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19 条记录 (耗时 0.014 秒)

    Integrated packaging of micromechanical sensors and associated control circuits
    1.
    发明授权
    Integrated packaging of micromechanical sensors and associated control circuits 失效
    微机械传感器和相关控制电路的集成封装

    公开(公告)号：US06770503B1

    公开(公告)日：2004-08-03

    申请号：US09422682

    申请日：1999-10-21

    申请人： Thomas F. Marinis ,  Jerome B. Sohn ,  Richard P. Tumminelli

    发明人： Thomas F. Marinis ,  Jerome B. Sohn ,  Richard P. Tumminelli

    IPC分类号： H01L2100

    CPC分类号： B81B7/0077 ,  G01P1/02 ,  G01P15/0802

    摘要： A micromechanical sensor is fabricated on a semiconductor wafer, and a control circuit is fabricated on another semiconductor wafer. A cavity is etched on the back side of the control circuit wafer, the cavity being formed such that the sensor on the other wafer fits within the cavity when the wafers are brought together in an adjoining relationship. Through-holes are etched through the back side of the control circuit wafer to allow access to electrical contact points, and a patterned layer of metal is deposited to form electrical interconnections between the electrical contact points and termination points on the back side of the wafer via the through-holes. The termination points are arranged such that electrical contacts of the sensor contact the termination points when the wafers are placed in the adjoining relationship. The wafers are then cleaned and bonded together in the adjoining relationship. In a typical process the wafers contain multiple sensors and control circuits, respectively, and thus the bonded wafers are diced to yield individual bonded sensor-circuit pairs. The bonded pairs are then packaged in an integrated-circuit package such as a leadless chip carrier in a known manner.

    摘要翻译： 在半导体晶片上制造微机械传感器，并且在另一个半导体晶片上制造控制电路。 在控制电路晶片的背面上蚀刻空腔，形成空腔，使得当晶片以相邻的关系将晶片合在一起时，另一晶片上的传感器安装在空腔内。 通过控制电路晶片的背侧蚀刻通孔以允许接触电接触点，并且沉积图案化的金属层以在电接触点和晶片背面上的端接点之间形成电互连 通孔。 终端点被布置成使得当晶片以相邻关系放置时，传感器的电触点与端接点接触。 然后将晶片清洁并以相邻的关系粘合在一起。 在典型的工艺中，晶片分别包含多个传感器和控制电路，因此将结合的晶片切割成单独的结合的传感器电路对。 然后以已知的方式将键合对封装在诸如无引线芯片载体的集成电路封装中。

    Method of forming an optical channel waveguide by thermal diffusion
    2.
    发明授权
    Method of forming an optical channel waveguide by thermal diffusion 失效
    通过热扩散形成光通道波导的方法

    公开(公告)号：US5194079A

    公开(公告)日：1993-03-16

    申请号：US830932

    申请日：1992-02-04

    申请人： Richard P. Tumminelli ,  Farhad Hakimi ,  John R. Haavisto

    发明人： Richard P. Tumminelli ,  Farhad Hakimi ,  John R. Haavisto

    IPC分类号： C03C17/23 ,  C03C17/36 ,  C03C23/00 ,  G02B6/12 ,  G02B6/13

    CPC分类号： C03C17/3607 ,  C03C17/23 ,  C03C17/36 ,  C03C17/3642 ,  C03C17/3657 ,  C03C23/0025 ,  C03C23/007 ,  G02B6/13 ,  C03C2217/213 ,  C03C2217/24 ,  C03C2217/734 ,  C03C2218/32 ,  G02B2006/12171

    摘要： A method of forming an optical channel waveguide includes forming on a substrate a waveguide layer of silica doped with an index of refraction raising dopant whose concentration profile in a first dimension includes a higher concentration region and an adjacent lower concentration region; and heating the waveguide layer along two spaced areas defined in the second and third dimension which define a path between them for diffusing the dopant along the first dimension from the higher concentration region to the lower concentration region to reduce the index of refraction of the higher concentration region in portions of the higher concentration region proximate the spaced areas and create a waveguide along the path.

