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公开(公告)号：US4359622A
公开(公告)日：1982-11-16
申请号：US150808
申请日：1980-05-19
CPC分类号： B23K11/252
摘要： A controller for a spot-welding machine compares the temperature evolution at a site at which a spot weld is being made to a standard thermal history stored in a digital read/write memory in controlling the welding current for the weld. Standard thermal histories can be generated and written into the memory as needed by an operator of the welding machine to take into account changes in operating conditions. The temperature evolution of the spot-welding operation is monitored by detecting radiant energy whose intensity provides a measure of a temperature of the weld. Phosphorescent radiation from a thermographic phosphor located in a welding tip of the welding machine and thermal infrared radiation are preferred for monitoring the temperature evolution of the spot-welding operation.
摘要翻译： 用于点焊机的控制器将在点焊处的位置处的温度演变与在数字读/写存储器中存储的标准热历史进行比较，以控制焊接的焊接电流。 根据焊机操作员的需要，可以生成标准热历史记录并将其写入存储器，以考虑操作条件的变化。 通过检测强度提供焊缝温度测量的辐射能来监测点焊操作的温度演变。 来自位于焊接机焊接端的热成像荧光体的光电辐射和热红外辐射是监测点焊操作的温度演变的首选。
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公开(公告)号：US4657169A
公开(公告)日：1987-04-14
申请号：US619438
申请日：1984-06-11
CPC分类号： B23K26/032 , B23K1/0056 , B23K26/034 , H05K3/3494
摘要： The melting of solder in a reflow soldering operation is detected by examining the rate of change of the solder temperature or by detecting a change in a surface reflectance characteristic of the solder which occurs upon melting.
摘要翻译： 通过检查焊料温度的变化率或通过检测在熔化时发生的焊料的表面反射特性的变化来检测回流焊接操作中的焊料的熔化。
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公开(公告)号：US4481418A
公开(公告)日：1984-11-06
申请号：US429397
申请日：1982-09-30
IPC分类号： G01N21/88 , G01N21/956 , G01N25/72 , G01R31/04 , G01R31/309 , G02B21/00 , H01S3/00 , G01J1/00
CPC分类号： G01N25/72 , G01R31/309 , G01R31/048
摘要： An apparatus for inspecting a device made up of a plurality of different infrared radiating elements includes an optical head which is moveable along X-Y coordinates above the fixed device to sequentially scan the infrared radiating elements. A laser beam source is operatively connected to the moveable head for injecting thermal energy into the infrared radiating elements and an infrared detector is provided for sensing the infrared radiation emanating from the elements. The infrared detector may be mounted directly on the moveable head or in a remote location wherein the detector would be connected to the moveable head by a flexible optical fiber. A second moveable head may be located on the opposite side of the device so that thermal energy from the laser source may be injected into opposite sides of the infrared radiating element.
摘要翻译： 用于检查由多个不同的红外辐射元件组成的装置的装置包括一个可以沿固定装置上方的X-Y坐标移动的光学头，以顺序地扫描红外辐射元件。 激光束源可操作地连接到可移动头部，用于将热能注入到红外辐射元件中，并且提供红外检测器用于感测从元件发出的红外辐射。 红外检测器可以直接安装在可移动头部或远程位置，其中检测器将通过柔性光纤连接到可移动头部。 第二可移动头可以位于装置的相对侧上，使得来自激光源的热能可以被注入到红外辐射元件的相对侧。
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公开(公告)号：US4214164A
公开(公告)日：1980-07-22
申请号：US926055
申请日：1978-07-19
申请人： Alan C. Traub , Riccardo Vanzetti
发明人： Alan C. Traub , Riccardo Vanzetti
摘要： Control of spot weld quality is effected by observing the progress of heat generation within the weld and initiating automatic corrective action if the heating rate is initially too high or too low. A flexible optical fiber bundle has one end located in the welding tip and the other end optically coupled to an infrared detector. Due to the excellent thermal conductivity of the copper material of the welding tip, thermal energy is conducted very rapidly for a short distance into the tip during the weld formation so that the infrared detector produces an output signal proportional to the weld temperature. This signal is sampled and compared with a previously-recorded signal corresponding to the heating rate that produced a good spot weld in the material being welded.
