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公开(公告)号：US06444082B1
公开(公告)日：2002-09-03
申请号：US09599754
申请日：2000-06-22
IPC分类号： B32B3500
CPC分类号： H01L21/67092 , Y10T29/49822 , Y10T29/53274 , Y10T156/1184 , Y10T156/1961
摘要： An apparatus and a method for removing a bonded lid from a substrate of variable size including nesting jaws to support and secure the substrate; and gripping jaws to grip the lid; wherein, in operation, the gripping jaws pivot with respect to the nesting jaws and create a, peeling action which separates the lid from the substrate with minimum force and without damage to the substrate or attached semiconductor devices.
摘要翻译： 一种用于从包括嵌套爪的可变尺寸的基底去除粘合的盖的装置和方法，以支撑和固定基板; 和夹紧爪以夹紧盖子; 其中，在操作中，夹爪相对于嵌套爪枢转并且产生剥离动作，其以最小的力将盖与基板分开，并且不损坏基板或附接的半导体器件。
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公开(公告)号：US5493076A
公开(公告)日：1996-02-20
申请号：US378411
申请日：1995-01-26
申请人： James M. Levite , Michael Berger , Richard L. Chartrand , Mary A. Emmett , Raymond A. Jackson , James J. Petrone , Richard F. Shortt , Roger A. Stinemire
发明人： James M. Levite , Michael Berger , Richard L. Chartrand , Mary A. Emmett , Raymond A. Jackson , James J. Petrone , Richard F. Shortt , Roger A. Stinemire
CPC分类号： H05K3/222 , H01L21/485 , H05K3/225 , H05K1/0298 , H05K1/095 , H05K2201/10287 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/1338 , H05K2203/173 , H05K3/0017 , H05K3/107 , H05K3/4685 , Y10T29/49155 , Y10T29/49162 , Y10T29/49167 , Y10T29/49742
摘要： The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.
摘要翻译： 本发明一般涉及用于修复半导体衬底的新结构和方法，更具体地，本发明包括通过在缺陷板上提供电线来修复印刷电路板或其它电子衬底的结构和方法。 在具有开放或电气不连续性的基板上，在不连续性已经建立之后，从电气不连续部分横跨的一部分电线被暴露，并且在两个或多个暴露部分之间形成一个或多个沟槽或凹槽 电线。 暴露的电线的两个暴露部分然后通过通过沟槽穿过的电线或使用标准沉积工艺连接，一个或多个金属或材料沉积在开放沟槽中，以提供或恢复电连续性， 去除沉积材料。 本发明还提供了用于修复网络的阻抗匹配的装置。
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公开(公告)号：US5446961A
公开(公告)日：1995-09-05
申请号：US137547
申请日：1993-10-15
申请人： James M. Levite , Michael Berger , Richard L. Chartrand , Mary A. Emmett , Raymond A. Jackson , James J. Petrone , Richard F. Shortt , Roger A. Stinemire
发明人： James M. Levite , Michael Berger , Richard L. Chartrand , Mary A. Emmett , Raymond A. Jackson , James J. Petrone , Richard F. Shortt , Roger A. Stinemire
CPC分类号： H05K3/222 , H01L21/485 , H05K3/225 , H05K1/0298 , H05K1/095 , H05K2201/10287 , H05K2203/0769 , H05K2203/107 , H05K2203/121 , H05K2203/1338 , H05K2203/173 , H05K3/0017 , H05K3/107 , H05K3/4685 , Y10T29/49155 , Y10T29/49162 , Y10T29/49167 , Y10T29/49742
摘要： The present invention relates generally to a new structure and a method for repairing semiconductor substrates, and more particularly, the invention encompasses a structure and a method for repairing Printed Circuit Boards or other electronic substrates by providing electrical lines on the defective board. On a substrate that has an open or an electrical discontinuity, after the discontinuity has been established, a portion of the electrical line across from the electrical discontinuity are exposed and one or more trenches or grooves are made between the two or more exposed portions of the electrical line. The two exposed portions of the exposed electrical line is then joined by either an electrical wire that is routed through the trench or using a standard deposition process one or more metals or material are deposited in the open trench to provide or restore electrical continuity and the excess deposition material is removed. This invention also provides means for impedance matching of the net that is repaired.
摘要翻译： 本发明一般涉及用于修复半导体衬底的新结构和方法，更具体地，本发明包括通过在缺陷板上提供电线来修复印刷电路板或其它电子衬底的结构和方法。 在具有开放或电气不连续性的基板上，在不连续性已经建立之后，从电气不连续部分横跨的一部分电线被暴露，并且在两个或多个暴露部分之间形成一个或多个沟槽或凹槽 电线。 暴露的电线的两个暴露部分然后通过通过沟槽穿过的电线或使用标准沉积工艺连接，一个或多个金属或材料沉积在开放沟槽中，以提供或恢复电连续性， 去除沉积材料。 本发明还提供了用于修复网络的阻抗匹配的装置。
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