    摘要翻译： 一种形成光通道波导的方法包括在衬底上形成掺杂有折射率增加掺杂剂的掺杂剂的掺杂剂的掺杂剂的掺杂剂的掺杂剂，其中第一维度的浓度分布包括较高的浓度区域和相邻的较低浓度区域; 并且沿着限定在第二和第三维度上的两个间隔的区域加热波导层，其限定它们之间的路径，用于沿着第一维度将掺杂剂从较高浓度区域扩散到较低浓度区域，以降低较高浓度的折射率 区域在较高浓度区域的靠近间隔区域的部分中，并沿着路径产生波导。

    Fiber laser and method of making same
    3.
    发明授权
    Fiber laser and method of making same 失效
    光纤激光器及其制作方法

    公开(公告)号：US5166940A

    公开(公告)日：1992-11-24

    申请号：US710766

    申请日：1991-06-04

    申请人： Richard P. Tumminelli ,  Farhad Hakimi ,  Robert P. Dahlgren

    发明人： Richard P. Tumminelli ,  Farhad Hakimi ,  Robert P. Dahlgren

    IPC分类号： H01S3/067

    CPC分类号： H01S3/0675

    摘要： A fiber optic laser includes a fiber optic element, and a Bragg grating means in the fiber optic element and defined by a periodic variation in the index of refraction of the element to enhance the narrow band response of the laser and/or increase the loss of unwanted frequencies. A method of making the fiber laser is also disclosed.

    摘要翻译： 光纤激光器包括光纤元件和光纤元件中的布拉格光栅装置，并且由元件的折射率的周期性变化定义，以增强激光器的窄带响应和/或增加损耗 不想要的频率。 还公开了制造光纤激光器的方法。

    METHOD AND APPARATUS RELATED TO A SIDE-FIRE MEMBER HAVING A DOPED SILICA COMPONENT
    8.
    发明申请
    METHOD AND APPARATUS RELATED TO A SIDE-FIRE MEMBER HAVING A DOPED SILICA COMPONENT 有权
    与具有二氧化硅组分的侧面成员有关的方法和装置

    公开(公告)号：US20110176770A1

    公开(公告)日：2011-07-21

    申请号：US12948138

    申请日：2010-11-17

    申请人： Jeffrey W. Zerfas ,  Richard P. Tumminelli

    发明人： Jeffrey W. Zerfas ,  Richard P. Tumminelli

    IPC分类号： G02B6/26

    CPC分类号： G02B6/262 ,  A61B1/0011 ,  A61B1/00137 ,  A61B1/0017 ,  A61B18/22 ,  A61B2018/2222 ,  A61B2018/2255 ,  A61B2018/2272 ,  A61B2018/2288 ,  C03B37/10 ,  G02B6/325 ,  G02B6/327 ,  G02B23/26

    摘要： In one embodiment, an apparatus may include an optical fiber that may have a surface non-normal to a longitudinal axis of a distal end portion of the optical fiber. The surface may define a portion of an interface configured to redirect electromagnetic radiation propagated from within the optical fiber and incident on the interface to a direction offset from the longitudinal axis. The apparatus may also include a doped silica cap that may be fused to the optical fiber such that the surface of the optical fiber may be disposed within a cavity defined by the doped silica cap.

    摘要翻译： 在一个实施例中，装置可以包括可以具有与光纤的远端部分的纵向轴线不平行的表面的光纤。 该表面可以限定接口的一部分，其被配置为重定向从光纤内传播的电磁辐射，并且入射到界面上至与纵向轴线偏移的方向。 该装置还可以包括可以与光纤熔合的掺杂二氧化硅帽，使得光纤的表面可以设置在由掺杂的二氧化硅帽限定的空腔内。