摘要翻译： 点焊质量的控制是通过观察焊缝内发热的进度来实现的，并且如果加热速率最初太高或太低，则启动自动校正动作。 柔性光纤束具有位于焊接尖端中的一端，另一端光耦合到红外检测器。 由于焊接头的铜材料的优异的导热性，在焊接形成期间，热能在焊接形成期间非常快速地进入尖端，使得红外检测器产生与焊接温度成比例的输出信号。 对该信号进行采样，并将其与先前记录的信号进行比较，该信号对应于在被焊接材料中产生良好点焊的加热速率。
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5.发明授权Method and apparatus for placing and electrically connecting components on a printed circuit board 失效用于将部件放置和电连接在印刷电路板上的方法和装置
公开(公告)号：US4696104A
公开(公告)日：1987-09-29
申请号：US895633
申请日：1986-08-12
CPC分类号： B23K26/032 , B23K1/0056 , H05K13/0465 , H05K13/08 , H05K3/3494 , H05K2203/107 , H05K2203/163 , Y10T29/49004 , Y10T29/49144 , Y10T29/49769
摘要： A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow solderiung utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.
摘要翻译： 用于在印刷电路板上放置，焊接和检查诸如焊接接头和电子部件的组成部件的系统利用传送装置，用于将特定电子部件选择和传送到印刷电路板上的预定位置并将每个部件保持在 在回流焊接操作期间通过使用转移装置来将组件部件机械地和电气地连接到印刷电路板的期望位置。 回流焊接使用激光束将热能注入到每个焊接接头中以熔化焊接材料。 红外检测器感测来自加热的焊料材料的热辐射和/或反射的辐射，以在焊料材料液化时停止施加激光束到焊料材料。 红外检测器还在冷却期间继续感测来自加热的焊料的热辐射，以提供将与标准信号进行比较的信号，以确定焊点的质量。
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6.发明授权Method and apparatus for placing and electrically connecting components on a printed circuit board 失效用于将部件放置和电连接在印刷电路板上的方法和装置
公开(公告)号：US4696101A
公开(公告)日：1987-09-29
申请号：US908920
申请日：1986-09-19
CPC分类号： B23K26/032 , B23K1/0056 , B23K26/034 , H05K13/0465 , H05K13/08 , H05K3/3494 , H05K2203/107 , H05K2203/163 , Y10T29/53178
摘要： A system for placing, soldering and inspecting component parts, such as soldered joints and electronic components, on a printed circuit board utilizes a transfer device for selecting and transferring specific electronic component parts to predetermined positions on a printed circuit board and holding each component part in the desired position by use of the transfer device during a reflow soldering operation to mechanically and electrically connect the component part to the printed circuit board. The reflow soldering utilizes a laser beam for injecting thermal energy into each soldered joint to melt the soldered material. An infrared detector senses thermal radiation and/or reflected radiation from the heated solder material to discontinue the application of the laser beam to the solder material upon liquifaction of the solder material. The infrared detector also continues to sense the thermal radiation from the heated solder material during cool down to provide a signal which will be compared with a standard signal to determine the quality of the solder joint.
摘要翻译： 用于在印刷电路板上放置，焊接和检查诸如焊接接头和电子部件的组成部件的系统利用传送装置，用于将特定电子部件选择和传送到印刷电路板上的预定位置并将每个部件保持在 在回流焊接操作期间通过使用转移装置来将组件部件机械地和电气地连接到印刷电路板的期望位置。 回流焊接使用激光束将热能注入每个焊接接头以熔化焊接材料。 红外检测器感测来自加热的焊料材料的热辐射和/或反射的辐射，以在焊料材料液化时停止施加激光束到焊料材料。 红外检测器还在冷却期间继续感测来自加热的焊料的热辐射，以提供将与标准信号进行比较的信号，以确定焊点的质量。
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