公开(公告)号：US08988882B2

公开(公告)日：2015-03-24

申请号：US13259563

申请日：2010-03-24

申请人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

发明人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

IPC分类号： H05K7/20 ,  H01L23/498 ,  H01L23/367 ,  H01L23/433 ,  H05K1/00 ,  H01L21/48

CPC分类号： H01L23/49816 ,  H01L21/4867 ,  H01L23/367 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2924/15321 ,  Y10T29/4913

摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

摘要翻译： 电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。 通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。 通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。 在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部 后表面上的连接电极连接到布线图案。

公开(公告)号：US20120127667A1

公开(公告)日：2012-05-24

申请号：US13259563

申请日：2010-03-24

申请人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

发明人： Kenji Ohsawa ,  Rinkou Fukunaga ,  Katsuya Tsuruta ,  Kei Mizuta ,  Masamichi Ishihara

IPC分类号： H05K7/20 ,  H05K3/32

CPC分类号： H01L23/49816 ,  H01L21/4867 ,  H01L23/367 ,  H01L23/4334 ,  H01L2224/16225 ,  H01L2924/15321 ,  Y10T29/4913

摘要： A circuit element is arranged on an organic substrate and connected to a wiring pattern arranged on the organic substrate. An internal connection electrode is formed on a conductive support body by electroforming so as to obtain a unitary block of the internal connection electrode and the support body. Each end of each of the internal connection electrodes connected into a unitary block by the support body is connected to the wiring pattern. After the circuit element is sealed by resin, the support body is peeled off, so as to obtain individual internal connection electrodes separately and the other end of each of the internal connection electrodes is used as an external connection electrode on the front surface while the external connection electrode on the rear surface is connected to the wiring pattern.

摘要翻译： 电路元件设置在有机基板上并连接到布置在有机基板上的布线图案。 通过电铸在导电性支撑体上形成内部连接电极，以获得内部连接电极和支撑体的整体块。 通过支撑体连接到整体块的每个内部连接电极的每个端部连接到布线图案。 在电路元件被树脂密封之后，剥离支撑体，以分别获得单独的内部连接电极，并且将每个内部连接电极的另一端用作前表面上的外部连接电极，而外部 后表面上的连接电极连接到布线图案。

公开(公告)号：US20130126139A1

公开(公告)日：2013-05-23

申请号：US13641580

申请日：2011-04-18

申请人： Katsuya Tsuruta ,  Kenji Ohsawa ,  Rinkou Fukunaga

发明人： Katsuya Tsuruta ,  Kenji Ohsawa ,  Rinkou Fukunaga

IPC分类号： F28F3/12

CPC分类号： F28F3/12 ,  F28D15/0233 ,  F28F3/00 ,  H01L23/427 ,  H01L2924/0002 ,  H01L2924/00

摘要： The heat transporting unit according to the Present Disclosure comprises: an upper plate; a lower plate that faces the upper plate; an interior space that is formed by the upper plate and the lower plate and wherein a refrigerant can be sealed; a first region, that is a region that is part of the interior space and that is provided with a first column portion that forms a plurality of first ducts that extend in the X-axis direction; and a second region that is provided with a second column portion that forms a plurality of second ducts that extend in the X-axis direction and the Y-axis direction, that is a region that is other than the first region within the interior space; wherein: the first ducts and second ducts connect at a boundary between the first region and the second region.

摘要翻译： 根据本发明的传热单元包括：上板; 面向上板的下板; 由上板和下板形成的内部空间，其中可以密封制冷剂; 第一区域，其是作为内部空间的一部分并且设置有形成沿X轴方向延伸的多个第一管道的第一柱部分的区域; 以及第二区域，其设置有第二列部分，所述第二列部分形成在所述内部空间中的除了所述第一区域之外的区域中沿X轴方向和Y轴方向延伸的多个第二管道; 其中：第一管道和第二管道在第一区域和第二区域之间的边界处连接。

公开(公告)号：US20110308772A1

公开(公告)日：2011-12-22

申请号：US13062561

申请日：2009-09-08

申请人： Katsuya Tsuruta ,  Rinkou Fukunaga ,  Toshiaki Kotani ,  Kei Mizuta

发明人： Katsuya Tsuruta ,  Rinkou Fukunaga ,  Toshiaki Kotani ,  Kei Mizuta

IPC分类号： F28D15/04

CPC分类号： H01L23/427 ,  F28D15/0233 ,  F28D15/046 ,  H01L2924/0002 ,  H01L2924/00

摘要： The Present Invention provides a heat pipe and an electronic device which can efficiently cool a light emitting element arranged in an end portion, so that it is possible to efficiently mount the heat pipe in a narrow space. The heat pipe is provided with an upper plate (3), a lower plate (4) opposing the upper plate (3), one intermediate plate or a plurality of intermediate plates (5) laminated between the upper plate (3) and the lower plate (4), a main body portion (2) formed by lamination of the upper plate (3), the lower plate (4) and the intermediate plate (5) and capable of sealing a cooling medium, a vapor diffusion path (6) capable of diffusing a vaporized cooling medium, and a capillary flow path (7) capable of reflowing a condensed cooling medium, and the vapor diffusion path (6) is formed from a first end portion (15) of the main body portion toward a second end portion (16) opposing the first end portion (15).

摘要翻译： 本发明提供一种热管和电子装置，其能够有效地冷却配置在端部的发光元件，从而能够将热管有效地安装在狭窄的空间内。 热管设有上板（3），与上板（3）相对的下板（4），一个中间板或多个中间板（5），层压在上板（3）和下板 板（4），通过层叠上板（3），下板（4）和中间板（5）而形成并能够密封冷却介质，蒸气扩散路径（6）的主体部分（2） ）和能够回流冷凝介质的毛细管流路（7），蒸气扩散路径（6）由主体部的第一端部（15）朝向 与第一端部（15）相对的第二端部（16）。