an opposing surface of a chip mounted on a surface of a chip carrier or substrate by forming a partition, preferably in the form of a grid, at the periphery of one or more chips. The partition is located laterally in sufficient proximity to the chip and in communication with the paste gap to form a capillary and thus confine motion of a viscous thermal material to repetitive bidirectional flow out of and into the paste gap with relative motion of the chip and the surface of the flat cooling plate. The grid is preferably fitted closely within grooves formed in the surface of the flat cooling plate and preferably supported by leaf springs so that thermal material is confined within cells of the grid while providing support and/or damping of relative motion between the flat cooling plate and the substrate or carrier.

    摘要翻译： 诸如糊状物或凝胶之类的热物质通过形成隔板而被限制在平坦冷却板的表面和安装在芯片载体或衬底的表面上的芯片的相对表面之间的糊料间隙中，优选为 网格，在一个或多个芯片的外围。 分隔件横向放置在与芯片相邻的位置并且与浆料间隙连通以形成毛细管，从而将粘性热材料的运动限制在重复的双向流出浆料间隙中，同时芯片和 平面冷却板表面。 栅格优选紧密地配合在形成在平坦冷却板的表面中的槽内，并且优选地由板簧支撑，使得热材料被限制在栅格的单元内，同时提供平板冷却板和扁平冷却板之间的相对运动的支撑和/或阻尼 底物或载体。